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YXLON tire inspection systems can be used for a variety of applications: whether testing prototypes under load or quality ensuring inline mass production, whether investigating passenger cars, truck bus or off the road tires – the high resolution of images produces by YXLON´s non destructive testing systems, enables you to take fast and fact based decisions.
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All MAXItire™ systems include manual and semi-automatic modes, with operator-assisted fully automatic inspection available.
Features & Benefits
High quality, single rotation, bead to bead inspection of tires
High throughput
Compact, modular and scalable design according to customer's specification
Excellent image quality from a fully digital imaging chain
Intuitive, easy to use operator interface
High uptime, low maintenance design
Meets ASTM standard F 1035 for discernment capability
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GE Inspection Technologies is a leading developer of eddy current instruments, testing machines, and sensors for industrial applications requiring surface and sub-surface crack detection and metal sorting. GE Inspection Technologies' non destructive eddy current testing equipment and solutions will meet the critical requirements of your unique application and deliver productivity, quality, and safety.
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Dynamic Systems Testing
Zwick provides test rigs and portal frames for the dynamic testing of systems components, which are designed in conjunction with your needs.
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SmartScope® MVP is the cost-effective way to get the benefits of video-based inspection and measurement from the leading name in the industry - Optical Gaging Products (OGP®).
Motorized benchtop SmartScope MVPs have a granite base and column, quality 6.5:1 zoom lens, and mechanical bearing translation stages for accurate positioning in every axis.
Measure-X® software makes it easy to create part routines using video and multisensor metrology. The touch probe option adds multisensor functionality, extending the versatility of SmartScope measurement systems.
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Rewinding, inspection and cutting machine for rolls of all kinds of fabrics (decorating textiles, fabrics for clothing industry, knitted fabrics).
Used by wholesalers for rewinding decorating textiles, upholstery, clothing and other technical fabrics.
* Maximum roll diameter 40 cm (other dimensions on request)
* Flexible and modular concept.
* One person operation
* Tilted 45° Inspection table with back lighting
* Accurate length measurement system
* Winding up station with adjustable speed control
* Power supply 230V, 50/60Hz, 1 kW
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Low-cost rewinding and cutting machine for rolls of fabrics.
Used by wholesalers.
# Fabric width up to 1800mm
# Maximum roll diameter 300mm
# One person operation
# Optiona accurate length measurement system with digital readout
# Varispeed rewinding system
# Machine dimensions 2100x 1000x 950
# Power supply 230V, 50/60Hz, 0.3kW
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The double flank gear rolling inspection is an easy and quick inspection method for gears. The inspection process can be carried out on the shop floor. It immediately enables the user to evaluate gears with regard to the total errors caused in production.
The double flank gear rolling inspection is, if used with modern evaluation equipment such as a PC, hardware and software, a very efficient and quick way of ensuring quality without any problems.
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Our multipoint measuring devices, measuring computers and measuring machines are used for measuring engine, gear and chassis components. With the HOMMEL GAUGELINE we offer our customers dimensional measuring methods which can be integrated individually in the production processes.
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Universal Gear Tester GMX 275, the accurate and fast solution for Gear analysis.The GMX 275 covers a wide range of applications for the gearing world up to 275 mm OD.
- High accuracy gear measurement with a Class 1 gear tester.
- Fast and effective through integrated Power PC technology
- Wide range of applications for gears and gear tools for guaranteed success.
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LPKF ScanCheck I+
The LPKF ScanCheck I+ Stencil Inspection System compares solder paste stencils manufactured by any method with the CAM data. The stencil supplier is thereby able to guarantee continuous quality of the stencils.
For the SMD assembly houses LPKF ScanCheck I+ provides quality assurance for all stencils before assembly production begins. After use and cleaning the stencil can be examined for blockages.
ScanCheck recognises all stencil defects such as missing apertures, wrongly shaped apertures, positional inaccuracies and, after use, any contamination
For the packaging industry in particular with the extremely high requirement for quality stencils there is no economic alternative to LPKF ScanCheck I+
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The IP321 combines conversion of Gerber data and the automatic recognition function for ease of programming. New data can be created easily and rapidly as compared with manual input.
The IP321 supports lead-free solder inspection and analyzes placement quality - it's optimally efficient.
Features & Benefits
Real time 100% inspection at in-line speeds
High resolution of up to 10 µm enables inspection of printed solder with a 0.4mm pitch
Handles solder-paste printing inspection for a wide variety of components
In-process control, including real-time monitoring
Easy operation & 3D Color Display
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S500 Functional Tester
A flexible, scalable high-performance functional test system tailored to meet your exact requirements for Module and PCB test. Rapidly and reliably giving you a Pass / Fail decision on any electronic module or PCB.
Test results can be passed to the PinPoint PCB Diagnostic Test System for rapid identification of any failure.
