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Die Head
The specially designed DKM basket die head and spiral die head for the DKM series single screw extruder, fits well with the DKM high speed vacuum calibrator and guarantees the high output with excellent article quality. The max producible pipe diameter isΦ1600mm.
* Regardless of material viscosity variation, widely applicable for HDPE/MDPE, PERT, PP/PP-R, PB, PS/ABS and HMW-PE pipe production, with reliable processing property.
* High output but rather low pressure drop and melt temperature.
* Small pipe stress due to the low melting pressure and temperature.
* Capacious and smooth runner reduces the pipe stress to the minimum.
* High quality ceramic heater with longer service life.
* Pipe with scratch-free smooth surface finishing.
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Reifenhäuser has a tradition of making die-heads that goes back for over 50 years. A team experienced in planning and construction, the use of cutting edge software tools, highly efficient production, and close contacts to raw material suppliers are all factors that guarantee the best possible results.
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Polyolefin pipe die-heads for pipe diameters ranging between 10 - 2 000 mm are part of the delivery package. Reifenhäuser was the world's first supplier of die-heads for 2 000 mm pipes, thereby significantly increasing the extrudable pipe diameter of the time a milestone that perfectly illustrates Reifenhäuser's key expertise.
Reifenhäuser uses spiral mandrel die heads for the extrusion of PE pipes. Coextrusion adapters for the extrusion- of 2 and 3 layered pipes are also supplied.
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TEDD is an acronym for Thermal Equalization and Distribution Device. It is designed to reduce the wide temperature variation across the diameter of the melt stream as it exits the extruder. The temperature can have a variety of profiles depending on machine speed and screw design.
Peak to peak variations as much as 30o F are common and this translates into large viscosity variations. Cut and try modifications must be made to the die to produce the product profile required. This means the die will produce the right profile over a rather limited production rate range.
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As the most influential brandname on extrusion die, owning 60% market share in China, we have been always dedicated to carrer on development of extrusion dies and correlative products
Features
Special flow channel design, sutiable for different raw materials, JCtimes has developed series of dies for PE PP PVC EVA foam products.
Independent temperature control system in lips ensures very identical temperature on the whole width, in order to get most proper expansion rates for different raw materials.
Equipped with the feedblock can produce the co-extrusion foamed products, in whiich surface layers are compact and the internal layer is foamed
Width adjustment system
According customer’s requirement to design various width adjustment system, include: external deckling system and inernal deckling system.
Features
Internal deckling system have reducing thick edge function, mainly use for coating extrusion line. Due to the special adjust requirement, the flow channel of the die also have special design.
Screw type external deckling can adjust the width on line and it working can save time, labour, and raw materials,
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As the most influential brandname on extrusion die, owning 60% market share in China, we have been always dedicated to carrer on development of extrusion dies and correlative products
Characteristics
- Originated design for mono-block die body, UV layer distributed evenly.
- Avoid leakage happening because of split die body.
- Easy maintainance.
- Male inside have air distributary system, divide the cavity into several zones, control air volume independently, ensure even air distribution in a short time.
- Flexible and fine adjustment on both upper and lower lips, the tolerance of the wall thickness within ±3％.
- Internal heating bars work independently in separated zones, temperature tolerance within ±1℃.
- With the economic UV function，PC+UV co-extrusion feedblock and a special structured male, make UV layer evenly cover on the product surface.
- PC hollow profile die can be used for 4-25mm thick , 2100mm wide product, the multilayer product thickness can reach 80mm.
- PPhollow profile thickness and width range bewteen 2-12mm and 1200-3000mm.
- Flow channel surface polishing precision at 0.01-0.02μm.
- Male tooling precision can reach 0.04-0.05μm，special non-sticking treatment applies to each rib.
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The types of extrusion dies offered are monolayer, biflux and coextrusion. They are made by drop forged alloy steel and machined on CNC machine tool to guarantee very precise tolerances.
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HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
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The FC300 High Force Device Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding on wafer up to 300 mm.
It includes Nanoimprinting Lithography (NIL) capabilities.
The FC300 is a configurable platform which can perform various applications with a quick and easy process head exchange:
high force bonding, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography,
low force for reflow bonding of RF & optoelectronics devices assembly,
UV-curing for adhesive bonding or for Nanoimprint using the UV-NIL process.
High End Processes
Die bonding, flip chip bonding, mass reflow, in-situ reflow, fluxless eutectic bonding, thermocompression bonding, ultrasonic bonding, UV-curing bonding, adhesive bonding,
UV-NIL, hot embossing lithography...
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Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding
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The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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An accurate high-speed flip chip bonder, the FCB3 accommodates a variety of needs. From development to pre-production and multiple-model production, this machine offers outstanding functionality.
The FCB3 features a simultaneous recognition camera that ensures accurate bonding in continuous production. Additionally, the automatic calibration function corrects thermal changes over time, guaranteeing bonding accuracy of ± 3 _m/3 sigma during continuous production.
Ideal for medium to very fine pitch manufacturing.
