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WS position sensors capture position measurement either absolutely or incrementally, using measuring cables made from stainless steel. Using different constructions, and with measuring lenghts of up to 60,000 mm, the ultra-simple, sturdy, space-saving designs make these sensors the ideal basic solution for many length and positional measuring tasks.
Technical advantages:
Fast and easy to assemble, only minimal linear guidance required, compact design, resistant to vibration and shock, high protection category to IP68, linearity of up to 0.01%, high measuring speed upt to 20 m/s, mearuting lenghts of up to 60,000 mm, many output types.
WS positions sensors ensure reliable operation in many sectors of automation, process engineering, industry and research, e.g. in handling systems, circular saws, printing presses, aircraft testing, automobile testing, elevator technology, conveyor belt technology, warehousing technology, local transportation vechicles, tunnel-boring machinery, wind power plants, rehabilitation technology, medical engineering, patient beds, etc.
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Stout, easy to install, highly protected against environmental agents: linear wire transducers are the ideal solution for those industrial applications which require high accuracy and measuring length up to 12 m.
ELAP proposes two types, with potentiometer (series HPS) or encoder (series HLS) output, and three different sizes (S, M, L).
For all the types the transducer consists of a strong stainless steel wheel covered with nylon.
- Stout
- Easy to mount
- Measures from 200 mm to 12 m
- High protection degree
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Draw-wire displacement sensors measure linear movements using a highly flexible steel cable. The cable drum is attached to a sensor element which provides a proportional output signal. Measurements are performed with high accuracy and high dynamic response. The use of high quality components guarantees a long life cycle and high operational reliability. MICRO-EPSILON offers a wide selection of draw-wire displacement sensors with numerous types of output signal. This means that each customer has the opportunity of selecting the best sensor for his application. Choose between analog and digital outputs to optimize your individual measurement task. OEM-solutions for
customized integration possible. wireSENSORs are application friendly due to the excellent measurement range to size ratio and the fact that they are easy to mount and use. The rugged sensor construction ensures reliable operation even under difficult ambient conditions. Measuring ranges between 50mm and 50m are available.
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The DLS series of draw-wire linear position sensors are a cost effective way to measure linear displacements up to 5000mm in the most demanding industrial environments.
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SIKO wire-actuated encoders are a perfect measurement solution thanks to their state-of-the-art, fail-safe technology and effortless integration. They are suitable for a wide range of measurement tasks under very varied conditions. Their sturdy design and wire types guarantee an exceptionally long, maintenance-free service life.
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- Voltage output, Current output or Potentiometer output
- High repeatability, Can be combined with incremental, absolute or fieldbus encoders
- High repeatability, Can be combined with incremental, absolute or fieldbus encoders
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The Series 925 Linear Cable Reel Sensor can be used in any linear application up to 1200 inches. The system consists of a heavy-duty spring motor assembly attached to a precision-machined cable drum. As the cable is pulled off of the precision drum, the drum rotates a shaft connected to it. The shaft is precisely geared such that the full number of revolutions of the drum is equal to the appropriate number of revolutions required by the chosen sensor. There are three basic models. The Series 925 Linear Cable Reel Sensor can be used with our Series 1746 Resolver Input Card and a Series 2120 PLC Transducer Module.
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These sensors have size, weight, and installation advantages over traditional rod-and-cylinder transducers such as LVDTs and linear potentiometers. They offer easier mounting than rotary synchro and RVDT sensors. Tested to DO-160D/ED-14D successfully.
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The Celesco SP1 and SP2 String Pots and SE2 String Encoder, are compact, economical and durable.
These sensors are designed for tight spaces, high-cycle applications and generously allows cable misalignment. With 4 different measurement ranges and handy mounting brackets, the S Series is a perfect solution for many applications, from light industrial to OEM.
Output Signal Options: Voltage Divider (potentiometer), Incremental Encoder
Measurement Range Options: 0-4.75 in., 0-12.5 in., 0-25 in., and 0-50 in.
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IDEACOD, the leader of the rotary sensor, offers also solutions with linear sensor. The sensor with cable does not need precise linear guidance. It is especially adapted to severe industrial environment : iron and steel industry, metallurgy, industry of wood (sawmills, joineries), etc... Principle of operation : a cable of measurement out of stainless steel, of great flexibility coated with a film polyamide, is rolled up and been held on a drum of precision. With the cable of measurement is associate interdependent of the drum, an optical encoder, of technology incremental, absolute, analogical or potentiometric..
