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The strong point of the threephase model OIL 440 is that it can separate the vacuumed swarf and liquid and return the filtered liquid to the machine tool where it can be used again.
The machine is equipped with an ejection pump , so the liquid can be expelled during the vacuuming operations, in this way using the vacuum is fast and efficient ("E" version) in the same time.
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The Tecnoil range is especially designed to suck up, clean and recycle the oil and coolant on machine tools. Single and three-phase models from 3 to 15 HP, capacities from 150 to 700 litres.
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HeoloS industrial suction units, HSP series, represent the best solution for sucking greases, emulsions, cooling fluids, mud and slush.
besides being fitted with a unit for the elimination of fluids, HSP suction units are fitted with an elimination pump and a scrap filtering basket with floater.
Thanks to the practical reverse flow system, standard on all HeoloS suction units, the HSP range is suitable to suck large quantities of greasy substances that after an effective filtration and the separation of the scrap material, can be reintroduced into the machine.
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Tecnoil is a vacuum unit specifically designed for the engineering, automotive and mechanical industry; it includes a vacuum unit, a separation / filter unit, and a collection and rapid discharge unit.
It is especially suitable to vacuum up liquids such as cutting oil and coolant, mixed with solid particles (metal chips and shavings), to separate them and filter the liquid to the required level (from 300 down to 6 micron), in order to make it possible to use it several times thanks to an inbuilt powerful discharge pump, and reduce stand by times of machine tools to minimum levels.
Available in both single and three phase version, or as air operated, Tecnoil is specifically designed and suitable for CNC machines, lathes and other machine tools.
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The oil vacuum DM35 / 40 OIL is the newly designed vacuum unit designed by Delfin, with a special regard to the engineering and mechanical industry.
Compact and sturdy, entirely built in steel, and available in 2 or 3 motors version, the DM OIL guarantees great mobility. It is fit with a detachable container (100 lt. capacity) fit with a sieve grid, enabling the suction and separation of liquids such as oil or coolant, mixed with metal shavings and chips, and their easy and safe disposal.
Additional features such as a level indicator, a tangential suction inlet with inbuilt cyclone and a floating device to stop the suction when the liquids fill in the tank, make the DM OIL the perfect vacuum for applications in engineering, workshops and machine tools maintenance
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The TANK-VAC draining appliances enable users to collect industrial fluids with or without filtering them. They extract swarf/chips, sludge and sediments that they separate from the fluid collected, and then release the fluid either directly or following a fine filtration process, so that it can be re-used immediately.
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The suction plant KMA 1003 is marked by a robust construction and by carefully in detail planned solutions. The very mobile and light KMA 1003 is the problem solution for appli-cations where only a suction of short duration is demanded. A high air output along with a high storage of shavings is assured by the large-dimensioned filtering bag. Also the removal is really simple: The exhausted shavings are separated according to the proven ZYKLON-method and directly collected in the exchangeable dust bag.
Extremely long clearing intervals become possible for the suction plant KMA 1004, thanks to the high-capacity filter of 5,2 m². The collecting receptacle has a volume of 150 l. Thus the easily exchangeable shaving bag has to be changed only most rarely. The filter itself can easily and quickly be cleaned by means of the fitted hand-operated, ratcheted, rotating cleaning brushes.
Due to the max. volume flow of 2000 m3/h, the KMA 1004 belongs not only to the most efficient units of their class, but also to the most robust ones, as its complete surface is completely galvanized and assures a long service life.
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Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
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The FC300 High Force Device Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding on wafer up to 300 mm.
It includes Nanoimprinting Lithography (NIL) capabilities.
The FC300 is a configurable platform which can perform various applications with a quick and easy process head exchange:
high force bonding, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography,
low force for reflow bonding of RF & optoelectronics devices assembly,
UV-curing for adhesive bonding or for Nanoimprint using the UV-NIL process.
High End Processes
Die bonding, flip chip bonding, mass reflow, in-situ reflow, fluxless eutectic bonding, thermocompression bonding, ultrasonic bonding, UV-curing bonding, adhesive bonding,
UV-NIL, hot embossing lithography...
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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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An accurate high-speed flip chip bonder, the FCB3 accommodates a variety of needs. From development to pre-production and multiple-model production, this machine offers outstanding functionality.
The FCB3 features a simultaneous recognition camera that ensures accurate bonding in continuous production. Additionally, the automatic calibration function corrects thermal changes over time, guaranteeing bonding accuracy of ± 3 _m/3 sigma during continuous production.
Ideal for medium to very fine pitch manufacturing.
Features & Benefits
Flexible modular system accommodates various processes
IC feed from both tray and wafer optimizes productivity
Automatic tool changer with 4 input handles up to 38 types of ICs
Wide component range - from 2" x 2" (up to 320 inputs) to 4" x 4" (up to 80 inputs)
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KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding
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The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
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Chip inductor coil winding machine
Displayed Machine : NCI-0150
The NCI-0150 and NCI-0250 machines are specialized machines for inductor coil winding. The machine is controlled by 12-axis and is capable to wind multiple inductor specifications. Cross-winding is possible for transponder coils. The type of welding is selectable.
Features :
. Shortened cycle time by core supply, winding, welding and core unload simultaneous processing
. Consumes little floor space
. Reduced weight
. Indexer operated by direct drive motor. No maintenance required.
. NITTOKU`s original auto tuning system stabilizes welding temperature
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