26 products in   Logic gates, FPGAs, ASICs GaAs application specific integrated circuit (ASIC) Triquint Semiconductor Key Features and Performance • Very Low Loss (<0.25dB Typical) • High Power 1W 50 Termination • Broadband 3dB Power Split • Chip dimensions: 1.0 x 3.0 x 0.1 mm (40 x 120 x 4 mils) • 3 sizes Cover 12GHz - 45GHz Preliminary Measured Data Primary Applications • Power Combining Application specific integrated circuit (ASIC) Atmel Atmel SiliconCity™ ASICs are the ideal choice for medium- to high-volume projects where optimum performance, die size, power consumption and unit cost are essential. Atmel ASICs keep design time, cost and risk to a minimum by extensive IP re-use, and by using a design flow that has been optimized on the basis of more than twenty years of successful projects. Atmel offers a range of ASIC process technology options including leading-edge digital CMOS for maximum performance, and mature mixed analog-digital and embedded MVM variants that keep NRE costs to a minimum. Application specific integrated circuit (ASIC) Broadcom Broadcom offers custom silicon design capability for applications where customers want to integrate their own intellectual property with Broadcom's proprietary intellectual property cores. We have successfully developed custom chips for LAN, WAN and PC applications. These chips are complex mixed-signal designs that leverage Broadcom's advanced design processes. Application specific integrated circuit (ASIC) Epson Europe Electronics Our product range includes Gate Arrays that address the need for fast turnaround at low IC development costs, Standard Cells that make System Solutions possible at the lowest unit price, and Embedded Arrays that combine the fast turnaround time for Gate Arrays with the ability to implement system level funcionality on-chip available with Standard Cell. The Gate Array is a member of the ASIC family that offers Quick Turn Around Time during the development cycle at the lowest development cost. This is achieved by Epson stocking pre-fabricating Base/Bulk wafers that have transistors arranged in the form of an array. Our customers design the "wiring", that connects the transistors, that bring specific functionality to the design of the ASIC. Bulk wafers are prefabricated with a different numbers of transistors giving customers a wide range of choices to implement their circuits, thereby giving customers a choice of adding or subtracting functionality from the design offering flexibility. The Embedded Array combines the fast turn around time of gate arrays with the ability to implement system level functionality available in Standard Cell. The fast turn around is accomplished by starting some of the wafer fabrication processes in parallel with the Embedded array design process. In selecting an Embedded Array approach, the designer trades off the ability to change the Bulk in the last minute, possible with a gate array, with the need to implement system level functionality, with gate array like turn around. By offering Gate Array, Standard Cells, and Embedded Arrays;Epson offers a choice to meet the individual needs of our customers. Application specific integrated circuit (ASIC) Freescale Freescale Semiconductor offers Application Specific Integrated Circuits (ASIC) as well as highly integrated, customized System-on-Chip System (SoC) solutions for the printing and imaging, broadband, network, and storage markets. The Application Specific Products operation develops ASIC and SoC products built on a foundation of standard Freescale processor cores and proven peripheral intellectual property (IP). The offering is designed to provide customers with the benefits of scalable performance, fast time to market, low system cost, and flexible, System-on-Chip platforms that allow easy migration to next-generation system designs. Application specific integrated circuit (ASIC) GEMAC mbH Our ASIC designers look back on many years of experience in the field of design, development and support services for application-specific circuits with analog, digital and mixed technology in ASICs or FPGAs. Application specific integrated circuit (ASIC) LSI Logic Custom ASICs allow the ultimate combination of interfaces, processing capability, power and cost effectiveness enabling differentiated products that add real value to your end customer. Application specific integrated circuit (ASIC) Maxim Integrated Products Featuring Our SiGe (Silicon Germanium) Processes Customer-Designed RF ASICs Foundry Services Five SiGe Processes! 