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YXLON unipolar constant potential X-ray systems include 2.25 kW and 4.5 kW versions. The 2.25 kW X-ray systems have been designed and configured primarily for use in manual, semi-automated and fully automated radioscopic applications. The high energy and high dose rates of the unipolar 4.5 kW X-ray systems make them excellent candidates not only for radiographic and radioscopic applications but also for dosimetry and scanning methods like computertomography.
The typical application of each X-ray system is tailored towards specific target areas like low density applications, biological specimens (pathology), plastics and rubber compounds (MG103) and aluminum and steel applications like casting X-ray inspection (MG165 and MG226).
The unipolar 40kHz X-ray systems feature a very high output stability, a precise energy setting and an extremely fast change over to any selected new value. Any fluctuation or deviation of set values is controlled and corrected within microseconds. In addition these features reduce inspection times considerably and highly qualify the X-ray systems for inline inspection in fast, completely automated production lines.
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| The bench|mate is an economically priced, very compact high-resolution X-ray system for a variety of inspection tasks. Its modular setup enables the customer to easily upgrade the system to meet more advanced inspection requirements. |
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The ml|inspector is a high-resolution microfocus X-ray system designed for inspecting multilayer boards.
Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation |
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| Verimation Technology, Inc. is a leading manufacture of Ultrasound Test Systems for automotive applications. This method of Non-Destructive Testing is very accurate and reliable. Testing is performed by coupling short bursts of high frequency sound waves to the test part. The wave patterns are then analyzed and test results are generated. This method of testing can find internal flaws and analyze material properties without cutting or destroying the part. |
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The RETINAMATIC 2000 equipments are in use for the detection in real time of foreign contaminants as stones, metals, glasses, plastic, etc. In already stiff products or bulk productions with judging sensibilities that can come to 0.5mm (diameter of sphere) depending on the characteristics of the product (density of the same one).
The area of industrial application is indicated for the sectors of food: conserve, pre-coocking, frozen, 4th range, etc.), pharmaceutical, cosmetic, detergents, aerosols, etc...
This equipments allow to inspect different formats of products presentations: groups inside box, bags and metallized trays, carton, tin, etc., covering a great variety of widths and heights of product configurables. |
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Detecting manufacturing defects such as positional, missing, skewed, misplaced, incorrect device, incorrect polarity, solder and lead defects is fast and reliable. Unique dual lighting delivers the capability of inspecting laser marking on IC’s and SOT devices. An additional benefit is that it also delivers enhanced inspection of 0603 and 0402 devices.
Developed by DiagnoSYS for operator ease of use, this true AOI software is the most advanced available. Each system utilises the same software for extended ease of use. Comparator software, included, is a perfect solution for inspecting low volume assemblies without the need for programming.
Full manufacturing integration
The ScanPoint DT addresses prototype through to medium volume requirements complementing the ScanPoint 50 in-line system which targets medium to high volume. The family is complete with off-line programming allowing programs to be generated without interfering with production. Programs can be shared across multiple DiagnoSYS AOI systems. Data logging of test results is complimented with a full rework station capability |
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| Rudolph Technologies provides automated wafer edge top and edge normal inspection with throughputs of greater than 80 WPH (300 mm). The Class 1 certified system has an approximate 10 minute set-up time to be fully optimized and production ready. Featuring on-the-fly color defect image capture and intrinsic ADC capabilities, the E25 System can automatically detect and classify defects on the entire wafer edge, from the edge exclusion area to the bottom bevel. Both brightfield and darkfield illumination are available. |
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Designed from extensive customer feedback, the MLTM Series MicroLoader is the most technologically advanced, reliable and user friendly tool available for wafer inspection.
At Syniad we are aware that each of our customers has individual requirements. The MLTM Series MicroLoader contains unique features which mean processes can be tailored to meet specific needs.
The MLTM Series unrivalled specification is as follows:
Dimensions 515mm x 630mm
Class one cleanliness
Cassette mapping
Syniad SmartLoadTM intuitive Software User Interface
Networked machine for data sharing
System Control
7 Axis Dedicated Motion Controller with 3 unutilised axes offering huge potential for custom applications.
Controller Area Network (CANopen) option for flexible extensions and enabled data sharing.