Designed to use industry standard hardware and software, the system can be configured and expanded to meet your changing test demands today and re-deployed in the future.
o Fully Integrated Test Solution
o Flexible open architecture (PXI, VXI, GPIB, Boundary scan)
o Complete solution - from design to through-life support
o Easy to use software Environment
o Fully scalable from desktop to multi-rack system
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.
Wafer Specifications
* Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
* Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned
* Flat/Notch: All SEMI Standard Flat(s) or Notch
* Conductivity: P or N Type
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape
Measurements
* Thickness and TTV
* Bow
* Warp
* Site and Global Flatness
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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs
Wafer Specifications
* Diameter: 200mm and 300mm.
* Material: All Semiconducting and Semi-insulating materials.
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
* Flat/Notch: All SEMI Standard Flat(s) or Notch.
* Conductivity: P or N Type.
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.
Measurements
* Thickness and TTV.
* Bow
* Warp
* Site and Global Flatness
Advantages
* Cost effective alternative to fully automated tools.
* Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
* Standard Windows® User Interface.
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Each panel is inspected by a camera system that is installed above the material flow. Defective areas are detected where the surface pattern differs from the normal (perfect) pattern. Each defective area is classified (characterized) in light and dark defects. The operator can easily change the parameters and sorting criteria.
The GreCon system is self-learning. It can distinguish between new patterns and known patterns. For known patterns, the stored image data is simply called up from a database at the beginning of a new order; the system is immediately operational. For new patterns, two successive panels are compared. If the deviations are smaller than the preset tolerance limits, these panels are used as samples. All following panels will then be compared with the new pattern. This procedure is very easy and takes only a few minutes so that the machine can be trained to any kind of pattern in a short time period.
Defects on the top surface of each panel are determined and can be represented on the monitor if desired. The quality is determined by evaluating the data, such as defect type, size and position.
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Used by wholesalers for rewinding decorating textiles, upholstery, clothing and other technical fabrics.
* Maximum roll diameter 40 cm (other dimensions on request)
* Flexible and modular concept.
* One person operation
* Inspection table with back lighting
* Accurate length measurement system
* Winding up station with adjustable speed control
* Power supply 230V, 50/60Hz, 1 kW
*Several options are available as loop control device and special equipment for tensionless inspection.
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The shearography tire test systems from Steinbichler Optotechnik have been developed for the non-destructive testing of new tires in R&D and quality control, as well as for the inspection of tire carcasses in the retreading industry. The technical basis of the systems is the TV shearography system.
During the test cycle, a low pressure (e.g., 50 mbar pressure difference) is generated in the vacuum chamber, thereby inducing deformations which are caused by the expansion of air pockets occuring in faulty areas in a tire carcass. With the TV shearography technique - a holographic measurement method which reliably detects material deformations in the range of microns - faulty areas can be localized clearly and reproducably.
The Intact® systems by Steinbichler Optotechnik have successfully proven their functionality in the worldwide car-, truck-, and aircraft industries, as well as in the Formula 1 racing tire business.
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Tire Balancer
Fully Automatic TIRE Balancer
The YAMATO brand tire balancer measures the unbalanced points & value automatically on the tire product line.
Dynamic Tire Balancer
The tire is inflated and then rotated at a constant speed.
The TB-D1 calculates the unbalanced points by measuring the centrifugal force generated from the deviation between the center of rotation and the center of gravity of the tire.
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PV Series
Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer.
Wafer saw mark detection and classification is accomplished by adding optional laser sensors to the PV-1000 module. Utilizing up to two of MTII's industry leading Microtrak - SA standalone laser heads, saw marks can be classified for orientation and depth simultaneously with wafer thickness scanning making the PV-1000 ideal for incoming wafer characterization and sorting.
Integrated data acquisition and control electronics analyze and transmit wafer data via the on-board Ethernet port at speeds of up to five wafers per second. The digital I/O port allows communication with wafer handling equipment for up to 64 classes of wafer sorting and binning. Remote monitoring capabilities allow you to see your production line data across your network or directly at the module.
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Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding the wafer.
Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)
Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.
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With its newly developed unique multi-directional detection optics unit, the LS-6800 / LS-7800 Wafer Surface Inspection tool achieves a detection sensitivity of 36nm (LSE) on bare silicon wafers.
This enables critical wafer inspection even at the 65nm technology node.
Features:
Detection Sensitivity: 40nm (PSL on Bare Silicon)
(36nm attainable)
Defect Classification: Crystal Defect / Particles
Scratches/ Particles
others
Detection Reproducibility: >99% (100nm PSL on bare Si)
Throughput (fast mode): 97wph (300mm)
75wph (200mm)
Display functions: Particle map, counts, histogram,
haze map, haze histogram,
others
Wafer sizes: 300mm, 200mm
(150, 125, 100mm optional)
(thin wafer chucking optional)
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Hamamatsu provides photo ( EMMI ) and thermal emission microscopes , thermal ( OBIRCH ) and photoelectrical ( OBIC ) laser stimulation systems for the failure analysis field and the design debug markets .
