Machines for electronics production

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band conveyor / for printed circuits - Genius

The e³ GENIUS is a state of the art board handling solution which can be utilized in any PCB production line. The...

band conveyor / for printed circuits - Smart

The e³ SMART lineup of plug and play board units are cost efficient and feature seamless magazine loading/unloading and speedy width adjustment....

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flexible assembly machine - max. 2000 mm | SmartCell

The Smart Cell Comau is a parallel assembly hub that is perfectly suited for low to moderate volume automated assembly of parts that need stringent tolerances. Its value propositions include dependability that is proved in manufacturing and parallel process vs....

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SMT pick-and-place machine - Σ-G5

The Sigma-G5, which is manufactured by Hitachi, is SMT equipment that has been developed...

SMT pick-and-place machine / ultra highspeed - Σ-F8

Introducing the Sigma-G5 which is another machine of SMT equipment. This unit suggest an excellent...

fully-automatic die bonder - DB-800HS

The DB-800HS Die Bonder manufactured by Hitachi, offers high-speed Sip Assembling to semiconductor applications. Its framework comprises...

full automatic assembly system for LCD - AL/AB7000 Series

The Hitachi High-Tech AL/AB7000Series Module Assembly System is designed for 57, 47,...

full automatic assembly system for LCD - AK/AL/AB6000 Series

Hitachi has developed the AK/AL/AB6000 series built as a complete automatic assembly...

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screen printing machine for the electronic industry - SPG

Panasonic's SPG high-speed screen printing machine provides eco-friendly solutions for lean SMT manufacturing. It provides the ideal amount of solder in the correct...

screen printing machine for the electronic industry - SP70

Panasonic's SP70 screen printer is engineered for both high and low volume manufacturers who has a high...

two-storey screen printing machine / for the electronics industry - SPD

The screen printer dual (SPD) offers fast and successive production of two boards of the same type or two differing products. Its non-stop changeover features deliver...

electronics placer - max. 25 000 cph/m² | NPM-D2

The Panasonic NPM-D2 Dual Lane Assembly delivers a seamless and efficient electronics assembly production process, all via a singular-platform. It features a switchable, plug-and-play...

electronics placer - 70 000 cph | NPM-W

The NPM-W (Next Production Modular - Wide) is part of Panasonic's award-winning NPM platform for expanding and evolving electronics assembly needs.

Processing large board sizes up to 750 x 550mm (29.5 x 21.6") and placing large...

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electronics placer - 70 000 cph | NPM-W

Miyachi Unitek provides a selection of in-line laser welding, marking, engraving, cutting, and bonding systems...

lid placing and sealing machine for electronics production - AF8500

The AF8500 series of Lid Placement, Tack and Seam Sealing Systems from MIYACHI are used for hermetic sealing applications, and may be modified to be a stand-alone or a fully...

precision sealer -  SM8500

A complete machine on it's own, TCT5510-6G's advanced technology provides high safety and reliability for the user. It is equipped with its own safety devices and compartment...

hot-bar reflow soldering machine / manual - Newhorizon

The Hot-Bar Reflow Soldering & Heat Staking Systems from MIYACHI offers the services of standard...

hot-bar reflow soldering machine / manual - DT series

The DT Series Desktop Hot-Bar Bonding Systems are ideal for heat staking and hot bar reflow...

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hot-bar reflow soldering machine / manual - DT series

Nordson EFD PICO valve dispensing systems incorporates high production speed with high...

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fully-automatic die bonder - Esec 2009 SSIE

The Esec Die Bonder is a newly engineered die attach. It has a new point to line, pick and place...

wafers cutting machine - Fico Compact Line - X

The X (FCL-X) is the new Compact Line by Fico, often regarded as the latest development when it comes to trimming and forming, being able to process leadframes of the highest...

flip-chip die bonder - max. 350 °C | 2200 evo

The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications...

die bonder - 2200 evoplus

Combining integrated dispenser and vision alignment with automatic tool and wafer changer...

epoxy die bonder - Esec 2100 xP

The Esec 2100 xP, assembled by Besi, is a well tested die bonding device that is capable of operating at full range of epoxy die mounting applications....

