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The Desktop DT-250-PH and DT-260-PH Uni-Slide series are part of a line of (semi-) automatic systems developed for Hot-Bar Soldering. The “PH” stands for the pulsed heat hot-bar (alternative Constant Heat can be delivered). The model “250” has a manually operated 2-position slide, whereas the model “260” has a 3-position slide.
The Desktop Series delivers the same high connection quality as the larger and more sophisticated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts need to be aligned, it can be done in the front position where the operator or camera have sufficient free space and a view that isn't blocked by the bonding head. The manually operated slide locks into place, which is detected by a sensor. The sensor confirms the correct bonding position of the part and after activation of the 2-hand control the bonding process is started.
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These manual pick and place systems are designed specifically for low volume and prototyping assembly runs for the second stage of the SMT assembly process - placing components on the board assembly.
Our Gold-place systems offer many unique features and benefits:
1) Its patented hand rest and arm assembly alleviates operator fatigue by supporting the operator's hand and arm throughout the entire assembly process;
2) Its patented, movable ESD safe component trays enhance operator performance, regardless of board size, by allowing trays to be next to the placement area;
3) The Auto-pick feature automatically toggles on and off the vacuum tip during component pick-up and placement. This allows for picking components from tape
feeders without having to press down on the tape.
4) The digitally timed dispenser accurately deposits solder paste, adhesives and various potting compounds, while storing up to 99 memory settings;
5) Our optional Video Display System enhances overall component placement capabilities, including fine pitch devices.
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* Pick & Place system M1-compact contains
* Table support for PCB’s
* Two magnetic placeholders for PCB’s
* Arm support, anti static
* Built in vacuum pump with air switch.
* Vacuum hand pipette
* Two anti static trays, each containing 42 bins with covers.
* Dimensions: 590 x 250 x 70mm
* Max. PCB dimension: 200 x 240mm
* Power: 12VAC 50/60Hz
* Weight: 6,4 kg
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Aerosol Jet printing is an additive manufacturing solution that reduces the overall size of electronic systems by using nanomaterials to produce fine feature circuitry and embedded components without the use of masks or patterns. The resulting functional electronics can have line widths and pattern features as small as 10 microns, and as large as 100 microns or more — successfully bridging the gap between existing screen-printing and thin-film lithography capabilities.
Optomec's Aerosol Jet systems are used in the development and fabrication of next generation microelectronic devices. The system can also be used to repair production defects and legacy electronics, and further has the flexibility to be used for life science and biomedical applications.
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The Shallow Probe model LEXFAB-300 is a turnkey system designed to meet the needs for fully automated semiconductor fab application and currently used for the 90nm, 65nm and 45nm nodes.
The LEXFAB-300:
- gives Elemental Concentration AND Thickness of thin films, layers or ULE implants.
- is designed for Product Wafer analysis (measurement area from 10µm to 100µm) including enhanced Pattern recognition.
- is fully compatible with SMIF 200mm, Open Cassette 200mm and FOUP 300mm standards. SECS/GEM automation.
- meets factory-required host communication protocols. Fully compliant with SEMI standards.
- provides Full Wafer Analysis and Mapping (concentration and thickness uniformity).
- is based on a Non-destructive technique.
- allows a high throughput.
- guarantees a high uptime, reliability and stability, ensuring documented long term tool matching.
- has an easy-to-use User Interface with dedicated recipes.
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The FRT measuring systems series MFE (metrology front end) is
particularly suited to manufacturers of structured wafers, masks,
MEMS and similar products. Because of the very high cleanliness,
process and yield requirements, all tools are especially designed
for use in cleanrooms.
MFE systems measure critical dimensions and overlays on the
one hand and 3D topography or film thickness on the other.
All tools are metrological and comply with the necessary industry
standards such as the SECS II / GEM software interface.
Furthermore, the system is fully automated and equipped
with wafer cassettes and part carriers.
An EFEM and mini-environment for class 1 cleanrooms
rounds off the upper segment of the MFE tool series.
