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Fault Detection, Surface Inspection
KW TRIO
Your demands for a reliable and flawless detection of extrusion faults and surface defects are ever increasing. This applies to extrusion, jacketing, enameling, drawing, and many other areas. For this reason the use of optical fault detectors ("lump detectors") is very popular. These photometric detectors are able to detect small lumps, neckdowns, and other defects on wires, cable, tubing etc., without being influenced by product parameters, line speed, vibration etc.
Important Features:
-3 times higher detection reliability (TRIO models) than conventional 2 axis systems
-Theoretically unlimited life expectancy
-Non-sensitive to stray light
-Flexible mounting concept
-Integrated air curtains for cleanliness of windows
-Defect classification and printout
-All data ports like RS-232, RS-422 and RS-485 as well as analog and PROFIBUS DP are available.
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Location And Inspection
* The RIDGID SeeSnake® is rugged and maneuverable.
* The NaviTrack II and the NaviTrack Scout are the easiest to learn and use. Ideal for those primarily locating sondes.
* SeekTech provides confident locating of utility lines.
* Best-built, best-backed cameras and locators on the market.
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S500 Functional Tester
A flexible, scalable high-performance functional test system tailored to meet your exact requirements for Module and PCB test. Rapidly and reliably giving you a Pass / Fail decision on any electronic module or PCB.
Test results can be passed to the PinPoint PCB Diagnostic Test System for rapid identification of any failure.
Designed to use industry standard hardware and software, the system can be configured and expanded to meet your changing test demands today and re-deployed in the future.
o Fully Integrated Test Solution
o Flexible open architecture (PXI, VXI, GPIB, Boundary scan)
o Complete solution - from design to through-life support
o Easy to use software Environment
o Fully scalable from desktop to multi-rack system
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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs
Wafer Specifications
* Diameter: 200mm and 300mm.
* Material: All Semiconducting and Semi-insulating materials.
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
* Flat/Notch: All SEMI Standard Flat(s) or Notch.
* Conductivity: P or N Type.
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.
Measurements
* Thickness and TTV.
* Bow
* Warp
* Site and Global Flatness
Advantages
* Cost effective alternative to fully automated tools.
* Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
* Standard Windows® User Interface.
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.
Wafer Specifications
* Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
* Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned
* Flat/Notch: All SEMI Standard Flat(s) or Notch
* Conductivity: P or N Type
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape
Measurements
* Thickness and TTV
* Bow
* Warp
* Site and Global Flatness
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Each panel is inspected by a camera system that is installed above the material flow. Defective areas are detected where the surface pattern differs from the normal (perfect) pattern. Each defective area is classified (characterized) in light and dark defects. The operator can easily change the parameters and sorting criteria.
The GreCon system is self-learning. It can distinguish between new patterns and known patterns. For known patterns, the stored image data is simply called up from a database at the beginning of a new order; the system is immediately operational. For new patterns, two successive panels are compared. If the deviations are smaller than the preset tolerance limits, these panels are used as samples. All following panels will then be compared with the new pattern. This procedure is very easy and takes only a few minutes so that the machine can be trained to any kind of pattern in a short time period.
Defects on the top surface of each panel are determined and can be represented on the monitor if desired. The quality is determined by evaluating the data, such as defect type, size and position.
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Error spectrum
- Cracks and scratches
- Spirals, chatter marks and burn marks
- Pores, blowholes and scrapings
- Dull areas
- Polishing shades
- Impact damages
- Chromium plating error
- Simple handling and steady classification
- Error type classification regarding size, shape, position and any combination thereof
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Used by wholesalers for rewinding decorating textiles, upholstery, clothing and other technical fabrics.
* Maximum roll diameter 40 cm (other dimensions on request)
* Flexible and modular concept.
* One person operation
* Inspection table with back lighting
* Accurate length measurement system
* Winding up station with adjustable speed control
* Power supply 230V, 50/60Hz, 1 kW
*Several options are available as loop control device and special equipment for tensionless inspection.
