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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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An accurate high-speed flip chip bonder, the FCB3 accommodates a variety of needs. From development to pre-production and multiple-model production, this machine offers outstanding functionality.
The FCB3 features a simultaneous recognition camera that ensures accurate bonding in continuous production. Additionally, the automatic calibration function corrects thermal changes over time, guaranteeing bonding accuracy of ± 3 _m/3 sigma during continuous production.
Ideal for medium to very fine pitch manufacturing.
Features & Benefits
Flexible modular system accommodates various processes
IC feed from both tray and wafer optimizes productivity
Automatic tool changer with 4 input handles up to 38 types of ICs
Wide component range - from 2" x 2" (up to 320 inputs) to 4" x 4" (up to 80 inputs)
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AutoPoint DT is a fixtureless, gridless flying probe with a unique power-off impedance analysis measurement system. Excellent for Manufacturing Defect Analysis (MDA) testing and Field Return Failures.
Supplied as a Stand Alone System or integrated with the PinPoint II Advanced Diagnostic Test System System
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SUMMARY:
- Full hot air convection
- 4 Zone control
- PCB width up to 365mm
- Glass Top Design
- Built-inTemperature profile
- WComputer Control
Autotronik BS3020 is a high performance full hot air convection reflow soldering system
with computers control which can handle boards up to 365mm width with less than +/-2 centigrade degree temperatures gradient.
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The Tyco Electronics P350 is a fully automatic pin insertion machine capable of applying reeled products from Tyco Electronics or other manufacturers. With inline operation, an automatic tool changer and insertion rates up to 5 per second, it is focused at fully automatic high speed operation to maximize throughput while minimizing costly scrap.
Easy Operation
Boards up to 450 x 450 mm [17.5 x 17.5”] can be processed and are positioned on the X/Y table by stepper motors.
A servo powered XY table positions the PCB under a central drive station at highspeed. The automatic tool changer can hold up to 3 insertion heads — each capable of applying a different product. A unique rotary insertion finger allows the application of products at up to 7 different angles without rotating the PCB. This allows the P350 to apply product at different angles without a reduction in insertion rate or the potential positioning error associated with PCB rotation. An active lower anvil provides support to the PCB during insertion, can provide special actions such as clinching (when applicable) and allows for real-time force monitoring for 100% quality assurance on press-fit applications. Icon driven software with touch screen provides a simple to use, intuitive operator interface.
The P350 provides a wide range of solutions for pin insertion applications. Board size capacity up to 450 x 450 mm [17.5 x 17.5”], quick change tooling packs, and a wide range of options make it a flexible high speed platform.
A wide range of optional equipment is available for further performance enhancement and versatility to meet a wide range of customer specific application requirements
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Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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Bondjet BJ920
The Bondjet BJ920 is a nex development in heavy wire bonding. Hesse & Knipps has designed a bonder available with integrated pull and shear test, a high speed and accuracy and largest bonding area which is presently unique in the market. Advanced features available only on Bondjet BJ920 and enhanced quality control systems serve to meet your customers' requirements and greatly enhance productivity.
Advanced Features:
- E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Quality monitoring by high resolution deformation and transducer current measurement
- Program upload and download via LAN
- Flexible multi-lane handlers
Integrated Non-destructive Shear and / or Pull Test:
- Fast shear test with less stress for the connection than pull test
- Programmable pull test for each wire
Speed:
- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)
Accuracy:
- 10 μm at 3 σ repeatibility at each position in the large work area
- 7 μm pattern recognition system accuracy
Largest Bonding Area:
- Up to 380 mm x 500 mm (15'' x 19.7'')
Bondhead Highlights:
- Maintenance-free solid state joints
- Active cutting bondhead with extended cutter lifetime
- No pusher provides better access into tight packages
- Closed loop force control, programmable from 0 to 1400 cN
- Touchdown and deformation sensor without signal delay
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Integrated, In-line Diffusion System - DCF Series
Integrated, In-line Diffusion System
The new, Integrated, In-line Diffusion System is Despatch's latest addition to the company's photovoltaic product portfolio. The new in-line diffusion systems are designed to consistently deliver highly homogeneous emitters that are critical for creating high efficiency solar cells.