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Corning is a leading, global supplier of optical materials, high performance precision optics, optical-based metrology instruments and technical microlithography solutions for the semiconductor industry. Its core technical expertise includes fused silica and fluoride crystals, materials and processing, optical-based metrology instrumentation and high performance optics through Corning Tropel®.
Recognized world-wide in precision optical subsystems and advanced form metrology instrumentation, Corning Tropel provides rapid, accurate full-form measurement of precision flat and cylindrical surfaces for the semiconductor, data storage, automotive and industrial markets. Custom-designed, high performance precision optic components enable applications for wafer, photomask and inspection equipment suppliers, and are designed for systems from ultra-violet (UV) to near infrared (IR).
Advanced Metrology Research and Testing Exceeds Customer Expectation
Our commitment to semiconductor metrology research and testing is significant and addresses an industry-wide need for precise performance and predictability over the lifetime of materials. Corning’s advanced interferometry equipment enables precision measurements and quality assessments that meet and/or exceed customer requirements for quality products and solutions. Our world-class manufacturing facilities, leading-edge metrology equipment and in-house lens-making capabilities, continues to be known for the exceptional quality, performance and reliability of its precision optics
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Motor Winding Machine
TOM-0150H
TOM-0150H is the new generation motor winding machine. It is capable of direct multi-wire concentrated winding instead of single large wire (over 1.5 mm diameter). A high slot fill is possible due to untwisting the wire during the winding cycle. The newly developed process can achieve higher motor output without changing the stator outer diameter. TOM-0150H achieves lower coil-end by direct winding. The motor can be downsized.
Features :
. Increased Motor output by high slot fill
. Compact and light motor winding possible
. Save material cost
. 11 axis NC-controlled
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BL-1 Wave Shape Coil Winding Machine
Application: suitable for wave shape coil winding for auto generator stator.
Features: apply servo wire winding, step motor wire winding, automatic loading to tooling, automatic shearing and three phases finish in one time.
Main Technical Parameters:
Power Supply Voltage: 220V±10% 50Hz
Air source Pressure: 0.5~0.7Mpa
Wire Winding Diameter: ≤Φ1.7 or 2×Φ1.3
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KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding
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The 626 can be a Wedge bonder (wedge-wedge), Ball bonder (ball-wedge), Peg bonder (for tacking down pre-aligned leads, ribbons and bare or insulated wires) and a Bump bonder (gold stud bumping) without having to remove or replace any electrical or mechanical machine component. Conversion time from Ball bonder to Wedge bonder or vice versa is the same as the time spent replacing a used tool with a new one.
With servomotor control, touch sensor and linear vertical movement, the 626 bond head can move and bond within a 0.750” vertical range without the need to readjust the work stage or bonder platform height. The 626 also has LCD display with parameters in actual units, storage in memory for up to 75 different schedules (or “recipes”) and independent 1st and 2nd bond digital parameter settings. All these features and yet it’s smaller, weighs less and is more cost effective than most other wire bonders.
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The MWS 2300: perfect in every detail. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the modular design of the system, makes the nitrogen wave soldering system MWS 2300 a powerful piece of equipment. It is ideally suited to solder demanding printed circuit boards – even at high throughputs.
The flexible preheating zone configuration with a preheat length between 1800 mm (70.8 inch) and 3300 mm (129.9 inch) makes it possible to suit your specific production requirements. Should your requirements change in the years to come, simply – and without great expense – change the configuration of the soldering machine.
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The pcba|inspector is a high-resolution microfocus X-ray inspection system designed for inspecting solder joints in board assemblies.
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The automation of odd-form component placement is economically justified when a variety of components need to be placed at high production rates. The flexibility of our equipment provides the automation capability of odd-form components even for variable batch sizes and a number of different component shapes to be placed.
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Function
The ALD 01 laser depaneling system is equipped with a rotary table system for optimum separation of the individual processing stages. This method allows parallel processing of the individual tasks. Consequently, the only times relevant for the cycle time, are the time for the longest individual stage plus the time taken for the table to rotate from one position to another.
