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Integrated, In-line Diffusion System - DCF Series
Integrated, In-line Diffusion System
The new, Integrated, In-line Diffusion System is Despatch's latest addition to the company's photovoltaic product portfolio. The new in-line diffusion systems are designed to consistently deliver highly homogeneous emitters that are critical for creating high efficiency solar cells.
The production of the DCF Systems represents an important advance in the solar cell manufacturing process by integrating the following into one single piece of equipment:
A patent-pending, in-line phosphorus doper that utilizes top and bottom spray technology
An infrared diffusion furnace featuring a patent-pending thermal processing chamber
Critical process technology
The new integrated systems are recognized for superior thermal processing control, improved cost of ownership, value-added feature sets and ease of maintenance. These special features provide customers with high throughputs and maximum yields. |
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Uniform, Repeatable Thermal Processing
Axcelis' Summit XT covers a broad range of advanced thermal processing needs for transistor formation in and beyond the 65nm technology node, including anneals for:
-Ultra shallow junction formation
-Dry oxidation
-Nickel silicide
-Shallow trench isolation (STI) oxides
-Titanium nitride (TiN) densification |
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Beside the precise pressure of the solder paste and the exact Pick and Place, the soldering constitutes the most sensitive and most important process at the development of a PCB. Here the producing batch size certainly plays as well a decisive role, as the underlied technology (general components, FinePitch-, Ultra-Fine-Pitch-, BGA- or even special components).
In line with the broad spectrum of our different Print and Dispensing systems and the different possibilities to Pick and Place we also offer two systems for SMD-soldering.
This is on the one hand the smaller convection oven 538 DF (table-top) and on the other hand the standard device 548 DF for higher quantities. In general this is used in lines with machines.
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Specifications for Heller 1809EXL:
Overall LengthWidthHeight: 183" (465 cm)54"(137cm)63"(160 cm)
Typical Nitrogen Consumption: 700 - 900 SCFH @ 500 PPM
Maximum Board Width Standard: 22" (55.8 cm)
Top Heating Zones: 9
Bottom Heating Zones: 9
Number of Cooling Zones Standard: 2
Temperature Range Standard: 25-350° C
Heated Length: 105" (254 cm)
Maximum Conveyor Speed: 74"/Min (188 cm/min.)
Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software
Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System and more.
The 1809EXL- from Heller's newest generation of reflow ovens- provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The 1809EXL features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven. It also provides more flexibility in board handling and robust construction.
The 1809EXL supports high-speed, high-volume throughput… at speeds up to 40 inches (one meter) per minute… while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. |
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Specifications for Heller 1913 MKIII:
Overall LengthWidthHeight: 232"(589cm)/54"(137cm)/63"(160 cm)
Typical Nitrogen Consumption: 500 - 700 SCFH @ 500 PPM
Maximum Board Width Standard: 20" (50.8 cm)
Top Heating Zones: 13
Bottom Heating Zones: 13
Number of Cooling Zones Standard: 4
Temperature Range Standard: 25-350° C
Heated Length: 140" (355.6 cm)
Maximum Conveyor Speed: 74"/Min (188 cm/min.)
Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software
Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System
Heller Industries the recognized World Leader in Reflow Soldering Oven Technology announces a true breakthrough in Reflow soldering technology with the new Mark III series. With over 12,000 systems installed worldwide, Heller has been at the leading edge of Forced Hot Air Reflow soldering technology development since 1987.
Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications. The Mark III system is yet another major advancement with innovative Technologies including:
-Lead Free Certified Systems
-Maintenance Free Systems
-Lowest Cost of Ownership
-Best Return on Investment
-Integrated Cpk Software
-Local Support |
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Heller 1809 MKIII Specifications:
Overall LengthWidthHeight: 183"(465cm)/54"(137cm)/63"(160 cm)
Typical Nitrogen Consumption: 500 - 700 SCFH @ 500 PPM
Maximum Board Width Standard: 20" (50.8 cm)
Top Heating Zones: 9
Bottom Heating Zones: 9
Number of Cooling Zones Standard: 3
Temperature Range Standard: 25-350° C
Heated Length: 105" (254 cm)
Maximum Conveyor Speed: 74"/Min (188 cm/min.)
Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software
Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System, and more.
Heller Industries the recognized World Leader in Reflow Soldering Oven Technology announces a true breakthrough in Reflow soldering technology with the new Mark III series. With over 12,000 systems installed worldwide, Heller has been at the leading edge of Forced Hot Air Reflow soldering technology development since 1987.
Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications. The Mark III system is yet another major advancement with innovative Technologies including:
-Lead Free Certified Systems
-Maintenance Free Systems
-Lowest Cost of Ownership
-Best Return on Investment
-Integrated Cpk Software
-Local Support |
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1707 MKIII Specifications:
Overall LengthWidthHeight: 134" (340 cm)/54"(137cm)/63"(160 cm)
Typical Nitrogen Consumption: 500 - 700 SCFH @ 500 PPM
Maximum Board Width Standard: 20" (50.8 cm)
Top Heating Zones: 7
Bottom Heating Zones: 7
Number of Cooling Zones Standard: 1
Temperature Range Standard: 25-350° C
Heated Length: 72" (183 cm)
Maximum Conveyor Speed: 74"/Min (188 cm/min.)
Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software
Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System
Heller Industries the recognized World Leader in Reflow Soldering Oven Technology announces a true breakthrough in Reflow soldering technology with the new Mark III series. With over 12,000 systems installed worldwide, Heller has been at the leading edge of Forced Hot Air Reflow soldering technology development since 1987.
Heller utilizes a partnership approach with their customers to develop user-initiated solutions for real world applications. The Mark III system is yet another major advancement with innovative Technologies including:
-Lead Free Certified Systems
-Maintenance Free Systems
-Lowest Cost of Ownership
-Best Return on Investment
-Integrated Cpk Software
-Local Support |
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Heller 1707 EXL Specifications:
Overall LengthWidthHeight: 134"(340cm)54"(137cm)63"(160cm)
Typical Nitrogen Consumption: 700 - 900 SCFH* @ 500 PPM
Minimum/Maximum Board Width: 2" - 20" (5 - 50.8 cm)
** Requires 30" Heater Modules : 24" (61 cm)**
Top Heating Zones: 7
Bottom Heating Zones: 7
Number of Cooling Zones Standard: 1
Temperature Range Standard: 25-350° C
Standard Features:KIC Profiling Software,Power Width Adjustment, Auto Lubrication System, Three (3) Thermocouple Profiling, Powered Hood Lift, Signal Light Tower, KIC Profiling Software
Optional Features:High Temperature Up to 450°C, Computer Controlled Width Adjust, Center Board Support, Waterless Cooling w/ Flux Separation System
The 1707EXL- from Heller's newest generation of reflow ovens- provides 25% higher airflow for enhanced temperature uniformity, repeatability and high-load handling. The 1707EXL features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven. The 1707EXL supports high-speed, high-volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. |
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