The production of the DCF Systems represents an important advance in the solar cell manufacturing process by integrating the following into one single piece of equipment:
A patent-pending, in-line phosphorus doper that utilizes top and bottom spray technology
An infrared diffusion furnace featuring a patent-pending thermal processing chamber
Critical process technology
The new integrated systems are recognized for superior thermal processing control, improved cost of ownership, value-added feature sets and ease of maintenance. These special features provide customers with high throughputs and maximum yields.
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Lynx VS8 is an advanced stereo zoom microscope for Printed Circuit Board inspection and is ideal for all electronics applications including fine pitch, surface mount, TAB and BGA technology.
The Lynx VS8 consists of a stable, high capacity scanning stage that provides free floating movement for all sizes of board, including double sided PCBs. Stage can be locked for precision inspection tasks (x-axis, y-axis, or both). Complete with earthing point for static safe inspection.
Lynx VS8 provides magnification from x7 - x40 within the standard zoom range. An oblique and direct viewer can also be added to the modular system allowing the operator to view a subject direct or from an angle of 34° from vertical, which can be rotated through 360°.
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Model 616A Peg Bonders are used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine. Bare wire diameters equal to or smaller than 75um, insulated wires up to 51um and flat conductors up to 25um x 500um can be bonded with the 616A.
The 616A has a series of seven different configurations that allow it to fit into existing production lines, single work benches or new production lines.
For more information, please contact us at mailus@hybond.com.
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Complete Applications Coverage
Our evolving line comprises mid dose, high dose, and high energy platforms designed to address the continued scaling trends of implant applications to lower energy ranges. This means we have the technology to cover all critical implant applications - including all existing and emerging needs of the 65nm era and beyond. In addition, our platform is designed to provide a high degree of process overlap to provide both back up capability, and improved system ultilization...
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ECO
Micro-jet dosing systems for:
- lubro-cooling substances for processes like shearing, drawing, drilling, tapping, cutting, etc.
- lubrication of particular kinematic mechanisms and/or components
Products: lubricating oils, evaporable oils, cooling liquids, detaching fluids, protective coatings, etc
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- Diodes laser
- Laser power: 60, 90 or 120W
- Surface of the focal point 1 x 1.2mm
- Precision of the wire in-feed ± 2,5%
- Diameter of the soldering wire from 0.46 - 1.6mm
- Wire alloy leaded or lead free
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Laser Brazing Head YB50
Modular processing head for laser beam brazing
rugged components tested under industrial conditions
integrated protective window monitoring and Cross Jet
integrated sensor for process monitoring
can be expanded with an LPF Seam Tracking System
Laser Welding Head YW50
Process monitoring: laser power
Laser: Nd:YAG, ytterbium
Focal length collimator: 50 to 200 mm
Welding power supply, wire feed supply, torch hose pack: company CLOOS Schweißtechnik GmbH
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LPKF MicroCut
Capable of cutting any shape without burrs
The LPKF MicroCut is a high-performance stencil laser. The LPKF MicroCut is capable of cutting any shape at up to 50,000 openings per hour.
The laser can cut apertures as small as 30 µm with a roundness better than 96%, and its effective material focus diameter produces sharp contours.
As a result of the new cutting technology post-treatment is not necessary anymore.
Absolute flatness of the material is reached also with highest component density by the new LPKF PulsShape function.
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High-precision CSP and BGA checker jig plate drilling
Application extended to brittle material in addition to resin
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As a leading company in the PWB manufacturing systems industry, Hitachi Via Mechanics has been providing a broad range of products including PWB Mechanical Drilling Machines, Routing Machines and Laser Drilling Machines. We have also commercially introduced other products including Hole Analyzer and Printed-circuit Motherboard Products. Furthermore, we have been providing PWB manufacturing facilities, which are ready to address the needs of the highly-advanced information age. These solutions have an excellent reputation and have earned a high level of customer confidence.
LT Series
Laser trimming of embedded passive components on PWBs.