1. Handover of the panel from the inlet conveyor to the first position on the rotary table
2. Panel routing
3. Loading of individual routed PCBs onto the outlet conveyor
4. Tipping of remaining panel waste into the integrated waste container
The panel is transferred from the inlet conveyor to the first position on the turntable by means of a pneumatic X/Y/Z portal gripper system. The routing process utilizes a CO² Laser.
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Laser Depanelizer for stress free and flexible Cutting of PCB Panels
- Depanelizing with Laser Technology
- Stress- and dust free Process
- Low Process cycles, high throughput
- Simple Fixtures
- Cutting and Marking possible
- Cutting any shapes
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Inline Depanelizing Cell for Separating PCB Panels with Router or Disc Cutting
Scalable System – from semiautomatic to fully automatic system
Routing and disc cutting technology
90° panel rotation for rectangular cuts
Low dust and low stress technology
Low cost fixtures, short setup times
Flexible output modules: Transport conveyor or shuttle system
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Features
Modular design
Turn and transport rates as well as approach positions can be set
Short set-up times
Technical Facts
Handling Time: Approx. 8 sec.
Transport Height: 950mm +/- 25mm
Electrical Connections: Provided by an intelligent line component (e. g. TCIL)
Transport rate: 12 m/min. belt conveyor
Sequence Control System: Provided by an intelligent line component (e. g. TCIL)
Pneumatic Connection: Provided by an intelligent line component (e. g. TCIL)
Width adjustment: 50-400 mm
Dimensions: 600 x 600 x 1,300 mm
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We offer a PCB handling platform providing high quality, reliable solutions for a wide range of handling requirements. These high throughput modules provide transport, product buffering/accumulation, and a full range of handling and routing alternatives.
The range of FlexLink PCB handling modules offers the following features:
- Elimination of shafts and bellows with patented individual stepper ESD belt system
- Easily adjusted belts through unique lead-in and exit tip design.
- High accuracy and reliability on all lifting/sliding assemblies with servo motors
- Entire family is based on only three belt sizes, simplifying spares and maintenance.
- Easy access and maintenance with electrical panels
- All cables enter through the base plates of the modules, eliminating the need for external holes.
All edge belt modules are available with either slide width adjust, hank crank width adjust or programmable width adjust options. All modules can be designed to incorporate either high level flow management software or basic speed control systems.
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IC manufacturing automation
Hirata’s line of semiconductor material handling systems includes:
* Wafer handling systems — loading andunloading between wafer processing equipment.
* Chip handling systems — lead frame loading after wafer cutting, sortation of chips by performance grade, and labeling of chip package after performance grading.
* IC handling systems — bulk packaging of chips into tubes and trays for shipment.
# Process control systems for proper sequencing of processing equipment based onmanufactured product.
# Robots for clean room applications with class 10 or better, including self-contained vacuum pump.
# Assembly and handling systems for LCD and flat panel production.
# LCD glass handling system.
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Function
The unit consists of two loading/unloading conveyors for
magazines, a lifting axle with a magazine platform a transfer
conveyor to the following unit and an electrically driven
pusher. The magazine buffer conveyors are situated parallel
to each other and above each other. The magazines are
transported over a loading conveyor to the magazine platform,
clamped and then processed. The empty magazines are then
transferred over the unloading conveyor and stored until
manual removal.
Special features
Automatic magazine change with clamps
at the top and the bottom
Loading/unloading conveyors parallel to each other and above each other
Minimal floor space required through optimal positioning of the transport conveyors
Manual input of PCBs onto transfer conveyor
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General description
With over 20 years experience in laser marking, CMS is your best choice for fully integrated 4th generation PCB (Printed Circuit Board) laser marking systems.
All of our systems utilize high speed galvo steered lasers to mark any combination of:
- IDM Square matrix codes
- Rectangular matrix codes
- ECC 200 2D matrix codes
- UPS, 2 of 5, 3 of 9, 128 and EAN linear barcodes
- OCR Machine-Readable Text
- Alphanumeric Text with various fonts
- Graphics and logos
Our systems can be stand alone or can be integrated into your already automated production line. Systems can be designed to use automatic stackers, flippers, or any other kind of part handling system. See the PCB Marking system detail page for more features!
