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How to conserve power when playing back video content is a significant issue when designing mobile media devices. A common solution is to lower the backlight level of the LCD as it consumes 30% to 60% of the total system power. This solution significantly diminishes the viewing experience with details lost due to the lowered contrast ratio. QuickLogic’s proprietary VEE Proven System Block (PSB) enhances both image and video quality by optimizing the dynamic range, contrast, and color saturation pixel-by-pixel to provide a natural viewing experience under low backlight or bright ambient light conditions. Seamlessly integrated into the display path, VEE enhances the user’s mobile multimedia visual experience while drastically reducing backlight power to extend battery life.
All members of the ArcticLink II family of solution platform family embeds the recently announced 2nd Generation VEE technology, combined with programmable fabric. QuickLogic and Apical Limited partnered to architect and develop the optimal blend of algorithms with QuickLogic’s PSBs and patented ViaLink programmable fabric for mobile and portable multimedia products.
The core of the VEE technology is based on the proven iridix® algorithms licensed from Apical Limited, which is substantiated by nearly a decade of scientific research. These algorithms implement a model of human perception; resulting in a displayed image that retains detail, color and vitality even under variable viewing conditions. It specifically addresses the problem of the low contrast ratio of mobile Liquid Crystal Displays (LCD) to bring a more TV-like viewing experience to the mobile devices.
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ArcticLink is a programmable solution platform designed specifically to meet the unique connectivity requirements of handheld devices.
With the explosion of new handheld applications and devices, customers are demanding multiple functions to be performed at optimal levels by a single device. As a result, designers of handheld products such as Smartphones, Personal Media Players and Portable Navigation Devices are faced with the challenge of integrating enhanced wireless connectivity and digital storage features, among others.
ArcticLink addresses these issues in two ways: first by providing hardwired building blocks such as Hi-Speed USB 2.0 On-The-Go (OTG), SD, SDIO, MMC and CE-ATA, and secondly with an embedded, ultra-low power array of Customizable Building Blocks (CBBs) for additional connectivity and custom functions.
The flexible programmable fabric up to 20 CBBs combined with the hardwired building blocks provides a compact, single-chip solution that reduces BOM costs, saves board space, eases system-level design trade-offs and increases the end product’s time-to-market.
ArcticLink Solution Platform has two small package options; 8x8mm package for space constrained application and 12x12mm package for high pin count applications. Wafer level CSP is also available.
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The award winning PolarPro families of programmable platforms, including PolarPro and PolarPro II, were purposely architected to meet the interconnect and system logic requirements of power sensitive and portable applications. It is based on QuickLogic patented ViaLink® technology to offer programmability with ASIC-like power consumption. The PolarPro family offers a spectrum of platforms with ranging from 8 to 240 Customizable Building Blocks (CBBs), embedded SRAM and advanced clock management. Very Low Power (VLP) mode puts the entire device in sleep mode, drawing as low as 2.2µA, while maintaining I/O status and internal register values.
The PolarPro has won multiple industry awards. Packages as small as 5x5mm BGA package are designed specifically for mobile applications.
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VEE-enabled Platform Optimized For Qualcomm Mobile Processors
The ArcticLink II VX4C solution platform integrates two main Proven System Blocks (2nd generation VEE and MDDI v1.2 Type 2 Client with PHY) coupled with CellularRAM Frame Buffer and Programmable Fabric. This highly integrated, yet flexible architecture makes it the ideal platform to implement Customer Specific Standard Product (CSSP) solutions in the display and connectivity subsystems of Smartphones, Netbooks, Mobile Internet Devices (MIDs), Mobile Computing Devices (MCDs) and Pocketable Computing Devices (PCDs) using Qualcomm’s latest Mobile Station Modem™ (MSM™) MSM7xxx-series and MSM8xxx-series mobile processors, including the recently announced Snapdragon family.