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The shearography tire test systems from Steinbichler Optotechnik have been developed for the non-destructive testing of new tires in R&D and quality control, as well as for the inspection of tire carcasses in the retreading industry. The technical basis of the systems is the TV shearography system.
During the test cycle, a low pressure (e.g., 50 mbar pressure difference) is generated in the vacuum chamber, thereby inducing deformations which are caused by the expansion of air pockets occuring in faulty areas in a tire carcass. With the TV shearography technique - a holographic measurement method which reliably detects material deformations in the range of microns - faulty areas can be localized clearly and reproducably.
The Intact® systems by Steinbichler Optotechnik have successfully proven their functionality in the worldwide car-, truck-, and aircraft industries, as well as in the Formula 1 racing tire business.
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Tire Balancer
Fully Automatic TIRE Balancer
The YAMATO brand tire balancer measures the unbalanced points & value automatically on the tire product line.
Dynamic Tire Balancer
The tire is inflated and then rotated at a constant speed.
The TB-D1 calculates the unbalanced points by measuring the centrifugal force generated from the deviation between the center of rotation and the center of gravity of the tire.
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Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding the wafer.
Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)
Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.
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PV Series
Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer.
Wafer saw mark detection and classification is accomplished by adding optional laser sensors to the PV-1000 module. Utilizing up to two of MTII's industry leading Microtrak - SA standalone laser heads, saw marks can be classified for orientation and depth simultaneously with wafer thickness scanning making the PV-1000 ideal for incoming wafer characterization and sorting.
Integrated data acquisition and control electronics analyze and transmit wafer data via the on-board Ethernet port at speeds of up to five wafers per second. The digital I/O port allows communication with wafer handling equipment for up to 64 classes of wafer sorting and binning. Remote monitoring capabilities allow you to see your production line data across your network or directly at the module.
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With its newly developed unique multi-directional detection optics unit, the LS-6800 / LS-7800 Wafer Surface Inspection tool achieves a detection sensitivity of 36nm (LSE) on bare silicon wafers.
This enables critical wafer inspection even at the 65nm technology node.
Features:
Detection Sensitivity: 40nm (PSL on Bare Silicon)
(36nm attainable)
Defect Classification: Crystal Defect / Particles
Scratches/ Particles
others
Detection Reproducibility: >99% (100nm PSL on bare Si)
Throughput (fast mode): 97wph (300mm)
75wph (200mm)
Display functions: Particle map, counts, histogram,
haze map, haze histogram,
others
Wafer sizes: 300mm, 200mm
(150, 125, 100mm optional)
(thin wafer chucking optional)
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Hamamatsu provides photo ( EMMI ) and thermal emission microscopes , thermal ( OBIRCH ) and photoelectrical ( OBIC ) laser stimulation systems for the failure analysis field and the design debug markets .
Our know how to combine state of the art confocal optical design for various wavelength bandwidth , owning core detections technologies such as InGaAs or Thermal sensors , integrating extremely high accurate and stable mechanical stage down to the microprobing level , sets our equipments as the most renowned in the world for more than 20 years .
Our tools are suited for a wide type of architecture from the die or wafer level , though package or applications boards level, up to probe card level and direct docking with tester environment, allowing our customers to observe parametric defect in static conditions and/or functional failures in real dynamic conditions.
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JEOL wafer and mask review tools improve yield management with unique capabilities that help rapidly detect minute imperfections and killer defects. 360 degree wafer edge review, high tilt, and fully automated rotation enhance the automatic defect classification capability of our high resolution, high throughput wafer inspection SEMs for 150-300mm wafers. JEOL provides a wide range of SEM based review solutions for the most advanced designs and highest throughputs.