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insertion machine - CRD series

Simultaneous multiple-pin insertion will definitely increase productivity and this should be applied whenever possible. This machine, based on SPIROLs standard Model CR design is a very strong and stable dual vertical pin insertion...

insertion machine - CR series

The model CR is a robust, vertical pin-insertion machine that's ideally suited for moderate to high production for applications requiring up to 1,800lbs of installation force. Precision...

insertion machine - DP series

SPIROL Model DP is a self contained vertical drilling and pinning machine. It has been developed for mid-to-high volume production systems that demand precise assembly drilling and pinning. The use of a single system for both drilling and pinning removes the need for close tolerance...

insertion machine - HC series

This device is just easy to handle for it is not heavy and mobile. The unit is a horizontal pin inserter made to affix certain...

manual insertion machine - HM series

The HM Series, which is manufactured by Spirol, is an installation system that is typicallly designed...

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jet dispensing system - PICO®

The PICO dispensing system by Nordson EFD combines superior process control and accuracy with high production speeds, being suitable for various applications in the industry, available in three...

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tunnel furnace / reflow soldering - Ersa HOTFLOW 4/26

Ersa HOTFLOW 4/26 High-end reflow soldering system with outstanding thermal performance and best energy balance

The new HOTFLOW 4 series of systems has been augmented by the Ersa...

tunnel furnace / reflow soldering - 6 m | HOTFLOW 3/20e

The HOTFLOW 3/20e is the newest reflow system in the Ersa HOTFLOW family, and it delivers exceptional soldering results on account of its superior thermal performance, its low transverse profile and its excellent zone separation. The e attached to its signature stands for efficiency. For...

reflow soldering furnace / forced convection / 2-channel - 4 m | HOTFLOW 3/14

Since their introduction into the market nearly 30 years ago, Ersa reflow ovens have been setting the industry standard for high-end reflow machines. The new HOTFLOW is the third generation machine based on the proven & proprietary Ersa Multijet heating technology....

wave soldering machine / with nitrogen - POWERFLOW N2

ERSA‘s new full nitrogen tunnel wave solder machine, the POWERFLOW N2 was specifically designed to meet the challenges of lead free! As ERSA's flagship machine, the POWERFLOW N2 can reduce lead free wave solder running costs by as much as 90%! The machine highlights a 16" board width, plug and...

reflow soldering furnace - Ersa HOTFLOW 4/8

The HOTFLOW 4/8 is the shortest reflow system in the new HOTFLOW 4 series. This system, with a process length of 3,25 meters split into 8 heating zones and...

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reflow soldering furnace - Ersa HOTFLOW 4/8

Both circular and rectangular focuses are possible with the use of this product, whose typical applications include...

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SMT pick-and-place machine / automatic - 64 983 - 102 000 cph | SIPLACE X series

The X-series of Placement Systems from SIPLACE is the standard for applications that require optimum speed and precision. It offers maximum productivity...

SMT pick-and-place machine / automatic - 24 000 - 102 000 cph | SIPLACE SX series

The SIPLACE SX series which is manufactured by ASM is a placement solution for high-mix SMT that has been developed to provide...

SMT pick-and-place machine / automatic - 13 000 - 57 000 cph | SIPLACE Di series

The SIPLACE Di-Series is a placement system manufactured by ASM that employs original mechanisms such as the digital SIPLACE vision systems, the flexible SIPLACE dual-conveyor system and the...

SMT pick-and-place machine / automatic - 9 000 - 20 000 cph | SIPLACE CA series

As the world's first placement platform that incorporates bare-die from the wafer and classic SMT placement in a single machine and production process, the SIPLACE CA provides many benefits. This adds up to less special...

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SMT pick-and-place machine / automatic - 9 000 - 20 000 cph | SIPLACE CA series

Flying probe type testers: Product features (Models 1116, 1117, 1270, etc.)
The 1116 is a high-speed pattern tester that uses the capacitance testing method.
Compared...

