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- Diodes laser
- Laser power: 60, 90 or 120W
- Surface of the focal point 1 x 1.2mm
- Precision of the wire in-feed ± 2,5%
- Diameter of the soldering wire from 0.46 - 1.6mm
- Wire alloy leaded or lead free
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The LSS series of laser stencil cutting machines is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of any stencil size.
The laser stencil cutting machine has a Gerber interface and the data can be automatically transferred to the NC controller. |
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The Laser Dicing System is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications.
The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine including fast quality check (control of kerf width, position and roughness). |
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Sequences/Areas of application:
. Loading of laser with unmachined sheet.
. Sorting of laser-cut parts directly from the laser's change-over table in parallel with machining time.
. Disposal of unused sheet.
. Fully-automated unmanned loading and unloading.
. Compatible with ferromagnetic materials and NE metals.
Components/Equipment:
. 6-axis articulated robot with dynamic and part-specific tool changer.
. Special tools for loading blank materials and disposing of unused sheet.
Integration:
. Seamless integration into existing material flow and information flow environments.
. Existing NC programs do not need to be adapted. PRO-SORT is based on existing programs which it optimises specifically for sorting applications in the background.
. PRO-SORT is able to optimise the sort process with just ONE user interface for robots and lasers!
. Designed as an open system, Laser-Sort-06 can be connected to all standard machine types and manufacturer models (new or old). |
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| The MetaPULSE® System uses patented picosecond ultrasonic laser sonar (PULSE™) technology to provide the industry's first production-worthy opaque film metrology tool. Its small-spot, non-contact, non-destructive technology enables on-product thickness measurements of single or multi-layer opaque films for aluminum and copper processes. In addition to thickness, the MetaPULSE identifies missing layers or interfacial problems such as poor adhesion, and characterizes material properties such as density and roughness. MetaPULSE is used by all of the top ten semiconductor manufacturers, and nearly 200 tools are currently providing production monitoring in fabs around the world. |
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The OAI Model 8000 is an advanced, high-performance mask aligner and exposure tool that delivers ultra precise, front and back side, sub-micron alignment and resolution for the most demanding bulk and surface MEMS applications.
The system is available in manual or fully automated versions, and is capable of performing sub-micron, level-to-level alignment. It's flexible design allows printing on various substrates - round or square - up to 200mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range. |
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Dexter's rotating magnetron guns (Z-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Magnet array capable of 2.625 in (67 mm) of linear travel
>Easy target removal without special tooling
>Programmable recipe variables include: rotational speed, phase angle and linear position |
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By the modular configuration of the system LM 901 all imaginable requests for prototypes and small batches are satisfied.
Depending on the task can the system with the patented Fritsch-pick system be equipped with Tape Feeder, Tube Feeder, hoppers, turning knobs …
Furthermore the system can be used for dispense and rework tasks, too. This is supported by the magnetic breaks in x-, y-, and z-axis.
The versatile applications made the system by far the most sold manual Pick & Place Machine worldwide in best time. |
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The measuring systems series MFE (metrology front end) is
particularly suited to manufacturers of structured wafers, masks,
MEMS and similar products. Because of the very high cleanliness,
process and yield requirements, all tools are especially designed
for use in cleanrooms.
MFE systems measure critical dimensions and overlays on the
one hand and 3D topography or film thickness on the other.
All tools are metrological and comply with the necessary industry
standards such as the SECS II / GEM software interface.
Furthermore, the system is fully automated and equipped
with wafer cassettes and part carriers.
An EFEM and mini-environment for class 1 cleanrooms
rounds off the upper segment of the MFE tool series. |
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The 626 can be a Wedge bonder (wedge-wedge), Ball bonder (ball-wedge), Peg bonder (for tacking down pre-aligned leads, ribbons and bare or insulated wires) and a Bump bonder (gold stud bumping) without having to remove or replace any electrical or mechanical machine component. Conversion time from Ball bonder to Wedge bonder or vice versa is the same as the time spent replacing a used tool with a new one.
With servomotor control, touch sensor and linear vertical movement, the 626 bond head can move and bond within a 0.750” vertical range without the need to readjust the work stage or bonder platform height. The 626 also has LCD display with parameters in actual units, storage in memory for up to 75 different schedules (or “recipes”) and independent 1st and 2nd bond digital parameter settings. All these features and yet it’s smaller, weighs less and is more cost effective than most other wire bonders.
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| The pcba|inspector is a high-resolution microfocus X-ray inspection system designed for inspecting solder joints in board assemblies. |
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We offer a PCB handling platform providing high quality, reliable solutions for a wide range of handling requirements. These high throughput modules provide transport, product buffering/accumulation, and a full range of handling and routing alternatives.
The range of FlexLink PCB handling modules offers the following features:
- Elimination of shafts and bellows with patented individual stepper ESD belt system
- Easily adjusted belts through unique lead-in and exit tip design.
- High accuracy and reliability on all lifting/sliding assemblies with servo motors
- Entire family is based on only three belt sizes, simplifying spares and maintenance.
- Easy access and maintenance with electrical panels
- All cables enter through the base plates of the modules, eliminating the need for external holes.
