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Master Bond offers electrically conductive silicone adhesives as well as a number of specialty type systems including one part conformal coatings, special fast curing systems, higher temperature resistant specialty systems, thermal conductive systems as well as transparent silicones.
Master Bond MasterSil 155S is a two component electrically conductive silicone compound for high performance bonding and sealing. The specifically modified silver filled silicone resin after the addition of a liquid curing agent cures at ambient or more quickly at elevated temperatures to a tough, flexible, electrically conductive silicone rubber. The tightly controlled viscosity of this silicone elastomer formulation produces a smooth paste which assures complete fill-in around complicated contours in even very complex configurations and provides excellent electrical conductivity as well as superior resistance to vibration and shock after cure. It has been widely accepted for bonding and/or sealing of electronic components, electrical devices and various electro-optical systems as well for special electronic circuitry or wherever a tough, elastic electrically conductive adhesive, sealant or gasket offering superior protection against adverse environmental conditions is required. MasterSil 155S has a service temperature range of -85°F to +400°F.
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Silicones are ready-to-use one component adhesives that polymerize at ambient humidity. After creation of a « skin » after 30 minutes, polymerisation continues from 24 to 48 hours for joint thickness going from 2 to 4 mm.
There are different chemical bases of silicon, acetic bases and neutral bases (methoxy, alkoxy...). They present good adhesion on ali supports and insure high performance in most applications (mechanical, electronic, electric...). Silicones have excellent resistance to Chemicals, and can be used in extreme conditions (high temperatures, UV).
MS Polymers are one component adhesives without solvents which harden from absorbing humidity. With a faster reaction than with silicones or PU, the reaction continues for 24 hours and until it is set. Non-toxic and without danger for the environment, MS Polymers are ideal substitutes for silicones and PU.
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Metex Conductive Silicone Adhesive is an RTV silicone, loaded with electrically conductive metallic particles. A variety of conductive filler materials are available to suit a variety of bonding and sealing applications.
Metex Conductive Silicone Adhesive is easy to apply, has an extremely high bond strength, provides superior shielding performance and is available in custom formulations to meet special requirements and applications.
Conductive Silicone Adhesive is available in standard metal tube or cartridge containers of 1.0 fluid oz., 2.5 fluid oz., or 10.3 fluid oz. sizes. Clean surfaces using acetone, MEK, xylene, or isopropyl alcohol. Shelf life of unopened containers is one year from date of shipment, provided that materials are stored dry, below 23°C.
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Many of our Thermal Interface Materials are available in liquid form. Companies often choose automated dispensing for improved throughput, consistency and improved quality. The Bergquist Company and Liquid Control Corporation (LCC) have formed an alliance to serve the growing market need for system solutions in automated liquid dispensing applications. Please contact a Bergquist representative for more information regarding automated liquid dispensing.
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Kembond SSC-RTV is a single component electrically conductive adhesive comprising of silicone resin filled with conductive silver-plated copper particles. It cures on exposure to air at room temperature to form an electrically conductive flexible silicone elastomer. Once cured it adheres strongly to a wide range of substrates. Can generally be used a replacement for CA811.
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Master Bond Inc. offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry.
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. The newest innovation is our multi-functional, electrically conductive film, FL901S, which can be used as adhesive, sealant or coating. This silver film is available in a variety of shapes and sizes and offers ease of assembly with minimal waste.
Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our experienced, professional staff.
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Our comprehensive elecolit® series offers following adhesives:
Thermally conductive, see product overview
electrically conductive, isotropic und anisotropic - see product overview
UV-curing conductive adhesives
Our elecolit® adhesives are ideal for:
Die-Bonding,
powermodul bonding,
Antennaprint and antennacontact
Anisotopic Bonding with der Panacol heat sealing press
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These conductive resins consist of conductive fillers - silver, copper, nickel and other metals plus carbon - and synthetic resin. We offer three convenient forms of products: adhesive, paste and coating material to fit any specific application. Unlike solder, this material firmly bonds plastic, rubber and ceramics. Therefore, it has a wide variety of uses for example bonding lead wires, electrodes, semiconductor elements, EMI parts, jumper wire, manufacturing and repairing printed circuits, through holes and other electronic parts that require conductivity. Coupled with anisotropic conductive adhesives that easily bond high density, multi-terminal circuits, the Three Bond 3300 series will surely meet the demands for smaller and higher density electronic parts.
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Master Bond offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry. Other applications range from the construction of disc drives to die attach and flip-chip processes.
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. There is also an increasing demand for electrically conductive sealants. Master Bond offers both two and one part conductive sealants. The two part systems are primarily epoxies. The one part types are heat cured epoxies and room temperature curing acrylics and elastomers.