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Function
The unit consists of a servo driven X/Y axle, a rotating application head and a conveyor with positioning mechanism to pick up and place the PCBs. The PCB is transferred by the conveyor into the application area. The X/Y axle moves the application head to the printer, a label is taken and then applied to the PCB. After the application process the PCB is released and then transferred to the following unit.
Special features
- PC controlled unit
- User guidance
- Print control possible after printing or after application
- High performance servo drive
- Rotating applicator head
- Printer slides out for easy maintenance
- Barcodes and data-matrix labels
- Programmable Z-axis
- 2 Thermal transfer printers
- ASYS label software for creating labels
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User friendly, desktop size, hight-precision separator specifically for small boards.
Allows accurate, dust free and clean cut processing.
A cutting method using an electric router that places minimal stress on mounted PWBs.
The spindle motor load indicator unit included as standard.
A unique vacuum suction unit to pick up cutting residue.
Compact size that can be easily incorporated into the workplace.
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Function
The ARS 03 is an lnspection system which utilizes the new innovative Adomo inspectlon technology (patent pending) (rom the cornpany MODI. Unlike most inspection systems, the
movement of the camera or the product does not rely on the more traditional axis based technology. Instead, the Adomo technology is based on a stepper motor driven moving mirror. Within lOOms, the mirror deflects the cameras
field of vision from one position to another on the board and with an accuracy of 1 µm. This system makes it possible to take
extremely high resolution pictures in an area of up to 460mm x 460mm.
The process is controlled via a microprocessor which not only enables exact positioning of the mirror but also controls the
camera synchronisation.
Depending on the application, the system can be equipped with cameras with resolutions of 0.5 - 4.0 Megapixels.
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Abundant applications for slit, spot-facing, small-piece process, etc. Shorter set-up time for pin insert and high accuracy by Auto Pin Insert function
QIC function: Bit costs reduction by 30%
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Abundant applications for slit, spot-facing, small-piece process, etc. Shorter set-up time for pin insert and high accuracy by Auto Pin Insert function
QIC function: Bit costs reduction by 30%
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Abundant applications for slit, spot-facing, small-piece process, etc.
Slit routing cost reduction by QIC function for NR
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The 5800 series is a multi-configuration multi-functional test system that is designed to meet the ever changing needs of today's electronic manufacturing environment. An open approach to both hardware and software has been adopted. The open software architecture enables integration with code written using third party software such as Teststand™, Labview™, C#™ and VB.NET™, in short any platform that is .NET compliant.
The open hardware architecture allows configurable chassis and interface styles to accommodate low cost analog in-circuit testing, through to high integrity analog and digital functional test solutions. The integrated 21-slot PXI based backplane enables the user to implement solutions using not only Aeroflex PXI cards but also cards from any PXI card supplier. The 5800 Series of testers comprises three body styles, the 5850, 5830 & 5820.
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ATE QT2256-320PXI system is designed as a Combination Board Tester capable of testing highly complex and dense PCBs employing various test techniques on a single platform.
It can perform Board Level Functional Test through edge connectors of a PCB, and guided probe diagnostics utility to reliably repair Digital/Analog and Mixed Signal PCBs of various complexities for conventional PCBs.
It is an In-Circuit Device / cluster tester when High Current Pin Driver options are installed and interfaced to the UUT either through clips / probes or nail bed. Standard configuration is 64 Channels high current Pin Drivers.
It has in-built 20MHz 12bit Analog Driver / sensors synchronized with digital drivers for covering analog / mixed signal devices.
Integrated Boundary Scan Test controller (Up to 4 Chains) and software package can be used to test today’s PCBs with high density / high pin count devices. Uses latest technology Boundary Scan hardware with RAM based drivers / sensors in synchronization with ATE digital and analog pin drivers.
To effectively test CPU based boards without excluding the CPU from the test, the system offers optional Qmax patented Bus Cycle Signature System.
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Machines for electronics production
