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epoxy resin / encapsulation / thermal cycling
epoxy resin
EP17HT

... is a heat cured epoxy system used for bonding, sealing, coating and encapsulating applications. This tool features complete reactiveness and it does not contain solvents or diluents. It is equipped with a specialized ...

epoxy resin / for sealing / for the food industry / encapsulation
epoxy resin
EP42HT-2FG

The Master Bond's EP42HT-2FG is an epoxy system that is good for sealing, coating and casting and is made for food operation. It has met the requirements of the FDA CFR 175.300 as it has been tested by the laboratories. ...

bonding resin / epoxy / encapsulation / for sealing
bonding resin

Master Bond EP17HT-100 is a one component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher. This epoxy requires ...

epoxy resin / encapsulation
epoxy resin
EP30FL

The EP30FL model in the Master Bond Polymer System has a two-component epoxy resin design for casting, bonding, sealing, potting and encapsulation. It features low viscosity and high performance with ...

epoxy resin / encapsulation / fire-resistant
epoxy resin
EP21FRSPLV

... delivers functions such as potting, encapsulating and casting. The system is noted for its one to one mix ratio. This cured resin system is also durable, tough and has high strength properties. It doesn't get affected ...

epoxy resin / encapsulation / low-viscosity
epoxy resin
ER2183

ER2183 is a flame retardant, thermally conductive, two part potting and encapsulating compound. The flame retardant technology used is of a 'clean' type leading to relatively low toxicity fumes and low smoke emission. Key Properties: ...

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ELECTROLUBE
epoxy resin / encapsulation
epoxy resin
ER2222

... comparison to other encapsulants of 1.20W/m.K. Both resin systems are filled, but the viscosity of the mixed system is low in comparison to other resins with a similar filler loading. This allows the ...

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ELECTROLUBE
epoxy resin / encapsulation
epoxy resin
ER1122

Excellent adhesion to a wide variety of substrates Mix ratio can be altered to vary flexibility Good electrical properties Can be used as an adhesive or encapsulant

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ELECTROLUBE
epoxy resin / encapsulation / low-viscosity / water-resistant
epoxy resin
ER1450, ER1451

This material is a fast curing epoxy resin of low viscosity. The cured product is tough and exhibits good adhesion to a variety of substrates. The system may be supplied in bulk, kit or resinpack form. Key Properties: ...

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ELECTROLUBE
epoxy resin / encapsulation / thermal cycling / low-viscosity
epoxy resin
ER2218

ER2218 is a low viscosity, flame retardant, two part potting and encapsulating compound. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature ...

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ELECTROLUBE
epoxy resin / for wood / encapsulation / laminating
epoxy resin
SP 106

MULTI-PURPOSE EPOXY SYSTEM¬ Use for gluing, coatings, laminating and filling¬ Rapid curing, even at low temperatures¬ Simple to useINTRODUCTIONSP 106 is a simple to use, all-purpose epoxy which can be ...

epoxy resin / encapsulation / two-component
epoxy resin
U-66-2

Star Technologys U-66-2 is a two part epoxy designed as a buttering epoxy or for brush on applications. U-66-2 has excellent resistance to water and chemicals making it ideal for sealing the end turns ...

encapsulation resin / photosensitive
encapsulation resin
SC, IC Type 3, HNR, HR series

The Negative Polyisoprene-based photoresist material, fabricated by Fujifilm, features various of negative tone, polyisoprene-based resist systems that are suited for a wide range of contact imaging and projection. This product provides ...

epoxy resin / encapsulation / casting
epoxy resin
RE 22801/2120

Electrical insulating epoxy resin. bi-component, semi flexible, good thermal ageing stability. Casting resin for mechanical & numerous electrical applications, especially for low or medium ...

encapsulation resin
encapsulation resin

UV Curing Resins for Electronic & Industrial Potting Applications DYMAX light cure UV potting materials cure tack free in seconds upon exposure to UV/Visible light. Each potting material is engineered to bond different ...

epoxy resin / electronic / composite / encapsulation
epoxy resin
EPON™

... EPON™ Resins are the standard of the epoxy resin market and the foundation of the resin business. This product line includes liquid resins, solid resins, ...

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Miller-Stephenson Chemical Co
epoxy resin / encapsulation
epoxy resin
EPONOL™

EPONOL™ Resin is a high-molecular-weight epoxy resin used primarily in paint coatings and in prepreg laminates. For paint coatings, the resin offers good flexibility to help reduce chipping ...

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Miller-Stephenson Chemical Co