Wedge bonders are used in the manufacturing of many microcircuits especially those for RF and microwave applications. Hybond wedge bonders can bond wire and ribbon in materials such as gold, aluminum, copper, silver, palladium and others. For a further look into our wedge bonders we suggest our models 572A, 572A-40, 676 and model 626 multipurpose wire bonder.
Hybond designs, manufactures and sells ultrasonic and thermosonic wire bonders. Products include:
Ball Bonders: for ball bonding and bump bonding of gold wire.
Wedge Bonders: for bonding of gold, aluminum, platinum, copper and other material wires and ribbon (flat wire).
Peg Bonders: Used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine.
performs low-profile (fine pitch) interconnects and is also well suited for running stitch interconnects, reverse bonding, and ribbon bonding. It performs high speed, fine pitch automatic gold and aluminum wedge bonding, and gold ribbon bonding.
Machines for electronics production
