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| Products 151 to 180 of 216 |
General description:
The InnoLas wafer sorting system IL 2600 can automatically sort, split merge and transfer wafer from any slot / cassette to any other slot / cassette in a six cassette array.
Wafer sizes from 100 mm to 200 mm can be handled without any mechanical adjustment in a single or multi-batch operation.
The laser mark code read for verification can be located at any position on the front and/or backside of the wafer.
The basic model has one reading unit (OCR, BC412, T7) for reading the laser code on the frontside of the wafer.
A second reading unit (OCR, BC412, T7) for reading the code on the backside of the wafer can be mounted as an option.
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With the wave soldering system PowerWave, SEHO consequently realized a machine concept which offers a remarkable performance at simultaneously low investment costs. Complex SMD boards are as reliably soldered as conventional assemblies - due to up-to-date solder nozzle geometries and a flexible preheat area.
The modular construction of SEHO PowerWave offers the ideal concept for all production requirements and allows the machine to be integrated into existing fully automated production lines.
Performance reserves for the user have been created with the high performance pre-heating. SEHO PowerWave is available with either 1200 mm preheat length or 1800 mm. Depending on your production requirements, SEHO PowerWave may be equipped with a chain/finger conveyor system or with a solder frame conveyor for the processing of pallets.
The heart of the machine, the soldering area, is designed with a degree of flexibility that may perform all realistic soldering operations. Modern and innovative solder nozzle geometries provide ideal soldering results.
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The GoWave 1030 is a powerful soldering system for those just entering into mass-soldering operations. This system is suited to a variety of applications ranging from entry-level mass-soldering to soldering in small or medium-sized batches. It also provides an economical soldering solution for universities, schools and laboratories.
The GoWave 1030 is especially featured with its innovative nozzle concept which is ideally suited for nearly all soldering tasks.
A special feature of this machine is its compact, but performance oriented design. Offering a fluxer module, an efficient preheater, innovative soldering area and microprocessor control, the GoWave 1030 presents the finest soldering technology in its class.
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Wedge bonders are used in the manufacturing of many microcircuits especially those for RF and microwave applications. Hybond wedge bonders can bond wire and ribbon in materials such as gold, aluminum, copper, silver, palladium and others. For a further look into our wedge bonders we suggest our models 572A, 572A-40, 676 and model 626 multipurpose wire bonder.
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Hybond designs, manufactures and sells ultrasonic and thermosonic wire bonders. Products include:
Ball Bonders: for ball bonding and bump bonding of gold wire.
Wedge Bonders: for bonding of gold, aluminum, platinum, copper and other material wires and ribbon (flat wire).
Peg Bonders: Used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine.
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The ml|inspector is a high-resolution microfocus X-ray system designed for inspecting multilayer boards.
Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation
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Machines for electronics production