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Fonon's Zero Width Laser Dicing Technology® (ZWLDT®) will cover unprecedented explosive growth and demand in semiconductor markets in China, Taiwan, Japan and Korea. This technology has lead to products, such as the BlackStar™, that offer the best in silicon wafer dicing over existing technologies.
ZWLDT® will slice the wafer much safer than mechanical saws that may cause wafer damage, and increase the yield per wafer as well as maximum throughput while minimizing the HAZ.
With the technology Fonon acquires, Fonon Display and Semiconductor Systems (FononDSS), has been able to launch a number of products that make the most of the technology for the semiconductor and flat panel display industry.
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Panasonic's UV laser scriber has a complete laser optics bench that offers flexibility to fit the specific application - the result of PFSA's experience in high volume microelectronic manufacturing and expertise in productivity.
The laser scriber enables the non-mechanical scribing and dicing of wafers. Primary uses include application for low and ultra-low 'K' wafers as well as non-mechanical scribing over metalized portions in the wafer streets which enables smaller kerf widths - allowing for greater numbers of die per wafer.
The UV Scriber enables sample builds for next generation products and maximizes die-level densities to reduce costs and increase profits.
Features & Benefits
Low K scribing with superior quality over mechanical dicing
Next generation supported via sample builds
Configurable for development of future capabilities
Increase profits by optimizing die-level density
HVM capable today
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General description:
The models 2000 / S / DPS / DPS-G / C / UV of the wafer marking system d IL 2000 are designed to mark various wafer materials with different diameters.
Different laser types and setups (solid-state laser, CO2 laser, UV laser etc.) are available to vield optimum process results for different wafer materilas such as Si, GaAs, Ge, GaP, InP, Sapphir, Quartz and others.
The IL 2000 provides "Deep" marking (marking depth up to 100µm) as well as "debris-free" marking (0,3 - 6µm). A powerful software package, developed in cooperation with many customers over the past 10 years, offers immediate operating solutions for most customer applications.
The model 2000 X (Die Marking System) adds specially developed Die marking software and a linear X/Y-table to the standard components of the 2000 series. These enhancements allow the 2000 X to accurately mark each die on the wafer (e.g. for processing of high-end-components).
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Corning Tropel continues its tradition of providing innovative metrology solutions and tools to semiconductor wafer manufacturers by introducing UltraSort a patented wafer flatness analysis system for rapid, repeatable, accurate, non-qualification of wafers.
UltraSort continues Corning Tropel’s 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer manufacturing, this automated system offers the utmost in rapid, repeatable, accurate, non-contact qualification of silicon and alternative substrate wafers.
UltraSort is an automated wafer flatness analysis system that includes cassette-to-cassette wafer handling with user configurable sorting capability.
This Class 100 cleanroom compliant system integrates a grazing-incidence interferometer with industry standard robotic handling.
The UltraSort can be configured to measure wafer sizes from 2 inches to 8 inches in diameter, and is well suited for a variety of different materials including gallium arsenide, sapphire, quartz, germanium and silicon.
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The MetaPULSE® System uses patented picosecond ultrasonic laser sonar (PULSE™) technology to provide the industry's first production-worthy opaque film metrology tool. Its small-spot, non-contact, non-destructive technology enables on-product thickness measurements of single or multi-layer opaque films for aluminum and copper processes. In addition to thickness, the MetaPULSE identifies missing layers or interfacial problems such as poor adhesion, and characterizes material properties such as density and roughness. MetaPULSE is used by all of the top ten semiconductor manufacturers, and nearly 200 tools are currently providing production monitoring in fabs around the world.
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LCD Repair - Features:
- For Medium to Large LCD/PDP Panels (3" to 80")
- Wide Variety of TAB Sizes and Shapes
- Wide Variety of PCB Sizes and Shapes
The Emerald Series is designed for PDP / LCD repair and low volume production. With minimal changes and change over time, one system can handle 3" displays up to, and over 80" displays. These LCD repair systems can handle both TAB and COG applications. Pulsed heat or constant heat models are available. Four standard bonding platforms are available: 25", 45", 65", and 80". With the C-Frame construction there is no maximum size that the Emerald system cannot handle. Systems can be specified to handle LCD only; PDP only; or both PDP and LCD repair.
