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Function
Large board dimensions, different conveyor modes tor different throughput rates and a new high-speed inspection function - these
are the key product features of the X6. Printing tables with different designs tor different versions allow solder paste printing on partly assembled circuit boards (i.e. components mounted on the opposite side) with formats ot up to 610 x 550 mm. The choice
of the right circuit-board conveying system is determined by the required throughput rate. The single-track system conveys the
circuit-board safely through the printer and requires a handling time of only 12 seconds.
The single-conveyor HSP version with its tripartite conveyor belt shortens this handling time to less than 7 seconds.
The new high-end version of the EKRA 2 1/2-D postprint inspection delivers several images from up to 4 inspection stations every
second, thanks to the use of the latest linear engine drive technology. The use of a larger camera sensor increases the field
of view to 20 x 16 mm without any loss in resolution, ensuring that the 2 1/2-D postprint inspection system delivers consistently better results than the so-called line-scanner solutions and allowing
a thorough analysis of the solder paste printing quality on the basis ot its images.
Standard version with adjustable squeegee pressure and as a VIP head with weight compensation and fine-tuning for the squeegee
power. The automatic stencil-cleaning function also features in the basic version.
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Advanced Seam Welding System - PS1000
Features:
- Seals parts as small as 2x2 mm
- Miyachi Unitek HF25 inverter power supply with real-time feedback
- Rugged, precise motion control
- Servo motor-driven electrodes
The advanced technology of the PrecisionSeal 1000 opens new frontiers in quality, cost and capability in seam welding. It precisely controls energy, position, timing and force to hermetically seal even the smallest and most delicate semiconductor device packages.
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The new MW500 selective mini-wave soldering cell is adapted for selective point-to-point or linear soldering operations controlled by an industrial PC.
- Based on 4 fully programmable numerical axes with an additional 7-10° tilt axis.
- Staging area for optional tray loading system or rotary table.
- Integration into automatic lines.
- Working area: 500 x 500 mm.
- Mini-wave system fully made of titanium (tank capacity: 20-25 kg).
Soldering process:
programming -> re-centering (option) -> fluxing -> pre-heating -> soldering quality check (option)
Accurate positioning is achieved via a camera during teaching and programming.
Fluxing is introduced according to the type of flux used: an airless fluxer (alcohol based) or, alternatively, an ultrasonic fluxer » (water based).
Hot air blower, or alternatively infrared heater for PCB, are proposed for the pre-heating operation.
Selective soldering is carried out thanks to the most performing lead free compatible tank and electromagnetic pump fully made of titanium.
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Due to the ever-increasing demand for quality and reproducibility of the entire manufacturing process, today it is no longer acceptable to manually solder the conventional component remainings after the reflow process into place and – with the GoSelective-1 and -2 from SEHO – this is also no longer necessary.
The GoSelective-1 and -2 offer all in one: highest flexibility, absolutely reproducible results, high soldering quality even with demanding assemblies, low capital expenditure and the possibility to be upgraded step by step at a later date to suit subsequent production developments.
Special flexibility is given in the handling of the assemblies. Both, bare boards as well as assemblies in carriers can be processed with all GoSelective systems.
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The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
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The Uni-Slide stand-alone product line is a system concept with a linear product movement. The product is safely and accurately loaded, aligned and unloaded in the front position of the slide, and processed in the rear position. The linear slide is manual operated.
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The stand-alone Uni-Base systems are the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. The Uni-Base delivers the same high connection quality as the larger and more sophisticated systems.
Setting up the system for different products is easy as 1-2-3, making it suitable for laboratory and high-mix production. Because of the low investment costs, earn-back time is short. Mass production environments will typically run several of these systems besides each other.
Standard available systems are:
- Uni-Base SS-W-100 with SH500 pneumatic bonding head and Uniflow Power Supply
- Uni-Base SS-W-231 with SH500 pneumatic bonding head, Uniflow Power Supply and basic manual slide
- Uni-Base PS-W-101 with PH500 motorized bonding head, Uniflow Power Supply and PLC control
For Reflow Soldering and Heat-Sealing these standard systems are using Pulsed Heat Technology (Uniflow Power Supply). For ACF Bonding a tape feeder and tape cutting module can be added. You can find more information in the PDF-file below.
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AUREL AF5-AF8 Forced Convection Reflow Soldering system
Description
The AUREL AF5-AF8 reflow systems are special designed for predrying of pastes in thick film technology.
Applications
• Computer control with user-friendly software, Win 98 operating system, temperature PID control, 1000 program storage.
• Alarms for over temperature, heaters-blowers-thermocouples failure, conveyor stop and muffle open. Week timer. Light tower for status indication.