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Features:
Eliminates Damage to Embossing Rolls
Monitors the entire width of the embossed web as it leaves the embossing rolls
Alarm signal can alert operator, automatically shear the paper ahead of the embossing roll or automatically stop the machine
Uses up to three pairs (transmitter/receiver) of MICROSONIC® ultrasonic thru-beam sensors
Microsonic® Thru-Beam Web Sensing System
Web inspecting applications
This innovative sensing solution is applicable to industries that convert plies of materials into embossed napkins, paper towels, plastic-lined paper table cloths and other consumer products. The Model SS100 Web Sensing System uses MICROSONIC®, thru-beam sensors to eliminate the costly problem of broken plies wrapping around, heating up and damaging embossing rolls, as well as the resulting downtime required to make necessary repairs. False trips or no trips at all resulting from dusty environments, or problems associated with sensors not immune to changing colors and materials, are also eliminated.
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RAYEX®
RAYEX® is a highly developed system based on x-ray tomography. (Patents US 5 518 681, US 5 795 531, and CH 685 336 A5). During the extrusion process, RAYEX® measures the wall thickness, eccentricity, diameter, and ovality of multi-layer cables with XLPE and EPR insulation, multi-layer pipes with foam core, composite pipes, and multi-layer hose. RAYEX® systems have been in use for years on various production lines and processes with great success.
-Steam - or steam/nitrogen lines
-Catenary lines
-Vertical lines
-Horizontal MDCV lines ("long die")
-In Silane, Sioplast/Monosil processes
-In foam core pipe extrusion
Important Features:
-Measures thin semi-conductor and insulation layers down to 0.3 mm (.012 in.)
-Simultaneous and uninterrupted scanning in X and Y directions with highest precision
-High scan rate and screen update (every 1...3 s)
-Multi-colored, easy to understand display
-Automatic control, thanks to short measuring intervals
-High resolution and accuracy, thanks to "Micro Focus" beam and UMX x-ray source.
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X-ray Imaging for the Non Destructive Testing (NDT) market. More and more factories and research labs, faced with even stricter demands of quality and safety in all types of food and industrial products, are finding that non-conduct, non-destructive X-ray inspection is extremely effective in upgrading quality and safety since it detects tiny product structural flaws and foreign object contaminations - with no product damage whatsoever. Hamamatsu Photonics has a full line of X-ray sources and cameras for X-ray inspection of electronic components, industrial products as well as for a wide range of fields to meet needs in food
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Safeline X-ray Inspection offers complete product inspection, determination of contaminants such as metal, glass, stone, bone and plastic which preserves your brand integrity.
Safeline, a world leader in inline x-ray inspection offer a range of x ray machines for contamination detection, portion control and package integrity inspection for bulk, glass and packaged products in the food and pharmaceutical industries. All systems feature industry-leading detector and image processing technology, simple set up and use, user-friendly intuitive operator interfaces and sealing to IP65 as standard, IP69K optional.
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PROx, A Family of X-Ray Inspection Systems
The Thermo Scientific PROx is the next generation in a long line of powerful and flexible x-ray food protection systems. Due to it’s unique design, it provides industry-leading detection of product defects including a wide range of contaminants and product assembly errors. It was engineered utilizing our 20+ years of experience and comes with many new improvements such as a larger touchscreen, high speed USB port, faster processor and improved performance in harsh environmental conditions.
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The RETINAMATIC 2000 equipments are in use for the detection in real time of foreign contaminants as stones, metals, glasses, plastic, etc. In already stiff products or bulk productions with judging sensibilities that can come to 0.5mm (diameter of sphere) depending on the characteristics of the product (density of the same one).
The area of industrial application is indicated for the sectors of food: conserve, pre-coocking, frozen, 4th range, etc.), pharmaceutical, cosmetic, detergents, aerosols, etc...
This equipments allow to inspect different formats of products presentations: groups inside box, bags and metallized trays, carton, tin, etc., covering a great variety of widths and heights of product configurables.
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Offering contamination detection of foreign objects and assuring product integrity, the InspireX R20 x-ray inspection system for conveyorised products protects your brand from costly product recalls and ensures the product leaves the production line in perfect condition.
