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600HTL TURBO LAPPER®
Gleason is proud to offer the 600HTL TURBO LAPPER® Hypoid Lapping Machine, bringing a new dimension of features and process capability to the lapping process. This fast and flexible machine offers new levels of productivity to the automotive, industrial and truck markets. Reduced cycle-times, efficient and powerful software, and a robust compound handling system are some of the features that make this the lapper of choice around the world. |
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Peter Wolters is the leading manufacturer of high precision machine tools and systems for Fine Grinding, lapping, honing and polishing applications for flat workpieces. Since 50 years our mission is to supply the market with highest quality products, prime service and production solutions. The product range is completed by combined grinding and brush deburring systems which have been developed for the final surface optimisation of fine ground and stamped workpieces. Decades of experience enable us to supply you with tailor-made setups for high productivity precision systems.
Peter Wolters fulfils your requirement of workpiece processing in respect of surface quality, parallelism, flatness and thickness variation. We offer solutions that will give you competitive advantages in your markets.
The philosophy of Peter Wolters as innovation leader is to break through process limits, working together with our customers on a regular basis. Therefore, Peter Wolters is equipped with process laboratories including specific engineering and equipment resources and state-of-the-art measurement technology. Today’s innovations are tomorrow’s progress.
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Lapmaster's lapping/polishing machines, when used with conventional abrasive, diamond superabrasive, or polishing media, can remove stock and finish virtually any solid material to your required specifications.
Our machines are engineered to lap surfaces so flat you can measure them in lightbands. . . surfaces so smooth, it is possible to get leak- proof mating without gasketing. Lapmaster's lapping and polishing machines provide the proper balance between rate of stock removal, finishing and flatness. |
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Aero Lap enables automatic slickenside mirror finishing for irregular
shapes of punches, dies, pins and small-sized moulds by applying unique
technology to accomplish the task that was previously performed
almost entirely by manual labour.
Technology
Obtaining elasticity and adhesion by applying multi-solution and
enable to polish and rub bythe composite abrasives (Multi-Cone), which
are gliding on the work target surface at high speed. |
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The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially designed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel - the water is sucked onto an air floating table. |
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Lapmaster’s “systems approach” provides a complete line of processing wherewithal which includes machinery, accessories, consumables & services to process primary & secondary wafers, lenses and other components that comprise “Advanced Materials” Applications.
Lapmaster is aware of the individual requirements that each of the above developmental and processing centers mandate. Based on these separate needs, we have developed equipment, optional features and accessories to address those needs. However, there are three common goals that we always maintain during our product development:
- Constant Improvement of Device Quality
- Enhanced Yield & Productivity
- Reduced Cost per Device
Lapmaster’s initiative to address the needs of the Advanced Materials Applications developmental and growth centers can be summarized in five product-service categories:
Specialty Machinery
- Wafer Thinning Systems
- Back-Grinding Systems
- Lapping Systems
- Polishing Systems
- Planarization Systems
- Wafer Edge Grinder
- Wafer Edge Polisher |
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