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Glues and conductive paints:
Silver Conductive
Resin
12097
Flexible Silicone
Adhesive RTV 1030
Flexible Silicone
Adhesive/Sealant
RTV 1038
Nickel Paint
4015
Silver Epoxy
584-29
Silicone/Métal
Bi-Component Glue
1029
Coating
4090
Silver Paint
4900
Epoxy Nickel
Filled
GT 4120
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Silicones are ready-to-use one component adhesives that polymerize at ambient humidity. After creation of a « skin » after 30 minutes, polymerisation continues from 24 to 48 hours for joint thickness going from 2 to 4 mm.
There are different chemical bases of silicon, acetic bases and neutral bases (methoxy, alkoxy...). They present good adhesion on ali supports and insure high performance in most applications (mechanical, electronic, electric...). Silicones have excellent resistance to Chemicals, and can be used in extreme conditions (high temperatures, UV).
MS Polymers are one component adhesives without solvents which harden from absorbing humidity. With a faster reaction than with silicones or PU, the reaction continues for 24 hours and until it is set. Non-toxic and without danger for the environment, MS Polymers are ideal substitutes for silicones and PU. |
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Metex Conductive Silicone Adhesive is an RTV silicone, loaded with electrically conductive metallic particles. A variety of conductive filler materials are available to suit a variety of bonding and sealing applications.
Metex Conductive Silicone Adhesive is easy to apply, has an extremely high bond strength, provides superior shielding performance and is available in custom formulations to meet special requirements and applications.
Conductive Silicone Adhesive is available in standard metal tube or cartridge containers of 1.0 fluid oz., 2.5 fluid oz., or 10.3 fluid oz. sizes. Clean surfaces using acetone, MEK, xylene, or isopropyl alcohol. Shelf life of unopened containers is one year from date of shipment, provided that materials are stored dry, below 23°C. |
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Cyanoacrylates are single component “instant curing” solvent free adhesives. They cure upon exposure to moisture at room temperature. These adhesives are fast and easy to use. They do not need any mixing or heat and require only contact pressure to obtain durable high performance bonds. Cyanoacrylates perform best when applied as a thin film between two surfaces.
Master Bond cyanoacrylates are available ethyl, methyl and speciality grades. The different grades vary in viscosity, cure speed, strength, etc. They will bond to almost any combination of dissimilar and similar materials including metals, rubbers, most plastics, glass and ceramics. Primers are available to further enhance cure speed and adhesion to certain hard to bond plastics. Master Bond cyanoacrylates are easily applied both manually and automatically. Rapid cure and easy application make them particularly suitable for high speed production applications. One pound of adhesive properly applied can provide for as many as 30,000 bonds.
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cyanolit®: High speed adhesive for large requirements
cyanolit® cyanacrylate adhesives are 1 part and cure in seconds.
Long time research and development lead to a new generation with considerable advantages.
Bonding:
with high shock and temperature strength
with good humidity resistance
no gase phase
of porous material
of PP and other critical plastics
express bonding of metal, plastics, gum
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one-component cyanoacrylates
cold-curing
cure very rapidly at room temperature under the influence of
moisture
High-strength bonding and fixing within seconds – these are indispensable for production processes which are becoming quicker all the time.
Rapid fixing of a logo cap onto a screwed connection.
Special requirements for the adhesive in this case are its chemical resistance and resistance in rinsing machines.
Properties DELO-CA:
Rapid and high-strength bonding of virtually every material
like metals, plastics, elastomers, foam rubber, ceramics,
textiles etc.
Tailor-made product types for various materials.
Easy handling and non-problematic dispensing ease
processing.
Surface pretreatment by primers DELO-PRE and DELO-QUICK.
Application areas:
Plastic processing
Electronics and electrical engineering |
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Master Bond's electrical and electronic grade epoxies and polyurethanes feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and low dielectric constants and dissipation factors. Because of their unusually low viscosity in combination with excellent mechanical and electrical properties, epoxies and polyurethane make superior potting and encapsulation compounds. Besides electrical insulation, they feature broad electronic compatibility. They are available as both one and two component compositions and are offered in a wide variety of viscosities, cure speeds, hardness, strengths, chemical resistance and flexibilities.