• Entrance with adjustable barrels, curtains, aspiration chamber.
• 450 mm Stainless Steel mesh belt conveyor or [optional] combination Pin Chain/Mesh Belt conveyor, width 50 to 330 mm adjustable by hand wheel or motor [optional], SMEMA interface.
Standard Features
• Controls for Air/Nitrogen, RS232 port for printer and for external temperature profiler [optional].
• 4+4 or 7+7 zones Top and Botton Heating full convection modules, long life blowers, long life and low consumption heating elements, modular design for easy service and cleaning.
• Cooling zone with Air/Nitrogen blowers, fan ventilators, exhaust aspiration, optional exhaust filtering 99.9% efficiency.
• Easy access to the machine hardware, removable panels, gas and pneumatic cylinders for complete opening of the muffle, UPS for product evacuation [optional], emergency stop buttons, interlock switches for total security, easy installation and moving by adjustable feet and wheels.
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The Tyco Electronics P200 is a stand-alone insertion machine targeted at low to medium volume production. Equipped with a rotary insertion finger, the P200 can apply products at up to 7 different angles without having to rotate or remove the board. The end result is the ability to apply products at various angles without increasing cycle time.
Easy Operation
Insertion tools for Tyco Electronics products are composed of an insertion head (upper tooling), an anvil (lower tooling) and a product feeding mechanism. These tools are product specific and the PCB holder interface is designed according to the customer application. A rotary insertion finger allows the insertion of pins at different angles. Because of a simple mechanical and electrical interface, other tools can easily be integrated into the machine.
The standard insertion head on the P200 machine is pneumatically activated. All movements such as feeding the product, cutting contacts off the carrier strip, gripping and inserting the product into the PCB are activated by the vertical movement of the pneumatic cylinder.
Also available is the motor driven base insertion head together with a large variety of product specific conversion kits. These conversion kits can also be used on P300 and P350.
The excellent performance of a multi-tasking control system allows easy programming and operation of the machine. Simple operator and programming interface, failure diagnosis and modem (for remote diagnosis) to provide easy operation and trouble-shooting.
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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs
Wafer Specifications
* Diameter: 200mm and 300mm.
* Material: All Semiconducting and Semi-insulating materials.
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
* Flat/Notch: All SEMI Standard Flat(s) or Notch.
* Conductivity: P or N Type.
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.
Measurements
* Thickness and TTV.
* Bow
* Warp
* Site and Global Flatness
Advantages
* Cost effective alternative to fully automated tools.
* Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
* Standard Windows® User Interface.
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.
Wafer Specifications
* Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
* Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned
* Flat/Notch: All SEMI Standard Flat(s) or Notch
* Conductivity: P or N Type
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape
Measurements
* Thickness and TTV
* Bow
* Warp
* Site and Global Flatness
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Uniform, Repeatable Thermal Processing
Axcelis' Summit XT covers a broad range of advanced thermal processing needs for transistor formation in and beyond the 65nm technology node, including anneals for:
-Ultra shallow junction formation
-Dry oxidation
-Nickel silicide
-Shallow trench isolation (STI) oxides
-Titanium nitride (TiN) densification
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No matter where you are in the move to smaller linewidths, Axcelis has a UV curing technology available to improve your process. We offer three configurations - RapidCure FC, RapidCure CE and RapidCure PS - to give you the flexibility to cover a range of film curing , charge erase and photostabilization applications. Every system in the RapidCure family is built on the same technology foundation that has made Axcelis the leader in UV curing, with over 2,000 systems shipped worldwide.
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Two platforms, complete coverage
When it comes to dry strip technology, process application needs are as diverse as our customers. That's why Axcelis offers two distinct product families that address the full range of FEOL and BEOL resist strip and polymer removal requirements for transistor formation, interconnect, and packaging applications through the 45nm technology node.
-Speed, efficiency and economy
Our family of RapidStrip(TM) systems address, high-volume photoresist strip needs, wherereliability and low cost of ownership are premium concerns.
-Process performance and versatility
Our family of RadiantStrip(TM) systems support the most demanding dry strip requirements, including cleaning over advanced low-k dielectric materials.
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These benchtop machines offer technologically advanced, low cost solutions for low to medium volume surface mount placement applications. These systems are specifically designed for facilities where quick set-up, ease of operation and high reliability are paramount.