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Master Bond offers a broad line of thermally conductive epoxies, silicones and rubber based compounds widely used for bonding, potting and encapsulating. Featuring excellent thermal conductivity along with good physical strength and/or ease manufacturability, these compounds are available in hundreds of grades to meet your specific requirement. These vary from high strength, general purpose adhesives, sealants and coatings systems to highly specific “tweaked” applications. Uses include heat sinks, thermistors, chip bonding and underfill applications.
Controlled characteristics include toughened system with high peel and shear strength, resistance to vibration and mechanical shock, enhanced chemical resistance and good thermal cycling properties. They are also available for use in high temperature, deep vacuum, thermal cycling and other challenging applications.
Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our professional staff. They have years of experience, and will assess your problem and work with you throughout the design, prototype and manufacturing process. Master Bond products are manufactured under strict quality control standards at its plant in Hackensack, New Jersey, U.S.A.
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DELO-MONOPOX AC:
one-component, anisotropic electrically conductive adhesives,
heat-curing
DELO-MONOPOX:
one-component, non-conductive, heat-curing, reactive resins
Flip-chip bonding
The adhesive fulfils the task of the underfiller (no-flow underfilling) and of the contacting in one process step Fixing of SMD components
Tailor-made adhesive - DELO-MONOPOX MK096 - for fixing melves and glass SMD components
Properties:
DELO-MONOPOX AC:
enable production in the smart card and smart label industries to be noticeably rationalised by highly automated processes.
E.g., flip-chip technology: chip is set and contacted in one process step
DELO-MONOPOX:
extremely rapid curing
for flip-chip bonding and as Die Attach
Fixing of SMD components
Chip encapsulation compounds for the automotive sector and high-quality industrial products
Application areas:
Assembly
Smart card / Smart label
Micro-electronics
Automotive electronics
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CHO-BOND® Adhesives
CHO-BOND® adhesives are electrically conductive epoxy and silicone resins that cure at room temperature, elevated temperature or in humidity. CHO-BOND epoxies are two-part, silver-filled or silver-plated-copper-filled adhesives which cure at room or elevated temperatures into rigid structural bonds for attaching EMI vents, windows, mesh gaskets, or for filling cracks and seams. CHO-BOND conductive silicones contain silver-plated-copper. Their flexible nature in cured form is ideal for bonding conductive silicone gaskets in place.
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DYMAX Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.
Dymax thermal interface materials offer thermal conductivity levels as high as 1.2 W/m*K. They are high viscosity and highly thixotropic for optimal dispensing and material placement.
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Our comprehensive elecolit® series offers following adhesives:
Thermally conductive, see product overview
electrically conductive, isotropic und anisotropic - see product overview
UV-curing conductive adhesives
Our elecolit® adhesives are ideal for:
Die-Bonding,
powermodul bonding,
Antennaprint and antennacontact
Anisotopic Bonding with der Panacol heat sealing press
Auch im Vergleich zu anderen Verfahren:
Gleichzeitige Ableitung der hohen Wärmeenergie und Fixierung/Befestigung
im Gegensatz zu Pasten
solvent free
Rapid curing
High Ionen purity
1 component, easy handling
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Glues and conductive paints:
Silver Conductive
Resin
12097
Flexible Silicone
Adhesive RTV 1030
Flexible Silicone
Adhesive/Sealant
RTV 1038
Nickel Paint
4015
Silver Epoxy
584-29
Silicone/Métal
Bi-Component Glue
1029
Coating
4090
Silver Paint
4900
Epoxy Nickel
Filled
GT 4120
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The products in the ThreeBond 3300 series are conductive adhesives, each made up of a synthetic resin and a conductive filler containing metal such as silver, nickel, or carbon. They offer strong bonding to plastic, rubber, or ceramic, and can easily be used on assemblies that require soldering. They are widely used in producing printed circuits, bonding wire leads to electrodes, and bonding semiconductor elements and EMI parts. The series also includes anisotropically conductive adhesives that offer strong jointing of high-density multiterminal circuits such as LCDs, to meet requirements for smaller, denser, higher-precision electronic parts. The series includes liquids and tapes.
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| ... products without technical information |
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Kembond SSC-RTV is a single component electrically conductive adhesive comprising of silicone resin filled with conductive silver-plated copper particles. It cures on exposure to air at room temperature to form an electrically conductive flexible silicone elastomer. Once cured it adheres strongly to a wide range of substrates. Can generally be used a replacement for CA811.
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|
|
|
Master Bond Inc. offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry.
