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The use of induction furnaces for heating material that must undergo subsequent deformation by hot pressing, is now a consolidated practice that offers great advantages with respect to traditional heating systems such as gas furnaces, resistance or radiant panels furnaces, etc.
The great advantage in the pressing sector, where the heating process for work material is required continuously, is the total absence of pre and post operation downtimes. Other advantages include rapid reaction times to any temperature variation, rigorous reproducibility of operation parameters, easy automation of the entire line, easy adaptability to the different production needs of presses, hammers, forging machines, etc.
The electrical power required by the induction system depends on production needs, on the temperature, and on the cross-section and the type of material being heated. With regards to this last aspect, we would like to emphasize that furnaces can be built for any metallic material ( ferrous or non ferrous ) and of any cross-section ( circular, squared, tubular, flat, etc. ).
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Fonditrice to induction with Analogic centrifuge CS1 Vacuum Fonditrice to induction with centrifuge for fusions sottovuoto and in atmosphere of Argon of Gold and Silver, usable also for Platinum - Steel. Capacita' max crucible: 500 g Au? 300 g Ag Dimension maximum cylinder in milimeter: Ø 100 x 120 H Circuit of fusion in MF 40-60 kHz Pump for the empty one from 20 m3 incorporated System of external cooling Control of the temperature to the infrared - at call to immersion Circuit of distribution inert gas (Argon) incorporated entire Arm of centrifugalization with 4 saddlebacks - at call broken
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Frequency: 5 kHz Power: 50 kW
Length: 1.260 mm Height: 1.300 mm
Width: 1.160 mm
Tiltable medium frequency melting system for up to 50 kg ferrous and non-ferrous metals. Water cooled. The crucible of silicon carbide is heated up inductively and this way also non-conductive materials can be melted. The generator creating the medium frequency energy is equipped with it's own internal water cooling system.
Product-ID: 7
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Vacuum Induction Melting (VIM) is reliable and very versatile furnace. Can be used for producing a wide range of materials, including special alloys that are cast for high value, critical parts such as golf club heads, aerospace parts, automotive parts, and other equipment that need special mechanical properties for successful operation. The VIM furnaces can create single crystal, equiaxed crystal or directionally solidified parts for any application.
Thermal Processing Equipment offered by SECO/WARWICK is a products range made in Europe, based on RETECH's SYSTEMS LLC knowledge, experience and technology.
Cooperation between SECO/WARWICK and RETECH benefits European customers by metric standards, European parts, CE for European Directives, local sale and after sale service support.
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Integrated, In-line Diffusion System - DCF Series
Integrated, In-line Diffusion System
The new, Integrated, In-line Diffusion System is Despatch's latest addition to the company's photovoltaic product portfolio. The new in-line diffusion systems are designed to consistently deliver highly homogeneous emitters that are critical for creating high efficiency solar cells.
The production of the DCF Systems represents an important advance in the solar cell manufacturing process by integrating the following into one single piece of equipment:
A patent-pending, in-line phosphorus doper that utilizes top and bottom spray technology
An infrared diffusion furnace featuring a patent-pending thermal processing chamber
Critical process technology
The new integrated systems are recognized for superior thermal processing control, improved cost of ownership, value-added feature sets and ease of maintenance. These special features provide customers with high throughputs and maximum yields.
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Uniform, Repeatable Thermal Processing
Axcelis' Summit XT covers a broad range of advanced thermal processing needs for transistor formation in and beyond the 65nm technology node, including anneals for:
-Ultra shallow junction formation
-Dry oxidation
-Nickel silicide
-Shallow trench isolation (STI) oxides
-Titanium nitride (TiN) densification
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Beside the precise pressure of the solder paste and the exact Pick and Place, the soldering constitutes the most sensitive and most important process at the development of a PCB. Here the producing batch size certainly plays as well a decisive role, as the underlied technology (general components, FinePitch-, Ultra-Fine-Pitch-, BGA- or even special components).
In line with the broad spectrum of our different Print and Dispensing systems and the different possibilities to Pick and Place we also offer two systems for SMD-soldering.
This is on the one hand the smaller convection oven 538 DF (table-top) and on the other hand the standard device 548 DF for higher quantities. In general this is used in lines with machines.
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