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SUMMARY:
- Dual Gantry 4 Heads
- High Accuracy and high Flexibility for 0201 (0.6 mm x 0.3 mm), SOIC, PLCC, BGA, µBGA, CSP, QFP (0.3 mm pitch)
- Smart Feeder System provides Automatic feeder position checking, Automatic component counting, Production data Traceability
- Perfect for medium and high volume production
- COGNEX Alignment System "Vision on the Fly"
- Bottom Vision Alignment System for fine pitch QFP & BGA
- Built in Camera System with Auto Smart Fiducial Mark Learning
- Vision Inspection before and after production
- Windows 2000 Software
- Universal CAD Conversion
- Placement rate: up to 10.500 CPH
- Ball Screw Systems in X- and Y-Axes
- Conveyor System with SMEMA Interface and automatic width control
- Suitable for 64 intelligent Auto Tape Feeder
- Non-Contact Linear Encoder System
- Rapidly changeable Feeder Trolley
- Strong and rigid mechanical design
The SMT Pick & Place Machines of BS683-series were especially designed for medium and high volume batch sizes. With the two row of dual-head (4 multi-head in total), both row of heads can pick up the components, and place the components steadily in alternation.
Non-contact Linear Encoders together with DC-servo motors provide an extremely high repeatability and stability.
Additionally, the BS683-series feature COGNEX vision processing and head-mounted for non-contact "Vision on the Fly" alignment.
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Placement area:
- max. 400x500mm
Component range:
- from 0402 to 25x25 ( option 40x40 )
- min pitch 0,4mm
- BGA / µBGA
components packgage:
- tapes / sticks / trays / bulk
Components centering:
- non-contact alignment
Placement rate:
- up to 800 cph.
Feeder capacity:
- max 80 x 8mm - tape strips
- and 2 x (300 x 200mm) - IC-tray
- with 200 x 300mm PCB size
Resolution:
- X / Y Axis - 0,008mm
Placement accuracy:
- +/- 0,08mm
Dimensions and weight:
- 840 x 630 x 430 mm / ca. 65 kg
Supply:
- 230V-50Hz -350W / 0,6 MPa - 15l/min
KEY FEATURES:
- desktop SMT pick and place machine
- automatic pick & place head
- automatic nozzle changer ( 6 tools )
- top camerasystem for automatic fiducial
- bottom camerasystem for touchless components centering
- Gerber - and CAD editor ( all CAD-systems)
- teach-in mode - electronic manipulator
- image processing system
- operating system: Windows XP
- control panel: PC keybord / Mouse
- user interface - PC and 17" LCD monitor
Application area:
- suitable for small and medium volume production
- qualified for pick & place of standard and fine pitch components
- incl. BGA and µBGA
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When you're looking for highly productive, low cost per placement and exceptional quality - Panasonic's BM123 and BM133 modular placement machines are the answer.
Panasonic's eight-nozzle independent vertical drive system ensures expansion of component gang pick-up and focused recognition scans; thereby, delivering reliable accuracy to 0.12 s/chip (30,000 cph). The integrated line scan sensor measures component thickness - administering consistent force and placement.
Placing components from 0402 (01005) chips to 32 x 32mm QFP and BGA chips, it's small footprint 1950 x 1710mm, and easy to use, interactive design make the BM123 and BM133 the continuous quotient in any decision matrix.
Features & Benefits
Speed
Low cost per placement
Wide component range
Reliable Accuracy
Wide component capability from 0402 (01005) chips to 32 x 32mm QFP and BGA chips on up to 18" x 22" boards
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Turn-key solutions - Solartechnology
MiniTec offers automatic assemblylines for this very sophisticated process including industrial images processing, automatic test stations, framing stations and many approved solutions for damage free module handling.
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From standard, single element materials to custom compounds, small circular to multi-tile and stepped constructions, commercial grade to ultra-high purities, Angstrom Sciences provides the highest quality magnetron sputtering target materials.
We utilize a variety of specialized processing techniques such as hot pressing, hot isostatic pressing (HIP), cold isostatic pressing (CIP), induction vacuum melting, and vacuum casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards.
All sputtering targets are cleaned, inspected, chemically-tested, and packed under inert gas for immediate use in your vacuum system.
Angstrom Sciences provides a full range of sputtering target materials including: precious metals, pure metals, alloys, ceramics, cermets, borides, oxides, carbides, nitrides, silicides, and fluorides.
Purities range from commercial grade (99.5%) to ultra high (99.9999%).
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The 866B is a universal device programmer with a constantly updated extensive device library. It has been designed for ease of use and reliable performance and it is ideal for use with Laptop/Notebook computers that do not have parallel port interfaces. Whether you are working with PLCC, SOIC, TSOP, DIP, TQFP, SSOP, PSOP or QFP, B+K Precision has an extensive line of socket adapters to interface with any IC package. This programmer is much more than a basic EPROM Programmer and it is a must for anyone that Tests, Repairs, or Programs any electronic device that uses a memory IC.
