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ANSYS ICEM CFD CAD & STL repair
Post-Processing
A state of the art post- processing and visualization module, ICEM CFD Visual3, provides the CFD professional with easy-to-use powerful result visualization features for structured, unstructured, and hybrid grids. ICEM CFD Visual3 provides an in depth view of data with visualization tools such as cutting planes, contouring, iso-surfaces, streamlines, line plots, data probes and animation. Features such as a CFD function professional calculator and an intuitive based user interface make ICEM CFD Visual3 a powerful interpretation tool of computed results. The ANSYS ICEM CFD Visual3 is a flexible and customizable post-processor that professional interfaces with all the major CFD/CAE solvers.
ICEM CFD Visual3 provides an integrated environment for CAD Geometry, ICEM CFD computational grids, and the flow solution.
ICEM CFD Visual 3 can read files written in the following formats; CGNS, AVS, CFD+ , CFX, DAMAS, Ensight, Fensap, Fieldview, Fluent, Hawk, ICAT, NetCDF, NS3D, Plot3D, STAR-CD, Tecplot, AcuSolve and TDM. Most solvers can output in at least one of these formats, so these actually cover many solvers.
It can also be used to map CFD results on to FEA mesh which can then be exported to FEA solvers such as ANSYS, ABAQUS, NASTRAN, LSDYNA or AUTODYN. |
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Process Improvement (BPI)
Business Process Improvement (BPI) is a systematic approach to help organizations change the way it does business or literally transform their business from top to bottom. Organizations looking to improve their processes to impact their bottom line answer several questions:
Who are we? What do we do? Why do we do it?
Who are our customers?
How do we do our jobs better?
Lanner offers comprehensive support for business process improvement. From analysis of the current process structure right through to the implementation of improvements, our technology and services solutions will guide you every step of the way. In addition, Lanner specializes in assessing e-business change through accurate modeling to ensure new planned processes will work. Some of our most successful BPI solutions are:
Productivity Improvement
People and Transportation Flow
Supply Chain and Logistics
Maintenance Planning
Resource Planning
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Problems involving any combination of conduction, convection,
and radiation are solved easily with the Heat Transfer Module.
It finds extensive use in systems that involve the
generation and flow of heat in any form.
A variety of specialized modeling interfaces
are available for different formulations
and applications such as
surface-to-surface radiation,
nonisothermal flow, heat transfer
in structures made of thin layers
and shells, and heat transfer in
biological tissue.
The Heat Transfer Module allows for arbitrary couplings to other application modes in COMSOL Multiphysics and its modules for multiphysics modeling. This is particularly relevant to applications such as thermal management in the electronics industry, thermal processing and manufacturing, and medical technology and bioengineering.
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DEFORM™-HT is a powerful stand-alone finite element modeling system for simulating heat treatment processes. The system predicts thermal, mechanical and metallurgical responses of parts during heat treatment. Heat treat distortion, quench cracking and residual stresses can be predicted. The system can also provide information on phase transformation and phase volume fraction.
A variety of materials ranging from carbon steel and aluminum to titanium and nickel
based alloys can be modeled. Typical heat treatment processes include:
- normalizing
- austenizing
- carburizing
- solution treatments
- quenching
- tempering
- aging
- stress relieving |
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| With the integrated capture, simulation and layout environment of the National Instruments Circuit Design Suite, engineers have a complete PCB design and validation environment. With the integration with NI LabVIEW, measurements can be easily introduced into the design flow, with simulation results improved with real-world data (a concept called virtual prototyping), and the transfer of simulation data to the test environment to compare real vs. theoretical. |
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