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ANSYS Professional software offers a first step into advanced linear dynamics and the nonlinear capabilities of ANSYS structural mechanics. ANSYS Professional comes in two versions: ANSYS Professional NLT with linear structural and dynamics capability and nonlinear thermal capability, and ANSYS Professional NLS with linear structural dynamics and thermal capability as well as a basic structural nonlinear capability.
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Pro/ENGINEER Mechanica
Gain product insight
Costly and laborious prototyping hinders a design team, resulting in compromised schedules and budgets. However, with Pro/ENGINEER Mechanica, designer engineers can better understand product performance, and accommodate the digital design accordingly -- all without needing a specialist’s FEA-background. The result: engineering gains early product insight, improves verification and validation processes, and delivers higher quality products at lower cost.
Benefits
- Conduct standard analysis types, including linear static, modal, buckling, contact and steady state thermal
- Obtain real-world performance data by directly applying conditions to design geometry without requiring data translation
- Fast, automatic solution convergence, mapped precisely to underlying CAD geometry; 3rd party solver output
- Increase innovation by simultaneously designing and simulating results of design variations
- Decreases development costs through reduction or even elimination of physical prototyping and productive, engineering-friendly user interface
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SAMCEF Field is a fully integrated CAE environment for linear and non-linear structural and thermo-mechanical analyses, for multibody simulation based on FE methods and for multiphysics problems.
SAMCEF Field allows you to design your systems with a simple click, using pop-up menus, icon bars, shortcuts or keyboard commands. Design, modeling, analysis and results post-processing operations are driven in a fully contextual and single environment.
Indeed, in addition to its interfaces with CAD, its local modeler and its powerful meshers, SAMCEF Field supports:
- linear analysis (static, modal, buckling);
- stationary thermal analysis;
- non-linear structural analysis;
- multi-body simulation;
- composite materials analysis in both linear and non linear conditions.
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"Highly recommended" by Cadalyst Magazine, thinkdesign® streamlines product development for small to mid-sized manufacturers (SMMs). Unlike other MCAD products, thinkdesign has been designed from the ground up. Working closely with our customers we've developed%u2014in a single package%u2014the efficiency of 2D AND the power and precision of 3D. With think3 technology users can easily switch to 3D, without losing even one hour of work! Compare our features and benefits. thinkdesign capabilities include:
2D/3D transparency in a single design environment. Unsurpassed interoperability between the two eliminates costly interfaces
thinkPLM foundation. Seamless integration with thinkPLM, our scalable, ready-to-use PLM solution
Advanced AutoCAD compatibility. Users can import 2D AutoCAD drawings into thinkdesign, modify and reuse those drawings as if they were native
Robust part modeling, advanced design tools and UI. Users can design any conceivable part in a single, easy-to-use design environment. Drawings can be created automatically from 3D models
Design flexibility for manufacturable sheet metal parts. Sheet Metal parts can be created from scratch or from existing parts, including IGES and STEP
Smart objects. Store engineering knowledge into the system, for faster adoption and higher quality in 3D modeling
Advanced large assembly capabilities. Users quickly navigate with Light Representations of components and Visual Bookmarks; Symbolic References enable any replacement of components, preserving assembly integrity
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SIMULIA Extended Analysis extends the CATIA V5 Analysis capabilities. Designers looking to quickly evaluate real world performance and deliver the right design, the first time, now can enhance their product simulation methods to include basic nonlinear and thermal analysis.
The existing CATIA Analysis products are ideal for designers who want to evaluate their designs, but are limited to the linear structural response of parts and assemblies. Many products are subject to both thermal and structural loads, or are made of materials like rubber that are inherently nonlinear. Designers may also want to study the effect of overload conditions when the product might suffer permanent deformation.
SIMULIA Extended Analysis addresses this need with the introduction of two analysis products, Nonlinear Structural Analysis (ANL) and Thermal Analysis (ATH). These products are intended for designers looking to accurately size designs and quickly evaluate real world performance
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CALISTO is a NEW software developed for Thermal Analysis applications from DSC, TGA, TMA and Calorimetry.