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bubble engraving machine / for printed circuits - 235 x 330 mm | BB4.2

Vertical etching machine with heater BB4.2

New model with large working area of 235 x 330 mm
Thermostated heater - +36° to +45°C
Glass thermometer included
Frame in PVC with transparent acrylic tank
Perfect for first and second grade education and laboratories.
to be used with ammonium persulfate
PCB fixed by PVC support. Possibility to put...

bubble engraving machine / for printed circuits - 240 x 310 mm | DP3T

Vertical etching machine with 3 tanks DP3T

Etching machine with 3 tanks for DEVELOPMENT - RINSING - ETCHING
New model with large working area of 240 x 310 mm
Thermostated heater - +36° to +45°C for the etching bath
Frame in PVC with transparent acrylic tanks
Perfect for first and second grade education and laboratories.
to be used with ammonium persulfate
...

spray  engraving machine / vertical / double-sided PCB - AUTOJET II

Spray etching machine with rinsing, AUTOJET II

Double sided model with rinsing and thermostated...

spray  engraving machine / vertical / double-sided PCB - 200 x 300 mm | GIROJET R4

Double sided model with rinsing and thermostated...

spray  engraving machine / horizontal / conveyor / double-sided PCB - 200 mm | METEOR 220

Double sided etching with rinsing stage
• Transport by conveyor
• Working...

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spray  engraving machine / horizontal / conveyor / double-sided PCB - 200 mm | METEOR 220

Fusions new pistol grip gun attachment is compatible with FE-71 applicator...

spray  engraving machine / horizontal / conveyor / double-sided PCB - 200 mm | METEOR 220

Satellite Paste Applicators are designed to complement an existing heat source, such...

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solar wafer measurement module - PV-1000

Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple...

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solar wafer measurement module - PV-1000

Molybdenum coatings are the crucial components of the thin-film transistors used in...

solar wafer measurement module - PV-1000

Aluminum possesses very high electrical conductivity....

solar wafer measurement module - PV-1000

Our aluminum-chromium (AlCr) targets and cathodes further...

solar wafer measurement module - PV-1000

The hard material coatings chromium (Cr) and chromium nitride (CrN) optimally protect engine components such as piston rings and bucket tappets...

solar wafer measurement module - PV-1000

Many CIGS manufacturers use copper-gallium (CuGa) or copper-indium-gallium (CuInGa) sputtering targets for the deposition of the absorber layer....

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laser cutting machine / die board - 200 - 2 000 W | SENIOR F/R

he bidimensional laser cutting machine mod. SENIOR F/R is a fixed table system and chuck equipped with laser souces from 200W to 2000W.The overall dimensions are constricted, allowing an easy access for the loading and unloading processses.The machine is planned to seat Fanuc or Rofin Sinar laser sources...

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wafer cutting machine - ±4μm | QAC&BACL, LDC

This machine LDC-5142 has international competitive edge. It adopt 1064nm in-fared laser as cutting tool which has superior cutting quality. This machine owns advantages of fast speed, easier operation, low maintenance cost etc.....

UV laser cutting machine / wafer - 355 Nm | UV/QAC&BACL

This machine is independent researched and developed by HGLaser, which has international competitive edge. It adopt high-quality UV as cutting source, the cutting quality and cutting efficiency of chip are much better than traditional cutting equipment. UV laser cool source hs small thermal affected zone and superior cutting...

UV laser cutting machine / wafer - 355 nm | LED UV/QAC&BACL

This LED UV laser dicing machine adopt superior UV laser source and high-precision worktable. It has the features of high positioning precision, small focusing spot, CCD coaxial monitoring cutting, which meet the requirements of cutting craft for LED sapphires substrate epitaxial...

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X-ray inspection machine for cables - RAYEX®

The RAYEX® is a x-ray inspection machine developed by Zumbach Electronic. It is mainly used for connectors and highly developed based on x-ray tomography. The unit measures the wall thickness, eccentricity, diameter, and...

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