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ERmet ZD connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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ERmet ZD connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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The high-speed SMT connector Microspeed with the pitch 1.0mm is especially designed for modern board-to-board applications in telecom and datacom equipments with data rates up to 10 GBit/s. MicroSpeed features differential signal transmission with a impedance of 100 Ohm or single ended signal transmission with a impedance of 50 Ohm. Two different signal contact arrangements are possible. For improved crosstalk parallel signal ports are recommended. A excellent signal integrity is achieved by a design with 2 signal and 2 shield contact rows. The termination area of the shield contacts is available in 2 options: SMT or THR (Thru Hole Reflow).
For fully automatic SMT assembly the connector features:
- Tape and reel packaging
- Black high-temperature insulator for fast and reliable visual recognition.
- Integral pick and place surface for easy grip with a vacuum pipette
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BASICS+
Basics+ brings together our proven, standard connectors for board-to-board and wire/cable-to-board applications. Our goal is to save you time by providing “Easy To Use” services. All services are accessible via the dedicated Basics+ web site : www.fciconnect.com/basics
EASY TO SELECT A PRODUCT
This catalogue provides an easy overview of the most standard Basics+ products. For even more choice, our web catalogue provides the step search possibility that guides you step-by-step to your part number
EASY TO GET DOCUMENTATION
Data sheets, product drawings, specifications, application notes, packaging drawings and more are available on the web site for download.
EASY TO GET TECHNICAL SUPPORT
Get your technical questions answered within 24 hours on our e-mail hotline basics.help@fciconnect.com
EASY TO GET SAMPLES
Order a sample today, and you can start to work with your Basics+ product right away! Sample orders can be placed via the web site.
EASY TO GET COMMERCIAL INFORMATION
As a customer, you can have registered online access to prices, packaging quantities, minimum order quantities, and lead times. All the commercial information you need is at your fingertips.
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Available in 4 through 32 circuits Insulator material : glass filled nylon 6-T UL 94V-0 contact material: dual contact in phosphor bronze Tin –lead plated contact with kink tail . Low insertion force .Accommodated 0.30mm FFC /FPC thickness
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Tyco Electronics' HXC125 Board-to-Board Connectors offer a high performance, high density interconnect for today's design challenges.
Connectors are available in 1mm to 4mm heights, with centerline spacing as low as 1mm. This solderless, compression system allows for ease of assembly while offering excellent power management capability. Standard 1.0 mm contacts are rated to 4 Amps each.
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Winchester Electronics offers a comprehensive line of pre-assembled press-fit Edgecard connectors for backplane applications that features Winchester's proven, reliable, and industry leading C-Press compliant pin technology.
Winchester Electronics Edgecard product line is available in a variety of contact centerline spacings, contact pair position sizes, and contact tail lengths. Additional options include bifurcated or non-bifurcated contacts, standard or high scoop insulators, .415-, .350-, or .300- inch card slot depths, and closed-ended or open-single-ended connectors.
All Edgecard connectors are designed to be seated into .093 inch minimum thick backplanes and to mate to double-sided PCBs ranging in thickness between .054 - .071 inch.
- "A" Grid, NK & NJ Series, .100 X .100 inch
- "B" Grid, 276 Series, .125 X .125 inch (Early/Late Make and Shorting Contacts)
- "C" Grid, MK, NK, MJ, & NJ Series, .100 X .200 inch
- "D" Grid, MK, NK, MJ, & NJ Series, .125 X .250 inch
- "E" Grid, MK, NK, MJ, & NJ Series, .156 X .200 inch
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When space is at a premium, our board-to-board connectors are the perfect solutions. Proven reliability combined with design flexibility provide effective results for even the most demanding SMT and thru-hole applications.
Featured with :
- available in .050" (1.27mm), .079" (2mm), and .100"(2.54mm) pitch
- high density, low-profile interconnects
- high quality screw-machined terminals offer reliable electrical/mechanical interconnects
- wide variety of terminals and plating options
- mezzanine board applications
- unique solder preforms allow multi-tier Z-axis expansion
- RoHS Compliant insulators with either Gold/Gold or Matte Tin/Gold terminal plating are compatible with lead-free processing
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F4 - The smallest pitch (0.4mm) and lowest mating height (0.9mm) available
This series for board to fpc board connection has a pitch of only 0.4mm and a height of 0.9mm. Despite its small size, the connector includes spring-elastic contacts and a locking mechanism.
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Board to board connectors from GCT are of high quality and very competitive prices, with connector pitches ranges from 0.5mm, 0.8mm, 1.00mm, 1.27mm, 2.00mm to 2.54mm (0.019", 0.031", 0.050", 0.079" to 0.100" centerline), of single, double, triple or quadruple rows, with vertical (straight) or horizontal (right-angle) orientations in surface mount or through-hole(DIP) lead style. All the board to board connectors can be custom made based on specific customers design requirements, to achieve different stacking heights, from as low as 3mm, to more than 60mm, as well as different PCB orientations (right-angle, planar, and stacked). All posts & tails pin lengths, insulator or profile heights, contact plating (gold flash, tin, gold or selective gold plating from 1u" to 30u" thickness), locating pegs or polarization keys, contact terminals types (tuning fork, dual beam folded, triple beam folded or 4-side closed spring contacts), insulator materials of UL94V-0 thermoplastics (Nylon 6T, LCP, or PBT), suitable for high temperature reflow or wave soldering and are RoHS compliant, different entry types (top entry or dual entry sockets), voided pins or contacts for increasing pin pitch, can all be built and customized based on customers requirements.
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