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The V83xx is Mixed-Mode Array's family with 7 different bases offering a customized cost-effective solution for low- to medium-volume applications. The flexibility in design options allows any degree of digital to analog partitioning on a single chip with up to 6800 gates, along with low power cristal oscillator.
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The industry standard ARM architecture is the most widely used 32-bit microprocessor architecture ever with billions of products shipped. Actel has partnered with ARM to make ARM processors available for our customers to use in Actel's Flash-based FPGAs. The processors are fully implemented in the FPGA fabric, and designers have full access to the cores, so they can add IP and implement them in their embedded applications. By offering the processors without license fees or royalties and without the need to negotiate contracts, Actel is dramatically increasing our customer's access to 32-bit ARM processors. FPGA users no longer have to settle for a proprietary 32-bit processor core. Instead, they can use an industry standard ARM processor with the well-known architecture and popular instruction set. With its FPGA optimized ARM processor offering, Actel is truly bringing ARM to the masses.
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Broadcom offers custom silicon design capability for applications where customers want to integrate their own intellectual property with Broadcom's proprietary intellectual property cores. We have successfully developed custom chips for LAN, WAN and PC applications. These chips are complex mixed-signal designs that leverage Broadcom's advanced design processes.
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Freescale Semiconductor offers Application Specific Integrated Circuits (ASIC) as well as highly integrated, customized System-on-Chip System (SoC) solutions for the printing and imaging, broadband, network, and storage markets. The Application Specific Products operation develops ASIC and SoC products built on a foundation of standard Freescale processor cores and proven peripheral intellectual property (IP). The offering is designed to provide customers with the benefits of scalable performance, fast time to market, low system cost, and flexible, System-on-Chip platforms that allow easy migration to next-generation system designs.
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High Performance Microstepping Controller ASIC
The IM2000S is a high performance microstepping controller that incorporates a sine/cosine signal generator, anti-resonance circuitry, PWM current control and much more in one monolithic IC. The IM2000S combines hardware intense functions together with innovative features to provide designers with a powerful yet simple solution for their high volume OEM products.
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Custom ASICs allow the ultimate combination of interfaces, processing capability, power and cost effectiveness enabling differentiated products that add real value to your end customer.
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Featuring Our SiGe (Silicon Germanium) Processes
Customer-Designed RF ASICs
Foundry Services
Five SiGe Processes!
4th Generation SiGe Technology Available
SiGe QuickChip%u2122 For Low NRE
Maxim is uniquely qualified to solve your high-frequency ASIC needs with our Complementary Bipolar, Bipolar, BiCMOS, SiGe (Silicon Germanium), or SiGe BiCMOS process technologies. Our RF ASIC offering includes Customer Owned Tooling (COT) and Foundry Services. Maxim offers:
Experience with more than 1000 mixed-signal and RF ASICs
Thirty years of ASIC experience
Leading-edge process technologies. Choose from five SiGe (Silicon Germanium) processes.
Accurate device models that have allowed a >90% first-pass success rate
Full custom or semi-custom (QuickChip) design methods
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AMI Semiconductor is a leading supplier of structured asic and cell-based digital solutions supporting a wide range of applications in the military/aerospace, high voltage communication, automotive, medical, and industrial markets.
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Epson has long experience in offering a variety of ASIC solutions to customers with its products of gate arrays, embedded arrays and standard cells. Epson continues to be your reliable ASIC development partner, meeting your demand for low profile compact products with quick turn around and developing design environments that always satisfy you.
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As a leading global ASIC provider and total-solutions provider, Fujitsu delivers innovative solutions that enable customers to differentiate their products and maximise their time-to-market advantage.
Together with skilled engineers, this builds up the environment required to develop and produce advanced ASIC designs
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ST offers our partners direct access to advanced technologies through a comprehensive set of libraries and CAD environments to achieve competitive time-to-volume performance.
ASIC/semicustom products play a key role in the IC industry in that they give to customers the ability to access leading edge silicon and packaging technologies and to use advanced IPs to give added value to their equipments.
In our concept customers remain the owners of their IC architecture, having the capability to define and drive their products autonomously, gaining the full control of product differentiation versus competition.
ST's semicustom organization structure focusses on getting your product into volume production in the shortest possible time.
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Samsung delivers a total solution, including deep sub-micron design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging and testing capabilities. The result is a shortened design cycle, lower risk and a much higher likelihood of first-time silicon success.
