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5G CUTTING TECHNOLOGY
This high-performance laser cutting system features specific linear-drive motors and generates an acceleration of 5G. Its laser oscillator is equpped to handle cutting of thin and medium sheet metal parts during high-speed processing. Provided in standard in a shuttle table configuration or with an ASLUL storage system, FOL will boost your productivity with its unmatched performance.
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Workstation
Clean Room compliant Class i enclosure
Pressure sensitive joystick for mask navigation
Ultra fine thumbwheel focus override
Available mask Auto Loader and Mini-Environment
Advantages
Unique Ultrafast Femtosecond Laser
Image Processing Sub-micron Repairs and Other Machining Applications
Laser Ablation and CVD
Repairs without Subtrate Damage, loss of DUV Transmission, Splatter or Edge Roll-up
Advanced Platform and Motion System provides vibration isolation
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Features:
Laser type : CO2, sealed laser tube, water-cooled
Laser power : 70W
Laser wave length : 10,6 um
Working area : 1200*600 mm
Maximum moving speed : 50000mm/min
Highest scanning precision : 2500 dpi
Locating precision : +/-0,01mm
Speed control adjustable between 0,01 and 100%
Linear guides
Driving belts
Fumes extractor
Front and back opening for long materials and rolls
Stand alone working (without computer)
Air compressor for the laser head
External dimensions: 1200*1820*1040mm (depth, length, height)
Weight: 285 kg
Power supply : 220 v 50 Hz
Ethernet connectivity
Control software : lasersoft
Operating system compatibility: Windows 98, 2000 and XP
Supported interchange file format: PLT, BMP, DXF
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Features:
Laser type : CO2, sealed laser tube, water-cooled
Laser power : 70W
Laser wave length : 10,6 um
Working area : 1500*2500 mm
Maximum moving speed : 50000mm/min
Highest scanning precision : 2500 dpi
Locating precision : +/-0,01mm
Speed control adjustable between 0,01 and 100%
Linear guides
Driving belts
Fumes extractor
Front and back opening for long materials and rolls
Stand alone working (without computer)
Air compressor for the laser head
External dimensions: 3000*2000*1200mm (depth, length, height)
Weight: 500 kg
Power supply : 220 v 50 Hz
Ethernet connectivity
Control software : lasersoft
Operating system compatibility: Windows 98, 2000 and XP
Supported interchange file format: PLT, BMP, DXF
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DEDICATED TO QUALITY
The LC3015 X1 NT combines rapidity, accuracy, reliability and cutting quality. It satifies versatility and flexibility requirements, is highly effective for a wide range of processing thicknesses and metal types. Its productivity can be increased thanks to autostorage systems ASLUL.
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CUTMASTER
Micrometer adjustable or programmable focus
Completely sealed to eliminate contamination
Quick change focusing lenses to accommodate multiple processing
Gas assist
Economical
Capable of cutting, trimming, welding, scribing, slotting, drilling, & marking
No tool wear or breakage
Accurate and repeatable process control
Low operation cost
Quick set-up and change over
Minimized material loss
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For the last 10 years, HACO has build up a real expertise in industrial Laser Cutting Machines and applications. To meet the evergrowing laser market and its cutting quality requirements, HACO has developed compact, high performing and reliable CNC Laser Cutting Centers.
The monobloc frame structure, with built-in laser source, integrated electronic, electrical, pneumatical and mechanical compnents results in a stable and compact machine.
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MultiCam laser series machines are flying optic sheet cutting systems. These large format systems are capable of vector cutting and raster engraving. The welded, stress relieved all-steel frame insures rigidity and structural integrity under the most demanding conditions. Percision digital AC brushless servo drives and helical rack and pinion allow for smooth and accurate high speed cutting. The power ranges are 400 watts (water cooled), 200 watts (water cooled), and 100 watts (air cooled). To learn more about MultiCam's CNC Laser systems click the navigation to the left or an image below.
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Guaranteed top world class, fully industry standard laser cutting experience...
Technical Features:
- Super large working area highly improve productivity
- Imported 200W laser tube
- High rigidity aluminum gantry structure
- High precision ball-screw transmitting system
- Fixed optic beam passing system guarantees the cutting quality is same in the whole working area
- MITSUBISHI servo system imported from
- FTU handheld control panel
- High quality chiller specialized for laser system
- Specially designed software with perfect compatibility
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Low-Cost Entry-Level System with Advanced Laser Technology for High Flexibility
Made in Germany 1 kW CO2 Laser
complete system with capacitive height sensing, high-pressure optics for oxide-free cutting, automatic eye shield positioning, and coolant regeneration
cutter head can be used as scriber, so parts can be cut and scribed in one setup.
dual-processor technology allows simultaneous machining and program setup for the next machining
task directly at the machine control panel - saving significant time
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Specifications:
- Optical positioning system utilizing servo driven ballscrews, optional linear motors
- Designed to accommodate sheet with optional web processing
- Total work support of 1422.40mm x 1422.40mm (56" x 56") with a maximum cut size of 1371.60mm x 1371.60mm (54" x 54")
- Single "flying optic" cutting head; optional dual cutting heads to produce one or two identical, and simultaneously cut patterns with adjustable 152.40mm to 685.80mm (6" to 27") beam spacing
- Single unitized frame for laser, beam delivery, motion system and control system
- Operator interface to a movable arm located and easily accessible within the operating area
- Top side and bottom side (work support) fume extraction
- Deep vacuum designed for various work support requirements and useable for various materials
- PC-based Preco AcuNav™ controller with 2 controlled axes
- Exceptional dynamic performance (high productivity with good accuracy) in cutting holes and tight geometry.
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MD CARTESIAN is a laser system dedicated to cutting and welding works on components of medium dimension, with complex joining geometry too. The cell is a 3 or 5 axis system, with a Cartesian configuration.
It is possible to use both CO2 laser sources both Nd:YAG laser sources with different powers according to the specific applications.
The cell has two interchangeable optic groups for cutting and welding works. The two optic groups are special modules, realized by RTM, provided with circuits for the cooling of the mirrors and the adduction of the shielding gases.
In the base solution the principal characteristics are: 3 axis machine with movements obtained by ball bearing screw and top quality brushless motor checked with encoder; flying optics: allows to obtain many different configuration with a special focusing head studied according to the need of production;- axis control board with high performance processor; protection cabin for total safety with interlock elements on all access.
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Adira QHD press brakes, C type, present a remarkable step forward in relation to conventional press brakes.
The combination of two exclusive systems, resulting from simple ideas, allow for an excellent performance seen on the highly accurate bends and the better control of the bending angle:
CPS system in optimised combination with AF Wizard® allows for the teaching of the obtained angle by adjustment on the first bend.
As result of a thorough concept the precision and repeatability of the bending depth are excellent, independently of the bending length and temperature variation.
We recommend BL or LS versions equipped with protection by laser beams for increased productivity and maximum safety.
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The MicroLas plants is conceived for cutting very precise and form-fastidious parts in the modern sheet metal working. An easy building method of the plant ensures very good dynamic characteristics. Combined with an electronic torch this modular laser cutting machine knows even cuts from 0,5mm to 30 and/or 40mm material thickness completely.
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The Laser Dicing System is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications.
The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine including fast quality check (control of kerf width, position and roughness).
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- fully automatic loading and unloading for lightly manned shift working, optionally with integrated stock control system
- shortest of amortization times
- transparent job processing and stock management
- high level of process security and work safety
- application-specific, modularly expandable system
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