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Lid Placement and Seam Sealing System - Autoflow AF8500
Features:
- Sophisticated closed-loop vision system for precise lid placement
- Seam Seal in a matrix
- Exceptionally high yield rates at lower costs
- Completely automated
- Miyachi Unitek power supply
- Easy to operate
- Turnkey seam seal system /Full documentation and schematics
The Autoflow can also be easily integrated into atmospheric enclosures to provide for seam sealing in a controlled atmosphere at a desired gas composition. Utilization of a Benchmark supplied glovebox provides seamless controls communication insuring high yield hermetic seam sealing results.
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High Speed Hermetic Lid Sealing and Tacking - PT1000
Features:
- Real-time Cognex vision system for accurate hermetic lid sealing
- High speed vacuum placement head for high throughput
- Highly-sensitive voice coil technology provides the ultimate in force control
- Double lids are detected and eliminated
- Miyachi Unitek 125 DP/60WS capacitive discharge welding power supply
- Powerful, easy-to-use Microsoft Windows®-based operating software
- Small footprint
The PrecisionTack 1000 uses advanced technology to precisely align and tack small, fragile lids at record-breaking speeds. Every part of the system is designed for precise lid alignment and tacking performance.
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The OAI Model 8000 is an advanced, high-performance mask aligner and exposure tool that delivers ultra precise, front and back side, sub-micron alignment and resolution for the most demanding bulk and surface MEMS applications.
The system is available in manual or fully automated versions, and is capable of performing sub-micron, level-to-level alignment. It's flexible design allows printing on various substrates - round or square - up to 200mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range.
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Dexter's rotating magnetron guns (Z-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Magnet array capable of 2.625 in (67 mm) of linear travel
>Easy target removal without special tooling
>Programmable recipe variables include: rotational speed, phase angle and linear position
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Features:
- Wide Variety of Tip Shapes and Sizes
- Uniform Heating
- Dimensionally Stable
The resistance of the thermode to the flow of electrical current produces the heat required to melt the solder and create the connection. As the electrical energy flows through the thermode, the heat generated is conducted directly to the workpiece. Since most of the electrical current passes through the thermode, there is little chance of electrical damage to the workpiece.
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The Desktop DT-440-PH and DT-450-PH Uni-Turn Systems are part of a line of (semi-) automatic systems developed for Heat-Stack applications. The “PH” stands for the pulsed heat Hot-Bar (alternative Constant Heat can be delivered). The model “440” has a manually operated rotary-table. The model “450” has an automatically operated 2-position turn - table.
The Desktop Series delivers the same high connection quality as the larger and more sophisticated systems. It offers an ideal price – performance (throughput) ratio. The turntable enables easy loading and unloading of the parts, directly in front of the operator. If the parts need to be aligned, it can be done in the front position where the operator or camera have sufficient free space and a view that isn't blocked by the bonding head. The manual model “440” has the same high quality rotary table as the model “450”, but with a user-friendly large handle for the rotary movement. The automatic turn-table is the model with the highest throughput (simultaneous loading / unloading and bonding) and the most controlled process (all parts movements are done automatically). The model “450” combines this with the highest user-friendliness: the operator can load the parts straight in front of him while the bonding operation (in the back side) is taking place.
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Features:
- Many models to choose from
- Manual and automated systems
- Miyachi Unitek Uniflow2 Power Supply
- Manual or pneumatic bonding heads
- Thermo-plane thermodes with Quick Connect Blocks
- Linear slide or rotary motion
- Hot Bar Bonding, Reflow Soldering, and Heat Staking Applications
The Desktop Series are standard table top Hot-Bar Systems using Pulsed Heat Thermode technology for Reflow-Soldering and Heat Seal Bonding.
The DT-250 and DT-260 feature 2 or 3- position manual locking slides, respectively, easy load and unload, 2 handed operation, and sensor-selected parameters.
Miyachi Unitek's Desktop Bonders are also capable of performing heat staking. Heat Staking is an assembly process utilized in many high tech fields; it is also used in the manufacture of a variety of everyday consumer products.
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Machines for electronics production
