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SI - Side Interface Board-To-Backplane Connector Overview
In years past, low frequency transmissions could absorb the difference between the connector parameters and the PCB. As data transfers and rise times push into the gigabit range, signal ringing, jitter and edge rate profiles break down the signal quality to unacceptable levels. Side Interface refers to a revolutionary PCB technology. SI allows the inner layers to exit through the actual side of the PCB (represented by the thickness dimension). This provides a flat mating surface for the HXC125 contact. The advantage of this technology is that you keep the signal within the PCB for greater period of time. By staying within the "Controlled Impedance Environment" longer, there is less disturbance to the signal. This short interconnect distance eliminates the large electrical interruption one would see in traditional two piece connectors.
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Series 243 Card Edge Connector
* .200" (5.08mm) Contact Spacing x .200" (5.08mm)
* Accepts .062" (1.57mm) Nominal Thickness PC Board
Series 301 Card Edge Connector
* EISA or ISA (IBM XT/AT) Daughter Boards
* .050" (1.27mm) Contact Spacing 4 Rows 2.54mm Spacing
* Accepts .062" (1.57mm) Nominal Thickness PC Board
Series 302 Card Edge Connector
* Accommodates MCA Daughter Boards
* .050" (1.27mm) Contact Spacing 4 Rows 2.54mm Spacing
* Accepts .062" (1.57mm) Nominal Thickness PC Boards
Series 303 Card Edge Connector
* UL Recognized .156" (3.96mm)
* Contact Spacing x .140" (3.56mm)
* Accepts .062" (1.57mm) Nominal Thickness PC Board
Series 305/315/355 Card Edge Connector
* 305/355 Series CSA Approved and UL Recognized
* 315 Series UL Recognized
* .156" (3.96mm) Contact Spacing x .140" (3.56mm)
* Accepts .062" (1.57mm) Nominal Thickness PC Board
Series 333 Card Edge Connector
* .156" (3.96mm) Contact Spacing x .200" (5.08mm)
* Accepts .062" (1.57mm) Nominal Thickness PC Board
Series 345/395 Card Edge Connector
* CSA Approved and UL Recognized
* .100" (2.54mm) Contact Spacing x 5.08mm
* Accepts .062" (1.57mm) Nominal Thickness PC Board
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The DIN 41612/IEC 60603-2 connector line from ERNI includes standard connectors and customer-specific connector technology solutions. The standard and inverted connectors for printed circuits correspond to national and international standards. All connectors have the same installation requirements, regardless of differing application characteristics. This connector line includes modules with a high contact density for low voltages; and modules with a low contact density for high voltages. In addition to the standard types, ERNI offers a wide variety of versions and connection technologies that provide users with economical solutions.
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The Tyco Electronics’ LIGHTPLANE Connector is a multi-position fiber optic backplane connector that permits blind mating of singlemode or multimode optical fibers from a daughtercard to a system backplane or motherboard. Now you can simultaneously make both the optical and electronic interconnections when installing the daughtercard. The LIGHTPLANE connector contains up to 8 fiber
positions utilizing the standard SC interface.
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Winchester Electronics' High Density Plus® (HD+) product line is an all-inclusive backplane connector system consisting of signal, power, guide, and polarization modules. All backplane connector modules are sold individually, while daughtercard modules are mounted onto an extruded aluminum stiffener and sold as "stiffener assemblies." The ability to stack a variety of modules next to one another allows OEM designers to create custom connector configurations using standard off-the-shelf components.
Contact centerline spacing for HD+ signal modules is a .100 x .100 inch grid. Backplane pin connectors contain robust .025 square inch pins, which are less likely to be damaged during assembly, handling, and mating than many of today's higher density backplane connector systems. Backplane pin connectors are available in solder tail or with Winchester's proven, reliable, and industry leading C-Press® compliant pin technology.
Signal modules are available as 3- or 4-row modules with either 15 or 20 positions per row. For applications that require improved electrical performance, signal modules can also be supplied with 1 or 2 additional contact rows that help to:
- Minimize reflections due to impedance mismatches.
- Reduce cross talk between adjacent signal contacts.
- Minimize inductance of contacts used for power and ground.
- Integrate power distribution into the backplane.
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Backplanes BS2xx
* 1 .. 16 module slots
* Seamless connection possible
* Vibration proof fixing of modules
* Snappable on backplane
* Stabile mechanical design
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I-Trac™ Backplane Connector System
Minimize cross talk, achieve superior impedance control and high-bandwidth backplane connections with Molex's I-Trac System
The I-Trac™ Backplane Connector System features a broadside-coupled, skew-equalized design that handles speeds up to 12.5+ Gbps. It offers multiple benefits over other backplane products, including superior impedance control, lower cross-talk and higher overall bandwidth. With its unique open pin-field design, the I-Trac System gives customers the flexibility to assign high-speed differential pairs, low-speed signals, power and ground contacts anywhere within the pin-field.
As a press-fit, mono-block system that can be stacked end-to-end to meet customer pin-count requirements, the I-Trac System features a flexible design for any configuration. It is well-suited for standard and orthogonal architectures in server, storage, telecommunications and data networking applications. It utilizes the same part numbers for both standard and orthogonal architectures by providing the option to rotate the headers 90 degrees on one side of the mid-plane. This eliminates the need for customers to purchase unique, expensive components normally required with competitive orthogonal products.
The I-Trac System supports quad trace routing, which reduces PCB layer count and the associated cost. Mid-plane PCB layers can be reduced even further by leveraging the orthogonal capabilities of the I-Trac™ System. In an orthogonal architecture, the I-Trac™ System completely eliminates the need for PCB traces through the use of shared vias.
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Backplane Design
* On-site design reviews with your Engineers
* Full custom backplanes
* Modified Standard backplanes
* Cost-saving re-designs
* Design simulation and validation
* SPICE and HSPICE modelling
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ERNI Systems is one of the leading companies for turnkey manufacturing of customized backplanes, cPCI / VME standard backplanes and sub-rack integration.
Production facilities in America, Asia and Europe enable us to offer global sourcing for international customers.
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Customization is the standard at ELMA. With an extensive offering of modular products as a foundation, ELMA is able to leverage existing solutions and proven design concepts to meet any custom application. This approach insures that ELMA will provide quality, compliant solutions with reduced lead time, cost and risk.
Custom solutions for:
AdvancedTCA
MicroTCA
CompactPCI / CPCI
PICMG 2.16, Gigabit Ethernet
PXI
VXI
VME/VME64x
VITA 31.1, Gigabit Ethernet over VME64x
VITA 46, VPX
VITA 41, VXS
Services:
Custom design
Manufacturing
Characterization & measurements
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The BackPack plugs into the rear of the Cage and connects the PC Blades to the User Ports and the network. BackPacks, in conjunction with ClearCube software, enable PC Blade sparing and IT administrative control.
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