4th Generation SiGe Technology Available SiGe QuickChip%u2122 For Low NRE Maxim is uniquely qualified to solve your high-frequency ASIC needs with our Complementary Bipolar, Bipolar, BiCMOS, SiGe (Silicon Germanium), or SiGe BiCMOS process technologies. Our RF ASIC offering includes Customer Owned Tooling (COT) and Foundry Services. Maxim offers: Experience with more than 1000 mixed-signal and RF ASICs Thirty years of ASIC experience Leading-edge process technologies. Choose from five SiGe (Silicon Germanium) processes. Accurate device models that have allowed a >90% first-pass success rate Full custom or semi-custom (QuickChip) design methods Application specific integrated circuit (ASIC) STMicroelectronics ST offers our partners direct access to advanced technologies through a comprehensive set of libraries and CAD environments to achieve competitive time-to-volume performance. ASIC/semicustom products play a key role in the IC industry in that they give to customers the ability to access leading edge silicon and packaging technologies and to use advanced IPs to give added value to their equipments. In our concept customers remain the owners of their IC architecture, having the capability to define and drive their products autonomously, gaining the full control of product differentiation versus competition. ST's semicustom organization structure focusses on getting your product into volume production in the shortest possible time. Application specific integrated circuit (ASIC) Toshiba America Electronics Components Toshiba offers a large family of application specific integrated circuit (ASIC) covers from ASIC 0.009µm (TC-300 family) to ASIC 0.3 µm (TC-220 family). The TC300 family of ASICs are designed for the highest-performance, next-generation products ranging from networking and server applications to digital multimedia devices that manage audio/video information and portable devices that require the lowest power consumption. The TC300 family delivers approximately a 100% increase in gate integration, 20% increase is gate speed and a 50% reduction in power consumption compared to previous generation 130nm process technology. It's built on Toshiba's proven CMOS process technology (CMOS4) that permits easy mixing of mixed signal, DRAM and applications specific IP cores on the same chip. It supports two types of DRAM cores optimized for speed or density, Toshiba qualified primitives, I/Os and SRAMs, as well as a high-speed SerDes for a range of applications. Application specific integrated circuit (ASIC) Fujitsu A leading global ASIC provider and total-solutions provider, Fujitsu delivers innovative solutions that enable customers to differentiate their products and maximize their time-to-market advantage. Fujitsu provides all the leading-edge technologies, essential cores, design tools and services needed to develop and produce advanced ASIC designs, including: Application specific integrated circuit (ASIC) Samsung Semiconductor Samsung delivers a total solution, including deep sub-micron design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging and testing capabilities. The result is a shortened design cycle, lower risk and a much higher likelihood of first-time silicon success. ASIC solutions at a glance: Advanced process technology and complete design services Leader in mixed-signal designs, with silicon-proven IP Broad expertise to enable product differentiation: - SoC - Embedded DRAM & Flash - SerDes - ARM processors Support of key applications such as: - Mobile devices (smartphones, PDAs, GPS) - Storage (disc drives, enterprise storage) - Printers (ink jet, laser jet) Advanced packaging & testing services featuring: - System-in-Package (SiP) - Fine-pitch BGA - Flip Chip Regional design centers help speed development Application specific integrated circuit (ASIC) austriamicrosystems austriamicrosystems is a leading supplier of analog and mixed signal ASICs (Application Specific Integrated Circuits), designed for global leaders in the Automotive, Communications, Industry and Healthcare markets. Our goal is to ensure a strategic partnership for a secure long-term source of supply. Available ASIC Building Blocks Power Management Mobile Entertainment Wireline Communication Bus Systems Car Access Metering Sensors / Sensor Interfaces Medical High Voltage General Digital IPs General Analog IPs Software for integrated circuit design Synopsys Physical effects of semiconductors are becoming more and more interrelated. Each design decision can create unintended consequences. In addition to the old problems generated by wire capacitance, engineers can no longer manually balance the myriad effects such as leakage current, inductive noise or IR drop. Manufacturing processes and environmental variation can render your