ASIC solutions at a glance:
Advanced process technology and complete design services
Leader in mixed-signal designs, with silicon-proven IP
Broad expertise to enable product differentiation:
- SoC
- Embedded DRAM & Flash
- SerDes
- ARM processors
Support of key applications such as:
- Mobile devices (smartphones, PDAs, GPS)
- Storage (disc drives, enterprise storage)
- Printers (ink jet, laser jet)
Advanced packaging & testing services featuring:
- System-in-Package (SiP)
- Fine-pitch BGA
- Flip Chip
Regional design centers help speed development
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Toshiba offers a large family of application specific integrated circuit (ASIC) covers from ASIC 0.009µm (TC-300 family) to ASIC 0.3 µm (TC-220 family).
The TC300 family of ASICs are designed for the highest-performance, next-generation products ranging from networking and server applications to digital multimedia devices that manage audio/video information and portable devices that require the lowest power consumption. The TC300 family delivers approximately a 100% increase in gate integration, 20% increase is gate speed and a 50% reduction in power consumption compared to previous generation 130nm process technology. It's built on Toshiba's proven CMOS process technology (CMOS4) that permits easy mixing of mixed signal, DRAM and applications specific IP cores on the same chip. It supports two types of DRAM cores optimized for speed or density, Toshiba qualified primitives, I/Os and SRAMs, as well as a high-speed SerDes for a range of applications.
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austriamicrosystems is a leading supplier of analog and mixed signal ASICs (Application Specific Integrated Circuits), designed for global leaders in the Automotive, Communications, Industry and Healthcare markets.
Our goal is to ensure a strategic partnership for a secure long-term source of supply.
Available ASIC Building Blocks
Power Management
Mobile Entertainment
Wireline Communication
Bus Systems
Car Access
Metering
Sensors / Sensor Interfaces
Medical
High Voltage
General Digital IPs
General Analog IPs
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DirectCore and CompanionCore IP products with free evaluations complement the nonvolatile, secure, and low-power characteristics of Actel FPGAs while offering simple implementation with Actel's development tools. Design Services are available through Actel's Solution Partners.
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An epoxy resin or a silicone coating is then applied on top of the die to encapsulate and protect. This is a manufacturing solution that allows fast modification of existing product designs, even where space is at a premium. COB provides high packing density, quick turnaround, enhanced thermal characteristics, can be adapted to high frequencies, can mix standard assembly technologies and is applicable to most substrates.
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STMicroelectronics is a fast moving logic supplier that offers a broad and stable range of products covering the vast majority of the logic functions required in advanced electronics design. We are committed to providing a variety of logic families aiming at innovation as well as maintaining more traditional logics.
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Toshiba continues to offer the broadest line up of discrete products. Toshiba's Discrete solutions cover a breadth of products including Logic ICs covers 74AC series (299 products), 74HC series (378 products), 74HVC series (265 produxts) and standard series (92 products).
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Programmable logic devices (PLDs) allow designers to make key system changes late in the development cycle, thus providing flexibility and fast time-to-market. With Delta39K(TM) and Ultra37000(TM) devices, Cypress offers a wide range of CPLDs with products ranging from 32 to over 3000 macrocells.
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The NBSG86A is a multi−function differential Logic Gate which can be configured as an AND/NAND, OR/NOR, XOR/XNOR, or 2:1 MUX. This device is part of the GigaComm™ family of high performance Silicon Germanium products. The device is housed in a low profile 4x4 mm, 16−pin, flip−chip BGA or a 3x3 mm 16 pin QFN
package.
Differential inputs incorporate internal 50 termination resistors and accept NECL (Negative ECL), PECL (Positive ECL), LVCMOS/LVTTL, CML, or LVDS. The Output Level Select (OLS) input is used to program the peak−to−peak output amplitude between 0 and 800 mV in five discrete steps.
The NBSG86A employs input default circuitry so that under open input conditions (Dx, Dx, VTDx, VTDx, VTSEL) the outputs of the device will remain stable.
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Whether you’re designing at the board or system level, Actel’s low-power and mixed-signal FPGAs are your best choice. The unique, flash-based technology
of Actel FPGAs, coupled with their history of reliability, sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data centers and industrial controls.Take your designs to 30,000 feet or even millions of miles into space. Only Actel can meet the power, size, cost, and reliability targets that reduce time-to-marketand enable long-term profitability.