Many of the formulations combine the recognized advantageous performance characteristics of epoxy resins with those of polyurethane. They cure with minimal shrinkage to a durable high strength and tough elastomer with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals, over the exceptionally wide temperature range of -60°F to more than +250°F. Systems have been formulated to adhere well to difficult to bond substrates, others provide high optical clarity.
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Epoxy Resin
Ref: ER2001
Black
Medium viscosity
General purpose
Flame retardant to UL94V-0
Excellent insulation properties
Application: Potting PCBs, coils, transformers, mould casting
Epoxy Resin
Ref: ER2074RP250G
White
Thermally conductive
Flame retardant
No abrasive fillers
Application: Potting PCBs, power supply DC-DC converters, temperature sensors
Epoxy Resin
Ref: ER2183RP250G
Black
Lower Viscosity alternative to ER2074
Enhanced machine mixing and dispensing
Application: ABS, pressure and temperature sensors, power supplies
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Master Bond dual - heat and UV curing compounds are one component systems for high performance coatings, adhesives, sealants, potting and encapsulation. UV and visible light curable compounds cure in a matter of seconds when exposed to a suitable radiation source. Upon cure they exhibit minimal shrinkage. Additionally, they are strong, durable, and offer superior temperature and chemical resistance.
Dual curing formulations have been uniquely provided with a secondary cure mechanism for UV bonding applications encompassing shadowed areas. A problem with UV curing systems arises when three dimensional details on parts being cured create recesses and shadowed areas where the UV radiation from the lamp cannot reach. Under these circumstances a full cure may never be achieved. Master Bond solves this problem by having dual curing mechanism. It provides an almost instantaneous UV cure and/or a 30 minute low temperature heat cure. While the rapid UV cure is desirable to affix the parts on the automated line, the heat cure ensures total polymerization, high strength and long life to meet quality control requirements.
Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our experienced, professional staff. |
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| Kembond SSC-RTV is a single component electrically conductive adhesive comprising of silicone resin filled with conductive silver-plated copper particles. It cures on exposure to air at room temperature to form an electrically conductive flexible silicone elastomer. Once cured it adheres strongly to a wide range of substrates. Can generally be used a replacement for CA811. |
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Master Bond Inc. offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry.
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. The newest innovation is our multi-functional, electrically conductive film, FL901S, which can be used as adhesive, sealant or coating. This silver film is available in a variety of shapes and sizes and offers ease of assembly with minimal waste.
Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our experienced, professional staff. |
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Our comprehensive elecolit® series offers following adhesives:
Thermally conductive, see product overview
electrically conductive, isotropic und anisotropic - see product overview
UV-curing conductive adhesives
Our elecolit® adhesives are ideal for:
Die-Bonding,
powermodul bonding,
Antennaprint and antennacontact
Anisotopic Bonding with der Panacol heat sealing press
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For an electroconductive bonding, you may choose among our large range of adhesives:
- 1 or 2 components
- Epoxy ou polyimide
- Silver or graphite filled
- Curing from 25°C to 150°C
- Viscosities from 1 to 500 Pa.s
- Flexible or rigid
- Adhesives for lead free technology |
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DELO-MONOPOX AC:
one-component, anisotropic electrically conductive adhesives,
heat-curing
DELO-MONOPOX:
one-component, non-conductive, heat-curing, reactive resins
Flip-chip bonding
The adhesive fulfils the task of the underfiller (no-flow underfilling) and of the contacting in one process step Fixing of SMD components
Tailor-made adhesive - DELO-MONOPOX MK096 - for fixing melves and glass SMD components
Properties:
DELO-MONOPOX AC:
enable production in the smart card and smart label industries to be noticeably rationalised by highly automated processes.
E.g., flip-chip technology: chip is set and contacted in one process step
DELO-MONOPOX:
extremely rapid curing
for flip-chip bonding and as Die Attach
Fixing of SMD components
Chip encapsulation compounds for the automotive sector and high-quality industrial products
Application areas:
Assembly
Smart card / Smart label
Micro-electronics
Automotive electronics |
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Master Bond offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry. Other applications range from the construction of disc drives to die attach and flip-chip processes.