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System-on-chip technology is the ability to place multiple function "systems" on a single silicon chip, cutting development cycle while increasing product functionality, performance and quality. Even if the semiconductor industry achieved increasing levels of integration, the success of this double integration - processes and functions -- involves more capabilities than originally expected.
STMicroelectronics is a leader in system-on-chip technology thanks to an unrivalled combination of silicon and system expertise, manufacturing strength, wide IP portfolio and strategic partners.
The manufacturing strength of ST, technology and process know-how are combined to minimize time-to-volume. ST offers a complete solution that takes you from design right through to production. This solution integrates pre-characterised semicustom libraries, a wide package portfolio running from fine-pitch BGA as well as ultra-small leadless packages, a high performance BiCMOS process Silicon-Germanium HBT which marries the advantages of SiGe - speed, low noise and low power consumption - with state-of-the art CMOS in a high volume manufacturing structure.
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Melexis introduces a new versatile, fully integrated and programmable sensor interface solution for automotive and industrial applications. The MLX90320 provides amplification, calibration and temperature compensation for virtually all kinds of resistive bridge type sensors including pressure transducers, strain gauges and position sensors.
Melexis' Programmable Through Connector' concept for high-volume implementations, enables programming in the production environment post assembly.
An operating temperature range of -40°C to 150°C as well as various implemented clamping detection and fault/diagnosis modes, over-voltage and reverse polarity protection make the MLX90320 the perfect fit for automotive applications.
An Evaluation Board for this new MLX90320 chip is available.
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Physical effects of semiconductors are becoming more and more interrelated. Each design decision can create unintended consequences. In addition to the old problems generated by wire capacitance, engineers can no longer manually balance the myriad effects such as leakage current, inductive noise or IR drop. Manufacturing processes and environmental variation can render your functional chip useless or economically unviable. Market forces are creating demands of higher volumes at lower and lower price points. Investors are losing their appetite for risk and paying a premium for predictable success. Designers must walk a tightrope of price and performance to reach their time-to-market goals.
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General Description
The NC7SZ00 is a single 2-Input NAND Gate from Fairchild's Ultra High Speed Series of TinyLogic®. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65V to 5.5V VCC operating range. The inputs and output are high impedance when VCC is 0V. Inputs tolerate voltages up to 6V independent of VCC operating voltage.
Features :
- Space saving SOT23 or SC70 5-lead package
- Ultra small MicroPak™ leadless package
- Ultra High Speed; t PD 2.7ns Typ. into 50pF at 5V VCC
- High Output Drive; ±24mA at 3V VCC
- Broad VCC Operating Range; 1.65V to 5.5V
- Matches the performance of LCX when operated at 3.3V VCC
- Power down high impedance inputs/output
- Overvoltage tolerant inputs facilitate 5V to 3V translation
- Patented noise/EMI reduction circuitry implemented
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Single 2-Input NAND Gate
The NLU1G00 MiniGate is an advanced high−speed CMOS 2−input NAND gate in ultra−small footprint.
The NLU1G00 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage.
Features
- High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V
- Low Power Dissipation: ICC = 1 A (Max) at TA = 25°C
- Power Down Protection Provided on inputs
- Balanced Propagation Delays
- Overvoltage Tolerant (OVT) Input and Output Pins
- Ultra−Small Packages
- These are Pb−Free Devices
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TI is your source for Standard Logic ICs including Switches, Translation, I²C, Interface, Little Logic, Gates, Inverters, Flip-Flops, and FIFOs.
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Jennic's Serial RapidIO system-level IP product line provides a complete range of fully integrated Serial RapidIO interface solutions, intended for integration into SoC semiconductor devices. Serial RapidIO is a data communication standard provisioned for the interconnection of devices on the same circuit board or between circuit boards across a backplane. It has been developed as a more cost-effective, standards, switched based replacement for expensive proprietary busses in high-performance embedded systems, such as networking and communications equipment and enterprise storage.
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Logic gates, FPGAs, ASICs