The option of Optical Character Reading (OCR) for individual wafer locating capabilities.
Easy implementation of wafer alignment and centralisation.
The option of a custom made base plate to mount the MLTM Series MicroLoader and any microscope
Standards are as follows:
Full SEMI compliance
Full CE complaince
Unrivalled Component Listing:
Industry leading elevator with:
Autosize 100mm - 200mm
Cassette mapping
Cassette present "Easy LoadTM" Indicators
Options available:
100mm - 200mm Autosizing Bridge Tool
Wafer centralisation
Wafer alignment
OCR: M12, M13 Barcode, T7
SECS/GEM integration
Map file import and export to the Manufacturing Execution System (MES) |
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| The Rudolph Wafer device combines both edge and backside inspection into one enclosure. It retains all the capabilities of the proven E25 and B20 System in one small footprint. The Class 1 certified system can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior. |
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Recognising the rising cost in fab space Syniad Systems have developed a unique multipurpose inspection and sorting tool. The MultiSpecTM enhances the functions of wafer sorting, microscope inspection and bright light inspection all in a single small footprint tool. Customers are allowed to configure the tool to match their own unique requirements.
Example: A customer has a requirement for wafer sorting and bright light inspection. In this scenario, Syniad can configure the tool to "not" include Microscope Inspection and the sales price will be reduced.
Unrivalled Specification:
Dimensions: 1000mm x 700mm
Class 1 cleanliness
Cassette Mapping
OCR: M12, M13 Barcode, T7
UPS for continued operation after power out
Vacuum reservoir for continued operation after power out
Syniad SmartSpecTM intuitive Software User Interface:
Split, Sort, Merge, Wand Sorting functions
Bright Light Inspection Control
Wobble Chuck Control
Standards are as follows:
Full SEMI Compliance
Full CE Compliance
Unrivalled Component Listing:
Industry leading 3 axis robot
Industry leading pre-aligner with:
Linear Accuracy ±0.0025mm
Circular Accuracy ±0.05°
Integration with all microscope types
SEMI Standard Safety Light Curtains
Dual End Effector for maximum throughput
Cassette Present "Easy OnTM" indicators
Auto e-mail off-line configuration files
Options available:
100mm - 200mm Autosizing Bridge Tool
SECS/GEM integration
SMIF 200mm
SMIF and Open (on same tool) 200mm
Wafer thickness measurement (accuracy of 0.1µm) |
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Verimation’s Verimet® 7700 Portable Eddy Current Tester is a portable micro processor-based eddy current instrument for heat verification, alloy sorting, hardness inspection and case depth testing of ferrous metal parts. Versatile and accurate it offers improved capabilities for a wide range of applications. The instrument is compact, lightweight and battery equipped so it is very easy to use.
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| One compact, handheld tester now combines more of the technologies you need to test aircraft. The MIZ-21SR combines eddy current with two types of bond testing methods - resonance and sondicator. It also includes a built-in mode to measure conductivity and coating thickness across a broad frequency range - from 60 kHz up to 480 kHz. The MIZ-21SR employs the latest technology for superior flaw detection. High-gain input stages combined with noise-suppressing synchronous demodulation circuitry results in the best signal-to-noise ratio in the industry. The combination of a 16-bit A/D converter with high-gain analog circuitry maximizes sensitivity and signal resolution. |
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The X-32 is the first portable ultrasound phased array instrument for NDE.
It supports up to 32 channels, both for pulsing and receiving and is compatible with standard Hypertronics connectors.
With its own internal storage, the X-32 can make a real-time continuous recording of the inspection.
The X-32 software unit is based on the proven bulletproof Linux operating system. |
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Features:
- Large Bright High Resolution Color Touch Screen
- Built-In Encoder Interface
- USB, LAN, VGA outputs
- Huge Data Storage Capability
- Longitudinal, Shear, Guided, and Surface Waves
- A-Scan, B-Scan, CB-Scan, and TOFD
- Corrosion Profiling and Flaw Imaging
- Up To 20m Length of One LIne Scanning Record
- Playback A-Scans for Recorded Images
- Enhanced Signal Evaluation - Live and Frozen A-Scans
- Defect Sizing and Pattern Analysis
- Compliance with ASME and RBIM Procedures |
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