The easy-to-use control program with pull-down menu, hot keys and on-line help, also the 866B can be used by users with technical levels ranging from the Hobbyist to the professional R&D Engineer. Selecting of device is performed by its class, by manufacturer or simply by typing a fragment of vendor name and/or part number.
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Stealth Dicing Technology
In Stealth Dicing, a laser beam at a wavelength capable of transmitting through the material is condensed on an internal point in that material. This selectively forms a mechanical damage layer (stress layer) in a localized point near the light focus area so that the material is cut from the "inside". The operating principle of stealth dicing is fundamentally different from conventional blade dicing technology that cuts the material from the "outside".
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Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding the wafer.
Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)
Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.
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PV Series
Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer.
Wafer saw mark detection and classification is accomplished by adding optional laser sensors to the PV-1000 module. Utilizing up to two of MTII's industry leading Microtrak - SA standalone laser heads, saw marks can be classified for orientation and depth simultaneously with wafer thickness scanning making the PV-1000 ideal for incoming wafer characterization and sorting.
Integrated data acquisition and control electronics analyze and transmit wafer data via the on-board Ethernet port at speeds of up to five wafers per second. The digital I/O port allows communication with wafer handling equipment for up to 64 classes of wafer sorting and binning. Remote monitoring capabilities allow you to see your production line data across your network or directly at the module.
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With its newly developed unique multi-directional detection optics unit, the LS-6800 / LS-7800 Wafer Surface Inspection tool achieves a detection sensitivity of 36nm (LSE) on bare silicon wafers.
This enables critical wafer inspection even at the 65nm technology node.
Features:
Detection Sensitivity: 40nm (PSL on Bare Silicon)
(36nm attainable)
Defect Classification: Crystal Defect / Particles
Scratches/ Particles
others
Detection Reproducibility: >99% (100nm PSL on bare Si)
Throughput (fast mode): 97wph (300mm)
75wph (200mm)
Display functions: Particle map, counts, histogram,
haze map, haze histogram,
others
Wafer sizes: 300mm, 200mm
(150, 125, 100mm optional)
(thin wafer chucking optional)
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Rudolph Technologies provides automated wafer edge top and edge normal inspection with throughputs of greater than 80 WPH (300 mm). The Class 1 certified system has an approximate 10 minute set-up time to be fully optimized and production ready. Featuring on-the-fly color defect image capture and intrinsic ADC capabilities, the E25 System can automatically detect and classify defects on the entire wafer edge, from the edge exclusion area to the bottom bevel. Both brightfield and darkfield illumination are available.
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Hamamatsu provides photo ( EMMI ) and thermal emission microscopes , thermal ( OBIRCH ) and photoelectrical ( OBIC ) laser stimulation systems for the failure analysis field and the design debug markets .
Our know how to combine state of the art confocal optical design for various wavelength bandwidth , owning core detections technologies such as InGaAs or Thermal sensors , integrating extremely high accurate and stable mechanical stage down to the microprobing level , sets our equipments as the most renowned in the world for more than 20 years .
Our tools are suited for a wide type of architecture from the die or wafer level , though package or applications boards level, up to probe card level and direct docking with tester environment, allowing our customers to observe parametric defect in static conditions and/or functional failures in real dynamic conditions.
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JEOL wafer and mask review tools improve yield management with unique capabilities that help rapidly detect minute imperfections and killer defects. 360 degree wafer edge review, high tilt, and fully automated rotation enhance the automatic defect classification capability of our high resolution, high throughput wafer inspection SEMs for 150-300mm wafers. JEOL provides a wide range of SEM based review solutions for the most advanced designs and highest throughputs.
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The Rudolph Wafer device combines both edge and backside inspection into one enclosure. It retains all the capabilities of the proven E25 and B20 System in one small footprint. The Class 1 certified system can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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General description:
The IL 3400 wafer sorter / wafer inspection system is a multi functional tool to be used to sort, transfer and inspect 300mm wafers for various applications.
It is equipped with a class 1 mini environment with ionization unit and differential pressure sensor controlled flow.
The system uses a 300 mm "Edge Grip" handling and aligner unit. The versatile and compact 6 stations design allows various combinations of automatic FOUP openers, aligner and presenter units to be integrated.
The basic model has one reading unit (OCR, BC412, T7) for reading the code on the backside of the wafer.
A second reading unit (OCR, BC412, T7) for reading the code on the wafer frontside can be mounted as additional option.
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Machines for electronics production
