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Peter Wolters is the leading manufacturer of high precision machine tools and systems for Fine Grinding, lapping, honing and polishing applications for flat workpieces. Since 50 years our mission is to supply the market with highest quality products, prime service and production solutions. The product range is completed by combined grinding and brush deburring systems which have been developed for the final surface optimisation of fine ground and stamped workpieces. Decades of experience enable us to supply you with tailor-made setups for high productivity precision systems.
Peter Wolters fulfils your requirement of workpiece processing in respect of surface quality, parallelism, flatness and thickness variation. We offer solutions that will give you competitive advantages in your markets.
The philosophy of Peter Wolters as innovation leader is to break through process limits, working together with our customers on a regular basis. Therefore, Peter Wolters is equipped with process laboratories including specific engineering and equipment resources and state-of-the-art measurement technology. Today’s innovations are tomorrow’s progress.
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Lapping and polishing tools made of wood
These tools made from hard and soft wood can be
used rotating or linear (in hand-filing machines.
Through profiling, these bobs can also be used on
radii or similar.
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General description :
Specifically designed for unique polishing, delayering and planarization applications where R&D, prototype and small volume processing is required, Engis Microtech systems are available in both AM-15 benchtop and MPC floor-standing models. Each MPC system provides the kinematics and control required to develop processes that have 6-Sigma capability for material removal, flatness and surface finish generation. The menu-driven microprocessor control allows any polishing, delayering or planarization process to be fully optimized. The oscillation system provides 3-axis motion for true CMP kinematics.
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Lapping Plate Facing Machine UTD-420
This is a specialized machine with the purpose of conducting correcting-process of lapping plates for magnetic head slider into flat, healing, and sphere shapes and conducting spiral-grooving-process on lapping plates with high precision.
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The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially designed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table.
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