All edge belt modules are available with either slide width adjust, hank crank width adjust or programmable width adjust options. All modules can be designed to incorporate either high level flow management software or basic speed control systems.
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Specifications
UltraSpeed 6000-LZ
- A new generation of machines
- Consistent precision when drilling long runners due to thermal stability guaranteed by a new cooling system with water
- 5 stations 24" x 28.5" (609 x 724 mm), SINGLE or DUAL
- 6 stations 21" x 28.5" (533 x 724 mm), SINGLE or DUAL
- A range of machines - even more precise and more productive LZ Unit
- Drilling in DUAL mode even more flexible due to the reduced distance between spindles
- Reduced dispersion with spindles guided on air bearings
- Significant gain in productivity and in quality
New Controller Concept
- Integration of the most recent technologies in the control of the linear axes
- Unequalled friendliness of the graphical user interface
- Software developed entirely by Posalux
- Continuity with the well-known user interface
Maintenance
- Reduction of maintenance thanks to the linear motors in X, Y and Z
- Stability of alignment between spindle and clamping system
- Machine software updates available on the Internet
- Increased machine availability |
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Angstrom Sciences magnetrons are recognized as the new standard of the sputtering industry. Because, in addition to the advanced features provided by the Angstrom AdvantageTM, they offer a host of other performance efficiencies as well.
Versatile Design
Their ultra compact design makes them ideal for virtually any new or retrofit application including the most complex multiple-cathode cluster or the smallest vacuum chamber. Low-impedance heads provide RF, DC, mid frequency DC, and pulse DC power capability. All utilities are maintained at atmosphere and are accessed through standard o-ring compression fittings for ease of installation in any vacuum system.
Lower Pressure, Higher Power
All our magnetrons operate at extremely low pressure, in the 10-4 Torr range and can deliver practical power densities in excess of 300 watts per square inch.
High Rates and Performance
That means they can coat a greater area for their cathode size than other magnetrons. So you can maximize both your coating zone and your target utilization without the kind of trade-off in rate that other magnetrons force you to make.
Greater Performance
Yet these same advanced planar magnetrons can give you target utilization as high as 50%. Our magnetrons also deliver much greater uniformity of deposition – routinely in the 3 to 5% range. One of our research customers has even documented uniformity of 0.1% with Angstrom Sciences magnetrons.
Full Range of Sizes
Angstrom Sciences circular magnetrons are available in 1-16 inch target sizes. The linear magnetrons are available in target widths of 1.5 to 12 inches and in target lengths from 1 to 20 feet.
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ERmet : Modular Pressfit Tools: For Male Connectors
ERmet connectors can be end to end mounted in modular layout. To be able to pressfit the selected connector layout for your application in a rationalized way, we have designed the necessary pressfit tools to be modular too. This is true of the tools both for male connectors and for female connectors. The tool bases, also termed anvils, are fixed in a tool holder. Each connector module requires an appropriately sized tool module.
The standard tool holders are designed for two 50 mm modules (modules A, B, L and M), pressfitting a total module length of 100 mm. Due to the modular tool configuration, pressfitting can be carried out in any order. Using filler elements, it is also possible to pressfit just individual modules.
ERmet : Modular Pressfit Tools: For Female Connectors
ERmet connectors can be end to end mounted in modular layout. To be able to pressfit the selected connector layout for your application in a rationalized way, we have designed the necessary pressfit tools to be modular too. This is true of the tools both for male connectors and for female connectors. The tool bases, also termed anvils, are fixed in a tool holder. Each connector module requires an appropriately sized tool module.
The standard tool holders are designed for two 50 mm modules (modules A, B, L and M), pressfitting a total module length of 100 mm. Due to the modular tool configuration, pressfitting can be carried out in any order. Using filler elements, it is also possible to pressfit just individual modules. |
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Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation |
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Detecting manufacturing defects such as positional, missing, skewed, misplaced, incorrect device, incorrect polarity, solder and lead defects is fast and reliable. Unique dual lighting delivers the capability of inspecting laser marking on IC’s and SOT devices. An additional benefit is that it also delivers enhanced inspection of 0603 and 0402 devices.
Developed by DiagnoSYS for operator ease of use, this true AOI software is the most advanced available. Each system utilises the same software for extended ease of use. Comparator software, included, is a perfect solution for inspecting low volume assemblies without the need for programming.
Full manufacturing integration
The ScanPoint DT addresses prototype through to medium volume requirements complementing the ScanPoint 50 in-line system which targets medium to high volume. The family is complete with off-line programming allowing programs to be generated without interfering with production. Programs can be shared across multiple DiagnoSYS AOI systems. Data logging of test results is complimented with a full rework station capability |
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IPTE 's depaneling systems offer a unique combination of cutting tools, material handling and tooling to cut high technology panelized printed circuit board assemblies. They can be utilized in all kinds of production environments and can be seamlessly integrated, for example, in in-line manufacturing environments with automated ingoing and outgoing feeder units, and also be used in stand-alone configuration for manually supplied loading and unloading of boards.
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Machines for electronics production