CALISTO comprises two independent parts:
- CALISTO ACQUISITION for the control of SETARAM Thermal Analysis Systems
- CALISTO PROCESSING for the treatment of ANY Thermal Analysis Data independent of instrument type or manufacturer.
CALISTO ACQUISITION
- Program acquisition procedures (all experimental conditions and parameters)
- Control one or more Setaram systems via a PC
- Save experiment signals and monitor their progress in real time
- Change experimental conditions during an experiment
- Trigger acquisition of other equipment (mass spectrometers, FTIR)
CALISTO ACQUISITION software is available for the exciting NEW range of EVO products and is also compatible with existing SETARAM products.
CALISTO ACQUISITION provides a unique combination of ease-of-use and intuitive operation as well as powerful control of your Setaram systems.
CALISTO PROCESSING
- Imports files saved in CALISTO Acquisition
- Imports signal files from other equipment (mass spectrometers, FTIR)
- Treats recorded signals
CALISTO PROCESSING offers the most powerfull tools available for Baseline Selection / Substraction, Peak deconvolution / Separation, Data Presentation, Data Export , Cp (Heat Capacity) determination.
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ANSYS Airpak is a CAE tool for engineers to quickly and accurately model airflow, contaminants, and thermal comfort. Its fast learning curve enables users to begin comfortably using the software in only one day because ANSYS Airpak streamlines the application of the leading computational fluid dynamics (CFD) software, ANSYS Fluent, to ventilation problems. It provides information on flow characteristics such as mixing, ventilation effectiveness, temperature distribution, contaminant distribution, and thermal comfort.
Use it to easily build a computer model of an application and quickly test a variety of design options to find the best solution. Eliminate the guesswork in designing ventilation systems for non-standard and one-of-a-kind facilities. Reduce the risk for new designs and/or improve the efficiency of current designs. Animations and visualizations from ANSYS Airpak results also help the engineer to more effectively market and sell their designs and capabilities.
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Problems involving any combination of conduction, convection,
and radiation are solved easily with the Heat Transfer Module.
It finds extensive use in systems that involve the
generation and flow of heat in any form.
A variety of specialized modeling interfaces
are available for different formulations
and applications such as
surface-to-surface radiation,
nonisothermal flow, heat transfer
in structures made of thin layers
and shells, and heat transfer in
biological tissue.
The Heat Transfer Module allows for arbitrary couplings to other application modes in COMSOL Multiphysics and its modules for multiphysics modeling. This is particularly relevant to applications such as thermal management in the electronics industry, thermal processing and manufacturing, and medical technology and bioengineering.
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SAMCEF Thermal is a general non-linear thermal analysis program for both steady state and transient analysis, taking into account conduction, convection and radiation. Because SAMCEF Thermal shares its infrastructure with SAMCEF Mecano, both thermo-mechanical chaining as well as the inclusion of, for example, numerical controllers is straightforward.
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Analysing infrared images and reporting results of infrared inspections to clients and/or colleagues are important tasks for any professional thermographer. To facilitate and quicken these vital everyday jobs FLIR Systems has developed the new, Microsoft Word compatible, Reporter software.
Specifically designed for use with FLIR Systems infrared cameras, ThermaCAM Reporter is a powerful yet easy-to-use tool to generate comprehensive and professional infrared inspection reports.
Features And Benefits
Fast, one-step report generation
Powerful temperature analysis
Automatic insertion of voice and text fields from camera
Automatic association of IR and visual images
Voice comments playback
Wizard-guided report generation
Customized report layout
Multi-lingual
Database option for organizing IR report data
Freeware included for viewing reports and images
Choice of configurations: Basic or Professional
Compatible with Windows 95, 98, NT, 2000 and XP
Compatible with a wide variety of IR image formats
Network friendly
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ANSYS offers a range of products with the depth and breadth of capabilities to meet current requirements as well as a seamless upgrade path for future simulation needs.
ANSYS Multiphysics software offers a comprehensive product solution for both multiphysics and single-physics analysis. The product includes structural, thermal, fluid and both high- and low-frequency electromagnetic analysis. The product also includes solutions for both direct and sequentially coupled physics problems including direct coupled-field elements and the ANSYS multi-field solver.