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. The newest innovation is our multi-functional, electrically conductive film, FL901S, which can be used as adhesive, sealant or coating. This silver film is available in a variety of shapes and sizes and offers ease of assembly with minimal waste.
Master Bond invites you to take advantage of our “one on one" support policy offering prompt technical assistance from our experienced, professional staff.
|
|
Our comprehensive elecolit® series offers following adhesives:
Thermally conductive, see product overview
electrically conductive, isotropic und anisotropic - see product overview
UV-curing conductive adhesives
Our elecolit® adhesives are ideal for:
Die-Bonding,
powermodul bonding,
Antennaprint and antennacontact
Anisotopic Bonding with der Panacol heat sealing press
|
|
|
These conductive resins consist of conductive fillers - silver, copper, nickel and other metals plus carbon - and synthetic resin. We offer three convenient forms of products: adhesive, paste and coating material to fit any specific application. Unlike solder, this material firmly bonds plastic, rubber and ceramics. Therefore, it has a wide variety of uses for example bonding lead wires, electrodes, semiconductor elements, EMI parts, jumper wire, manufacturing and repairing printed circuits, through holes and other electronic parts that require conductivity. Coupled with anisotropic conductive adhesives that easily bond high density, multi-terminal circuits, the Three Bond 3300 series will surely meet the demands for smaller and higher density electronic parts.
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|
Master Bond offers a broad line of electrically conductive adhesives, sealants and coatings which are widely used in the electronic and electrical industries. They are formulated with metal powders and flakes such as silver, nickel, copper and silver-coated nickel, with silver formulations exhibiting the highest levels of electrical conductivity. Graphite filled formulations have also been developed for use where metal additives are not desirable. Master Bond offers a number of room temperature curing and low elevated temperature curing, electrically conductive systems for applications where heat sensitive components must be bonded to circuit boards and other assemblies or for repair of circuitry. Other applications range from the construction of disc drives to die attach and flip-chip processes.
Also available are electrically conductive coatings which are widely employed for EMI/RFI shielding of plastic molded parts to prevent undesirable electrical interference. There is also an increasing demand for electrically conductive sealants. Master Bond offers both two and one part conductive sealants. The two part systems are primarily epoxies. The one part types are heat cured epoxies and room temperature curing acrylics and elastomers.
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|
DELO-MONOPOX AC:
one-component, anisotropic electrically conductive adhesives,
heat-curing
DELO-MONOPOX:
one-component, non-conductive, heat-curing, reactive resins
Flip-chip bonding
The adhesive fulfils the task of the underfiller (no-flow underfilling) and of the contacting in one process step Fixing of SMD components
Tailor-made adhesive - DELO-MONOPOX MK096 - for fixing melves and glass SMD components
Properties:
DELO-MONOPOX AC:
enable production in the smart card and smart label industries to be noticeably rationalised by highly automated processes.
E.g., flip-chip technology: chip is set and contacted in one process step
DELO-MONOPOX:
extremely rapid curing
for flip-chip bonding and as Die Attach
Fixing of SMD components
Chip encapsulation compounds for the automotive sector and high-quality industrial products
Application areas:
Assembly
Smart card / Smart label
Micro-electronics
Automotive electronics
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CHO-BOND® Adhesives
CHO-BOND® adhesives are electrically conductive epoxy and silicone resins that cure at room temperature, elevated temperature or in humidity. CHO-BOND epoxies are two-part, silver-filled or silver-plated-copper-filled adhesives which cure at room or elevated temperatures into rigid structural bonds for attaching EMI vents, windows, mesh gaskets, or for filling cracks and seams. CHO-BOND conductive silicones contain silver-plated-copper. Their flexible nature in cured form is ideal for bonding conductive silicone gaskets in place.
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Glues and conductive paints:
Silver Conductive
Resin
12097
Flexible Silicone
Adhesive RTV 1030
Flexible Silicone
Adhesive/Sealant
RTV 1038
Nickel Paint
4015
Silver Epoxy
584-29
Silicone/Métal
Bi-Component Glue
1029
Coating
4090
Silver Paint
4900
Epoxy Nickel
Filled
GT 4120
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The products in the ThreeBond 3300 series are conductive adhesives, each made up of a synthetic resin and a conductive filler containing metal such as silver, nickel, or carbon. They offer strong bonding to plastic, rubber, or ceramic, and can easily be used on assemblies that require soldering. They are widely used in producing printed circuits, bonding wire leads to electrodes, and bonding semiconductor elements and EMI parts. The series also includes anisotropically conductive adhesives that offer strong jointing of high-density multiterminal circuits such as LCDs, to meet requirements for smaller, denser, higher-precision electronic parts. The series includes liquids and tapes.
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| ... products without technical information |
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