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IDEACOD, the leader of the rotary sensor, offers also solutions with linear sensor. The sensor with cable does not need precise linear guidance. It is especially adapted to severe industrial environment : iron and steel industry, metallurgy, industry of wood (sawmills, joineries), etc... Principle of operation : a cable of measurement out of stainless steel, of great flexibility coated with a film polyamide, is rolled up and been held on a drum of precision. With the cable of measurement is associate interdependent of the drum, an optical encoder, of technology incremental, absolute, analogical or potentiometric..
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Bondjet BJ820
The Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, handling all challenging wire bonding applications on a single platform - RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon.
High Speed Fine Pitch Wedge Bonder
Precision:
- 1 μm at 3 σ axis repeatibility at an interpolated encoder resolution of 20 nm
Largest Bonding Area
- 305 mm x 410 mm (12'' x 16,1'') work area can serve as two or mor smaller stations for efficient handling of smaller products or substrates, eliminating index time and maximizing throughput
- Enables intelligent automation of extra large products
Speed:
- Up to 7 wires per second
Quality:
- Consistant performance for the highest yields
- Realtime bond quality monitoring system
- Wear- and maintenance free piezo bondhead with solid state hinges
- Software supports control by host computer, product traceability and external statistical analysis
Small footprint, big capability:
- Integrates easily into complex production lines
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Bondjet BJ920
The Bondjet BJ920 is a nex development in heavy wire bonding. Hesse & Knipps has designed a bonder available with integrated pull and shear test, a high speed and accuracy and largest bonding area which is presently unique in the market. Advanced features available only on Bondjet BJ920 and enhanced quality control systems serve to meet your customers' requirements and greatly enhance productivity.
Advanced Features:
- E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Quality monitoring by high resolution deformation and transducer current measurement
- Program upload and download via LAN
- Flexible multi-lane handlers
Integrated Non-destructive Shear and / or Pull Test:
- Fast shear test with less stress for the connection than pull test
- Programmable pull test for each wire
Speed:
- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)
Accuracy:
- 10 μm at 3 σ repeatibility at each position in the large work area
- 7 μm pattern recognition system accuracy
Largest Bonding Area:
- Up to 380 mm x 500 mm (15'' x 19.7'')
Bondhead Highlights:
- Maintenance-free solid state joints
- Active cutting bondhead with extended cutter lifetime
- No pusher provides better access into tight packages
- Closed loop force control, programmable from 0 to 1400 cN
- Touchdown and deformation sensor without signal delay
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Panasonic's DMX is a world-class, high-productivity die bonder supporting 200mm and 300mm wafers. The eight-nozzle head system offers unparalleled productivity, providing results that are nearly 300% greater than conventional die bonders. The 3-beam mechanism and multi-nozzle bond head provide substrate recognition and both pre- and post-bond inspection.
The high-speed and volumetric epoxy writing system provide for increased productivity of up to 8,000 UPH (actual cycle). Seven (7) standard patterns are installed with free pattern programmability. Multi-beam parallel processing supports wafer (die) recognition, multi-nozzle bonding and substrate recognition (pre- and postbond inspection).
Features & Benefits
Flexible for ultra thin die, Semi S2/S8 option
Near zero transport time for increased machine utilization
Wafer mapping software capability
High speed positive displacement dispensing
Accurate to +/- 25 microns, die size: 0.25mm to 25.4mm
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Model 616A Peg Bonders are used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine. Bare wire diameters equal to or smaller than 75um, insulated wires up to 51um and flat conductors up to 25um x 500um can be bonded with the 616A.
The 616A has a series of seven different configurations that allow it to fit into existing production lines, single work benches or new production lines.
For more information, please contact us at mailus@hybond.com.
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The 626 can be a Wedge bonder (wedge-wedge), Ball bonder (ball-wedge), Peg bonder (for tacking down pre-aligned leads, ribbons and bare or insulated wires) and a Bump bonder (gold stud bumping) without having to remove or replace any electrical or mechanical machine component. Conversion time from Ball bonder to Wedge bonder or vice versa is the same as the time spent replacing a used tool with a new one.
With servomotor control, touch sensor and linear vertical movement, the 626 bond head can move and bond within a 0.750” vertical range without the need to readjust the work stage or bonder platform height. The 626 also has LCD display with parameters in actual units, storage in memory for up to 75 different schedules (or “recipes”) and independent 1st and 2nd bond digital parameter settings. All these features and yet it’s smaller, weighs less and is more cost effective than most other wire bonders.
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Hybond designs, manufactures and sells ultrasonic and thermosonic wire bonders. Products include:
Ball Bonders: for ball bonding and bump bonding of gold wire.
Wedge Bonders: for bonding of gold, aluminum, platinum, copper and other material wires and ribbon (flat wire).
Peg Bonders: Used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine.
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