Our know how to combine state of the art confocal optical design for various wavelength bandwidth , owning core detections technologies such as InGaAs or Thermal sensors , integrating extremely high accurate and stable mechanical stage down to the microprobing level , sets our equipments as the most renowned in the world for more than 20 years .
Our tools are suited for a wide type of architecture from the die or wafer level , though package or applications boards level, up to probe card level and direct docking with tester environment, allowing our customers to observe parametric defect in static conditions and/or functional failures in real dynamic conditions.
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JEOL wafer and mask review tools improve yield management with unique capabilities that help rapidly detect minute imperfections and killer defects. 360 degree wafer edge review, high tilt, and fully automated rotation enhance the automatic defect classification capability of our high resolution, high throughput wafer inspection SEMs for 150-300mm wafers. JEOL provides a wide range of SEM based review solutions for the most advanced designs and highest throughputs.
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RAYEX®
RAYEX® is a highly developed system based on x-ray tomography. (Patents US 5 518 681, US 5 795 531, and CH 685 336 A5). During the extrusion process, RAYEX® measures the wall thickness, eccentricity, diameter, and ovality of multi-layer cables with XLPE and EPR insulation, multi-layer pipes with foam core, composite pipes, and multi-layer hose. RAYEX® systems have been in use for years on various production lines and processes with great success.
-Steam - or steam/nitrogen lines
-Catenary lines
-Vertical lines
-Horizontal MDCV lines ("long die")
-In Silane, Sioplast/Monosil processes
-In foam core pipe extrusion
Important Features:
-Measures thin semi-conductor and insulation layers down to 0.3 mm (.012 in.)
-Simultaneous and uninterrupted scanning in X and Y directions with highest precision
-High scan rate and screen update (every 1...3 s)
-Multi-colored, easy to understand display
-Automatic control, thanks to short measuring intervals
-High resolution and accuracy, thanks to "Micro Focus" beam and UMX x-ray source.
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X-ray Imaging for the Non Destructive Testing (NDT) market. More and more factories and research labs, faced with even stricter demands of quality and safety in all types of food and industrial products, are finding that non-conduct, non-destructive X-ray inspection is extremely effective in upgrading quality and safety since it detects tiny product structural flaws and foreign object contaminations - with no product damage whatsoever. Hamamatsu Photonics has a full line of X-ray sources and cameras for X-ray inspection of electronic components, industrial products as well as for a wide range of fields to meet needs in food
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Safeline X-ray Inspection offers complete product inspection, determination of contaminants such as metal, glass, stone, bone and plastic which preserves your brand integrity.
Safeline, a world leader in inline x-ray inspection offer a range of x ray machines for contamination detection, portion control and package integrity inspection for bulk, glass and packaged products in the food and pharmaceutical industries. All systems feature industry-leading detector and image processing technology, simple set up and use, user-friendly intuitive operator interfaces and sealing to IP65 as standard, IP69K optional.
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PROx, A Family of X-Ray Inspection Systems
The Thermo Scientific PROx is the next generation in a long line of powerful and flexible x-ray food protection systems. Due to it’s unique design, it provides industry-leading detection of product defects including a wide range of contaminants and product assembly errors. It was engineered utilizing our 20+ years of experience and comes with many new improvements such as a larger touchscreen, high speed USB port, faster processor and improved performance in harsh environmental conditions.
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The RETINAMATIC 2000 equipments are in use for the detection in real time of foreign contaminants as stones, metals, glasses, plastic, etc. In already stiff products or bulk productions with judging sensibilities that can come to 0.5mm (diameter of sphere) depending on the characteristics of the product (density of the same one).
The area of industrial application is indicated for the sectors of food: conserve, pre-coocking, frozen, 4th range, etc.), pharmaceutical, cosmetic, detergents, aerosols, etc...
This equipments allow to inspect different formats of products presentations: groups inside box, bags and metallized trays, carton, tin, etc., covering a great variety of widths and heights of product configurables.
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Offering contamination detection of foreign objects and assuring product integrity, the InspireX R20 x-ray inspection system for conveyorised products protects your brand from costly product recalls and ensures the product leaves the production line in perfect condition.
Description
InspireX R20 x-ray system is capable of gross and zoned portion control, seal inspection for product freshness, and scanning for damaged or missing items for product quality ensuring your brand integrity. Safeline’s innovative approach to product inspection minimises downtime and reduces false reject rates increasing productivity. Full traceability is offered by the unique user sign in and event log system. An inspection width of 300mm is available suitable for single or multiple lane inspection, in a variety of configurations with a choice of reject mechanisms to suit your individual application.
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