functional chip useless or economically unviable. Market forces are creating demands of higher volumes at lower and lower price points. Investors are losing their appetite for risk and paying a premium for predictable success. Designers must walk a tightrope of price and performance to reach their time-to-market goals. Chip-on-board (COB) C MAC Microtechnology An epoxy resin or a silicone coating is then applied on top of the die to encapsulate and protect. This is a manufacturing solution that allows fast modification of existing product designs, even where space is at a premium. COB provides high packing density, quick turnaround, enhanced thermal characteristics, can be adapted to high frequencies, can mix standard assembly technologies and is applicable to most substrates. Multi-chip module (MCM) C MAC Microtechnology MCM technology is applicable to many markets. Substrate technology includes: Thick Film ceramic, LTCC, Thin Film and for benign environments, epoxy laminates, such as FR4. For the harshest environments, chip and wire MCMs on ceramic are hermetically sealed in metal or ceramic packages. For lower cost applications, epoxy or silicone glob top is often used to provide protection of wire bonding or flip-chip assemblies. Programmable system-on-chip (SoC) Lattice Semiconductor Lattice Semiconductor pioneered the approach of putting ASIC embedded cores and FPGA gates on the same silicon die. We call this a Field Programmable System Chip (FPSC). In contrast to ASICs with embedded FPGA gates, FPSCs have a broad range of uses. The embedded cores hold industry-standard Intellectual Property - bus interface, high-speed line interface, and high-speed transceiver cores. When these embedded cores are combined with hundreds of thousands of programmable gates they can be used in a variety of advanced system designs. Programmable system-on-chip (SoC) Quicklogic QuickLogic's pASIC 3 family of programmable devices range from 5,000 to 75,000 system gates. Members of the pASIC 3 Family feature 3.3 V operation with 5.0 V I/O compatibility, and are available in commercial, industrial and military temperature grades. Programmable system-on-chip (SoC) STMicroelectronics System-on-chip technology is the ability to place multiple function "systems" on a single silicon chip, cutting development cycle while increasing product functionality, performance and quality. Even if the semiconductor industry achieved increasing levels of integration, the success of this double integration - processes and functions -- involves more capabilities than originally expected. STMicroelectronics is a leader in system-on-chip technology thanks to an unrivalled combination of silicon and system expertise, manufacturing strength, wide IP portfolio and strategic partners. The manufacturing strength of ST, technology and process know-how are combined to minimize time-to-volume. ST offers a complete solution that takes you from design right through to production. This solution integrates pre-characterised semicustom libraries, a wide package portfolio running from fine-pitch BGA as well as ultra-small leadless packages, a high performance BiCMOS process Silicon-Germanium HBT which marries the advantages of SiGe - speed, low noise and low power consumption - with state-of-the art CMOS in a high volume manufacturing structure. Programmable system-on-chip (SoC) Cypress Semiconductor Cypress' PSoC(R) mixed-signal arrays are programmable systems-on-chips (SOCs) that integrate a microcontroller and the analog and digital components that typically surround it in an embedded system. A single PSoC device can integrate as many as 100 peripheral functions with a microcontroller, saving customers design time, board space, power consumption, and from 5 cents to as much as $10 in system costs. Easy-to-use development tools enable designers to select the precise peripheral functionality they desire, including : Analog functions (amplifiers, ADCs, DACs, filters and comparators) ; Digital functions (timers, counters, PWMs, SPI and UARTs) ; Communications interface (I2C, SPI, USB...). PSoC devices include : Up to 32 KB of flash memory 2 KB of SRAM ; An 8x8 multiplier with 32-bit accumulator and Power and sleep monitoring circuits. Programmable system-on-chip (SoC) NXP Semiconductors VIDE ... products without technical information Application specific integrated circuit (ASIC) Ami Semiconductor Application specific integrated circuit (ASIC) Chip X Application specific integrated circuit (ASIC) Clare Networking ASIC Chip X Structured ASIC Chip X ... see all the products in the category    Logic gates, FPGAs, ASICs   see the results for the following category