ANSYS Mechanical/Emag software offers a comprehensive solution for structural, thermal and low-frequency electromagnetic analysis. The product also includes solutions for both direct and sequentially coupled physics problems including direct coupled-field elements and the ANSYS multi-field solver for supported physics.
ANSYS Mechanical/CFD-Flo software offers a comprehensive solution for structural, thermal and fluid analysis. The product also includes solutions for both direct and sequentially coupled physics problems including direct coupled-field elements and the ANSYS multi-field solver for supported physics.
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Portunus is a system simulator that has been developed especially for the calculation of mechatronic systems. Possible applications range from the simulation of drive systems and switched mode power supplies to investigation of the heating of electronic components.
Several description approaches (network, block diagram, state machine) are available for the simulation of electrical, mechanical and thermal systems. With Portunus you may run different analysis types (simulations in the time and frequency domain, calculation of steady-state and operating point). The effect of parameter variations may be calculated and displayed automatically. Alternatively, it can be visualized using the interactive capabilities of the software.
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Designers are creating PC boards that are higher density, higher power and smaller than ever before. Do you have the thermal analysis tools necessary to keep up with these advances?
ANSYS Iceboard directly imports all the data from your ECAD tool including component data, traces, power and ground planes and vias to automatically create a three-dimensional board model. Put this together with a complete component database and CFD analysis of the air and you get unprecedented accuracy and speed. ANSYS Iceboard models can be exported to TAS , ANSYS, NASTRAN, FEMAP and SINDA.
Automatically imports the native ECAD database
Accurate board representation including traces, vias, pads, and the true board shape
3D multi-layer board modeling
Automatic meshing of the board and air
Single or double sided boards
JEDEC based 3D geometry data
Compatible with new JEDEC CTM standard
ANSYS Iceboard provides all the advanced thermal capabilities you need to:
Identify and solve thermal problems early in design %u2013 when failures are least costly to fix
Improve the overall thermal management of your PCBs for better reliability
Slash development time without risks of over-design or failure in the field
Increase overall product reliability and speed-up your time-to-market
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For more than a decade, leading companies around the world have relied on ANSYS Icepak to provide robust and powerful computational fluid dynamics (CFD) software for electronics thermal management. Based on the state-of-the-art ANSYS FLUENT CFD solver, ANSYS Icepak software has a streamlined user interface that speaks the language of electronics design engineers, enabling the rapid creation of models of complex electronic assemblies. The software automatically generates highly accurate, conformal meshes that represent the true shape of electronic components, and simulations include fluid flow and all modes of heat transfer - conduction, convection and radiation - for both steady-state and transient thermal-flow simulations. By predicting fluid flow and heat transfer at the component, board or system level, ANSYS Icepak improves design performance, reduces the need for physical prototypes and shortens time-to-market in the highly competitive electronics industry.
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CELSIUS Features:
- Easily assign boundary conditions such as temperature, heat flux, temperature gradient, convective and radiative heat exchange
- Assign heat sources in the form of volume heat and surface heat
- Material table stores thermal conductivity, specific heat, mass density or absorption and scattering coefficients
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Dynamic Simulation of Valvetrain
The cam lobe profiles are pre-specified to meet the performance and durability development targets. The dynamic behaviour of the valve train is verified using sophisticated analysis methods and tools available in the AVL TYCON software package. The valve train is optimised for low weight, friction and wear, yet meeting the durability target and considering the production capability and material properties.
The entire valve train including the camshaft drive (chain,belt or gears) is optimised to avoid excessive vibrations and dynamic forces in the system, which lead to premature failure and excessive noise. The analysis is validated by advanced measurement techniques capturing the dynamics of valve train components supports.
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M-JVIS Designer
* Fully graphical visualization software for HMI-applications (operate/observe)
* Complete configuration tool with graphical user interface (Eclipse)
* Platform independent thanks to Java technology
* Online language selection
* Recipes/data set management
M-JVIS, M-JSYS Java Visualization
* Tool library for Java Visualization
* Administration of process variables and their values
* Administration language / language switching
* Alarm handling
* Quality table
* Communication to PLC (RPC, FTP, Vis)
* Basis of M1 software modules
* Communication monitoring
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Calculation, Simulation, Modeling software