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Features
* 4-20 GHz High Isolation SPDT
* <0.9 dB Typical Insertion Loss
* 35 dB Nominal Isolation
* 12 dB Typical Return Loss
* On-Chip Bias Network
* DC blocked at RF ports
* Chip dimensions: 2.24 x 1.63 x 0.10 mm (0.087 x 0.063 x 0.004 in)
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Ever-increasing system complexity, never-ending cost pressures, continually shrinking available space for electronics, and ever-higher quality requirements top the list of trends that relentlessly drive ASIC development.
To help its customers meet these rigorous demands, AMI Semiconductor relies on its three decades of experience in creating and integrating functional circuit blocks that meet specific customer needs.
AMIS couples this expertise with a strong focus on dedicated high-voltage, mixed-signal technologies, know-how in complex system level integration, and a corporate-wide design methodology that is specially tuned to the unique requirements of mixed-signal design.
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Actel Fusion integrates configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry, and high-performance, flash-based programmable logic in a monolithic device. Actel's innovative Fusion architecture can be used with the Actel soft MCU core as well as the performance-maximized 32-bit ARM® Cortex™-M1 and CoreMP7 cores. Fusion is the definitive mixed-signal FPGA platform.
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TI is your source for Standard Logic ICs including Switches, Translation, I²C, Interface, Little Logic, Gates, Inverters, Flip-Flops, and FIFOs.
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MCM technology is applicable to many markets. Substrate technology includes: Thick Film ceramic, LTCC, Thin Film and for benign environments, epoxy laminates, such as FR4. For the harshest environments, chip and wire MCMs on ceramic are hermetically sealed in metal or ceramic packages. For lower cost applications, epoxy or silicone glob top is often used to provide protection of wire bonding or flip-chip assemblies.
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In the recent years, EM has expanded its large experience in low-power mixed-signal IC development to the imaging and photonics branches. Depending on the requirements of the various applications, different low-power embedded CMOS image sensor solutions with analog and/or digital outputs are possible. EM has focused on the development and production of customized Photo-ASICs rather than standard image sensing products.
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Cypress' PSoC(R) mixed-signal arrays are programmable systems-on-chips (SOCs) that integrate a microcontroller and the analog and digital components that typically surround it in an embedded system. A single PSoC device can integrate as many as 100 peripheral functions with a microcontroller, saving customers design time, board space, power consumption, and from 5 cents to as much as $10 in system costs.
Easy-to-use development tools enable designers to select the precise peripheral functionality they desire, including : Analog functions (amplifiers, ADCs, DACs, filters and comparators) ; Digital functions (timers, counters, PWMs, SPI and UARTs) ; Communications interface (I2C, SPI, USB...).
PSoC devices include : Up to 32 KB of flash memory
2 KB of SRAM ; An 8x8 multiplier with 32-bit accumulator and Power and sleep monitoring circuits.
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How to conserve power when playing back video content is a significant issue when designing mobile media devices. A common solution is to lower the backlight level of the LCD as it consumes 30% to 60% of the total system power. This solution significantly diminishes the viewing experience with details lost due to the lowered contrast ratio. QuickLogic’s proprietary VEE Proven System Block (PSB) enhances both image and video quality by optimizing the dynamic range, contrast, and color saturation pixel-by-pixel to provide a natural viewing experience under low backlight or bright ambient light conditions. Seamlessly integrated into the display path, VEE enhances the user’s mobile multimedia visual experience while drastically reducing backlight power to extend battery life.
All members of the ArcticLink II family of solution platform family embeds the recently announced 2nd Generation VEE technology, combined with programmable fabric. QuickLogic and Apical Limited partnered to architect and develop the optimal blend of algorithms with QuickLogic’s PSBs and patented ViaLink programmable fabric for mobile and portable multimedia products.
The core of the VEE technology is based on the proven iridix® algorithms licensed from Apical Limited, which is substantiated by nearly a decade of scientific research. These algorithms implement a model of human perception; resulting in a displayed image that retains detail, color and vitality even under variable viewing conditions. It specifically addresses the problem of the low contrast ratio of mobile Liquid Crystal Displays (LCD) to bring a more TV-like viewing experience to the mobile devices.
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Logic gates, FPGAs, ASICs