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. There is also an increasing demand for electrically conductive sealants. Master Bond offers both two and one part conductive sealants. The two part systems are primarily epoxies. The one part types are heat cured epoxies and room temperature curing acrylics and elastomers. |
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UV curable Adhesives, UV curable conformal coatings and UV curable encapsulants for electronic materials assembly cure upon exposure to ultraviolet light in seconds. DYMAX solvent-free UV curable adhesives, conformal coatings and encapsulants are ideal for circuit board assembly, flex circuit encapsulation, peelable and water soluble masking, tamper-proofing, potting and strain relief. IPC MIL Spec and UL approved and multiple viscosity grades of these adhesives, conformal coatings, masks and encapsulants are available.
DYMAX UV curable conformal coatings can be applied over the entire PCB surface or discreet areas to provide complete protection from harsh environments or solvents. UV curable Encapsulants protect components on rigid or flexible boards to -40°C. UV curable peelable and water soluble masks are easy to apply and remove, and are designed for manual or fully automated masking of printed circuit boards prior to wave solder or reflow operations. One-part and two-part potting compounds can achieve full cure in seconds and dramatically reduce cycle times and costs. DYMAX UV curable thermally conductive adhesives transfer more heat and bond faster than competitive products. |
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Master Bond is a leading manufacturer of high performance epoxy adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Epoxies are our most versatile group of thermosetting polymers and can be two component room temperature curing or one part heat and/or UV curing compositions. They feature high physical strengths, superior resistance to chemical and/or environmental damage and excellent dimensional stability; are widely employed for structural adhesive applications and as electrical insulation materials. Special formulations are available which feature high electrical and/or thermal conductivity as well as wide service temperature ranges.
Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our experienced, professional staff. We will assess your problem and work with you throughout the design, prototype and manufacturing process. Master Bond products are manufactured under strict quality control standards at its plant in Hackensack, New Jersey, U.S.A.
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Our structalit® products are 1 and 2 parts with high strength for universal use.
Structalit® our product range of „easy to handle“ adhesives ...
Structalit® unfilled Epoxy-adhesives for multiple applications.
Advantages from our product series structalit® 5800 are:
easy
fast
inexpensive ...
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Using structural adhesives for assembly guarantees the joint once it is under important mechanical pressure during its lifespan in its working environment. A structural jointing or « cold welding » can substitute traditional techniques like welding, screwing, riveting, or stamping...
There are 3 types:
- Acrylic or Méthacrylate
- Epoxyde
- Polyurethane |
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two-component epoxies
cold-curing
DELO-DUOPOX adhesives, casting resins and fillers excel by their extremely high reliability, especially with very large components those which are sensitive to temperature.
Bonding balustrade elements
for external and internal areas.
Adhesive is applied between two distance rings (spacers). Casting of electronic parts inside a safety sensor
top: casted,
bottom: uncasted
Properties DELO-DUOPOX adhesives, casting resins and fillers:
good resistance to chemicals and heat
tension-equalising
specific products with outstanding thermal conductivity
Easy handling of the DUOPOX products: by using the double chamber cartridge system DELO-AUTOMIX two-component products can be very easily processed with the help of dispensing guns.
Application areas:
Mechanical engineering and construction
Electronics
Metal processing
Automotive engineering industry |
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| EPO-ADRTM series is a medium viscosity, epoxy based adhesives that are designed for fibre composite adhesion. Three hardeners are available for use with EPO-ADRTM series. These systems give good peel strength for adherent composites. The EPO-ADRTM series systems will cure completely at room temperature, or can be given an elevated temperature cure. |
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Araldite ® Industry specific portfolio
Central to Huntsman's specific business philosophy is the delivery of custom adhesive solutions for specific markets. To this end we have developed several unique ranges of industrial adhesives which match the challenging requirements of various industry sectors. |
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Bonding, Adhesives