Description
InspireX R20 x-ray system is capable of gross and zoned portion control, seal inspection for product freshness, and scanning for damaged or missing items for product quality ensuring your brand integrity. Safeline’s innovative approach to product inspection minimises downtime and reduces false reject rates increasing productivity. Full traceability is offered by the unique user sign in and event log system. An inspection width of 300mm is available suitable for single or multiple lane inspection, in a variety of configurations with a choice of reject mechanisms to suit your individual application.
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Designed to inspect fluids and semi-solids, the InspireX R70 x-ray system is capable of detecting contaminants or variation from established standards before the final packaging, minimising your wastage. The system features automatic calibration, one-touch operation and can be set-up within three minutes.
Description
For the pipeline x-ray inspection of contaminants, the InspireX R70 offers reliability and superior efficiency. Designed to meet the highest hygienic standards - IP69K, it is robust to withstand the harshest wash down environments. Fast and efficient x-ray calibration is incorporated as the x-ray generator and detector retract from the pipe line without the need of manual intervention, saving both time and money. Available in four pipe sizes, the system can inspect product flows up to 12,000 kilos per hour.
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Verimation Technology, Inc. is a leading manufacture of Ultrasound Test Systems for automotive applications. This method of Non-Destructive Testing is very accurate and reliable. Testing is performed by coupling short bursts of high frequency sound waves to the test part. The wave patterns are then analyzed and test results are generated. This method of testing can find internal flaws and analyze material properties without cutting or destroying the part.
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Laser Inspection
Winbro’s triangulation laser sensing provides a non-contact method of inspecting hole position on both metallic and coated components, following EDM or Laser Drilling and also feature measurement following HSM (High Speed EDM Milling).
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Inspection of glue bead dispensing
The products of Cordia range inspect the conformity of beads or glue application whatever their colour: extruded and fiberised beads and on all supports (sheet metal, aluminium, cast iron, glass).
The bead is inspected on all its length and for all the following characteristics :
- Continuity (glue lack or air bubbles causing interruptions)
- Width
- Position relative to references (distance to an edge, a hole... or position relative in the part benchmark)
- Height (3D configuration)
These functions are performed by a unique Cordia system.
Independent from the colour of the bead and the nature of the support
Robustness and reliability
Easy integration and implementation
Discover our products
Cordia F2D
Cordia M2D
Cordia M3D
Weld inspection
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Checking - rolling - measuring machines with automatic or half automatic packing.
Main operations:
-Checking, rolling, measuring any type of cloth.
-Cloth inlet from small/big rolls and from folds.
-Cloth outlet on small/big rolls and on soft folds.
-Infinitely variable speed from 0 to 160 m/min. according to the type and the cloth to be rolled.
-Selvedge alignment of proportional photo-electric type.
-Innovative synchronisation systems of the driven cylinders allow rolling operation with constant tension of any type of cloth, needed compactness besides precise measuring.
-These machines are manufactured till max. working width of 4500 mm.
-You can add, on request, informatic control systems, fault detection, labelling, sewing unit, cutting machines, automatic elimination of second choice cloth without manual intervention of the operator, packing, etc.
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Checking - rolling - measuring machines with automatic or half automatic packing.
Main operations:
-Checking, rolling, measuring any type of cloth.
-Cloth inlet from small/big rolls and from folds.
-Cloth outlet on small/big rolls and on soft folds.
-Infinitely variable speed from 0 to 160 m/min. according to the type and the cloth to be rolled.
-Selvedge alignment of proportional photo-electric type.
-Innovative synchronisation systems of the driven cylinders allow rolling operation with constant tension of any type of cloth, needed compactness besides precise measuring.
-These machines are manufactured till max. working width of 4500 mm.
-You can add, on request, informatic control systems, fault detection, labelling, sewing unit, cutting machines, automatic elimination of second choice cloth without manual intervention of the operator, packing, etc.
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