Features & Benefits
Flexible modular system accommodates various processes
IC feed from both tray and wafer optimizes productivity
Automatic tool changer with 4 input handles up to 38 types of ICs
Wide component range - from 2" x 2" (up to 320 inputs) to 4" x 4" (up to 80 inputs)
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We designed a CNC drill press for thermal drilling and cutting applications.
Main characteristics are: Sturdy spindle, Motor power, Stability and pricing.
MACHINE
Machine: FD-005016
DRILL RANGE
From 2.0mm to 25.4mm
TECHNICAL INFO
400 - 3.000 Rpm.
4.0 kW Motor Power
15.000 N. Axial Force
200 mm. Spindle Travel
MT4 Spindle Taper
LxWxH: 1060x600x2290 mm.
Weight: 700 kg.
Multi-step programming
Rapid Feedrate: 6.000 mm/min
Max Formdrill diam. : 25.4 mm.
Max Cutting tool diam. : 30.0 mm.
Ideal solution for Formdrill thermal drilling or standard cutting applications!
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The DT-1 is a compact, high-speed drill and tap machine with full milling capabilities. The machine features a generous 20" x 16" x 15.5" (508 x 406 x 394 mm) work cube and 26" x 15" (660 x 381 mm) T-slot table, while maintaining a very small footprint. A powerful BT-30 taper spindle spins to 15,000 rpm, and allows tapping at speeds to 5000 rpm. The spindle is coupled directly to the motor for smooth, quiet operation and extreme thermal stability.
The DT-1 is equipped with a high-speed, 20-pocket, servo-driven tool changer that swaps tools in 0.8 seconds. High-speed 2400 ipm (61 m/min) rapids combine with 1G acceleration rates to shorten cycle times and reduce non-cutting time. The maximum cutting feedrate is 1200 ipm (30.5 m/min).
A 45-gallon (170 L) flood coolant system is standard, with options for a programmable coolant nozzle and high-pressure through-tool coolant systems.
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Robust and structurally balanced, providing excellent rigidity and thermal and mechanical stability-all resulting in improved accuracy, finish and tool life. The compact GX 480 DT drill/tap center offers exceptional and unprecedented speeds and feeds for high productivity
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STANDARD EQUIPMENT
OPTIONS
SNT 2 base - Micrometric feed box - Coolant unit (pump and tank) - 24 V illuminating attachment - Standard electrical tapping attachment - Intermediate table - Distance spindle / table + 100 mm - Quill powerfeed box ( 0,1 mm/t ) - Security switch/chuck guard - Vices and attachments
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STANDARD EQUIPMENT
OPTIONS
SNT3 base - Coolant unit - 24V illuminating attachment - Electrical tapping attachment - Quill powerfeed box 0,1 mm/t - Raising column - Intermidiate table - Micrometric feed box - 1PH motor - 3PH motor - Chuck guard security - Attachments - 2 speeds motor
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Spaciale machine tool of foratuta, to transfer, multiple mandrels.
Special machine for the perforation of the flange of the sluice valves.
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Taptite 2000 eliminates the need for pre tapped threads, as they create their own threads on installation, therefore reducing pre-assembly costs.
Other advantages are low thread forming torques, High strip torques and High clamping forces, therefore offering a superior process-reliable fixing.
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Remform® screws have been designed specifically for applications in plastics, with their unique thread profile, they offer low screwing in torques coupled with high strip torques make Remform® the perfect answer when looking for the right screw for plastics applications
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Specifications
Sizes: #8 to 1/4"
Lengths: 3/4" to 3-15/16"
Head Styles: Flat and wafer
Drive System: Phillips
Point Styles: Types 3 and 4
Material: Carbon steel
Finishes: Phosphate or gray Stalgard®coating
Features & Benefits
Eliminates costly pre-drilling of wood
Broad selection of sizes
Can be used with steel up to 5/16" thick
Gray Stalgard coating provides 1000 hours of salt spray resistance and was developed for use with ACQ treated lumber with retention levels no higher than 25 PCF
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Substitute the drive code for the ? and the length for the L In the part no. to specify the exact part required. The 30 deg. Flank angle and recessed core diameter of these thread forming screws for plastic have been developed following theoretical appraisal, exhaustive calculations and final proof testing. The 30 deg. Flank angle produces low radial forces when engaging the plastic, therefore resulting in less radial stresses, in other words the hoop stresses in the plastic bosses are less than those experienced with conventional screws. The recessed core geometry provides the ideal flow director for the displaced plastic, encouraging a uniform flow to fill the pitch of the screw without material jamming. This results in the maximum amount of plastic being engaged providing higher sheer loads due to the increased bearing depth of the thread. A combination of the above and the ease of penetration of the 30 deg. Flank angle through the material, encouraging plastic flow, reduces the torque required to drive the screw in. This therefore increases the margin between drive and stripping torque which minimises the potential of stripping during installation. The optimum pitch and maximum fill features provided by the recessed core results in a large area of plastic to be sheered prior to screw failure in tension. This creates a high resistance to pullout loads.
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