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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs
Wafer Specifications
* Diameter: 200mm and 300mm.
* Material: All Semiconducting and Semi-insulating materials.
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
* Flat/Notch: All SEMI Standard Flat(s) or Notch.
* Conductivity: P or N Type.
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.
Measurements
* Thickness and TTV.
* Bow
* Warp
* Site and Global Flatness
Advantages
* Cost effective alternative to fully automated tools.
* Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
* Standard Windows® User Interface.
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PV Series
Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer.
Wafer saw mark detection and classification is accomplished by adding optional laser sensors to the PV-1000 module. Utilizing up to two of MTII's industry leading Microtrak - SA standalone laser heads, saw marks can be classified for orientation and depth simultaneously with wafer thickness scanning making the PV-1000 ideal for incoming wafer characterization and sorting.
Integrated data acquisition and control electronics analyze and transmit wafer data via the on-board Ethernet port at speeds of up to five wafers per second. The digital I/O port allows communication with wafer handling equipment for up to 64 classes of wafer sorting and binning. Remote monitoring capabilities allow you to see your production line data across your network or directly at the module.
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Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding the wafer.
Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)
Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.
Wafer Specifications
* Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
* Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned
* Flat/Notch: All SEMI Standard Flat(s) or Notch
* Conductivity: P or N Type
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape
Measurements
* Thickness and TTV
* Bow
* Warp
* Site and Global Flatness
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The pcba|inspector is a high-resolution microfocus X-ray inspection system designed for inspecting solder joints in board assemblies.
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Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation
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Powerful digital and analog capabilities make the FaultFinder system a leading PCB fault analysis and diagnostic system. With rapid and excellent return on investment the FaultFinder is ideally suited to PCB repair and failure analysis environments. Having 152 test channels dedicated to synchronised active driver cards. Analog Network Signatures, and Digital Guards, the FaultFinder provides extensive circuit analysis capability without the need for test fixturing. Further flexibility is provided by the optional 1149.1 compliant XJTAG Boundary Scan software.
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With its newly developed unique multi-directional detection optics unit, the LS-6800 / LS-7800 Wafer Surface Inspection tool achieves a detection sensitivity of 36nm (LSE) on bare silicon wafers.
This enables critical wafer inspection even at the 65nm technology node.
Features:
Detection Sensitivity: 40nm (PSL on Bare Silicon)
(36nm attainable)
Defect Classification: Crystal Defect / Particles
Scratches/ Particles
others
Detection Reproducibility: >99% (100nm PSL on bare Si)
Throughput (fast mode): 97wph (300mm)
75wph (200mm)
Display functions: Particle map, counts, histogram,
haze map, haze histogram,
others
Wafer sizes: 300mm, 200mm
(150, 125, 100mm optional)
(thin wafer chucking optional)
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The ml|inspector is a high-resolution microfocus X-ray system designed for inspecting multilayer boards.
Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation
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DE-F SERIES
Mask-less, New Matrix Beam scan method Suitable for general PWB process with excellent cost-performance
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Rudolph Technologies provides automated wafer edge top and edge normal inspection with throughputs of greater than 80 WPH (300 mm). The Class 1 certified system has an approximate 10 minute set-up time to be fully optimized and production ready. Featuring on-the-fly color defect image capture and intrinsic ADC capabilities, the E25 System can automatically detect and classify defects on the entire wafer edge, from the edge exclusion area to the bottom bevel. Both brightfield and darkfield illumination are available.
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Designed from extensive customer feedback, the MLTM Series MicroLoader is the most technologically advanced, reliable and user friendly tool available for wafer inspection.
At Syniad we are aware that each of our customers has individual requirements. The MLTM Series MicroLoader contains unique features which mean processes can be tailored to meet specific needs.
The MLTM Series unrivalled specification is as follows:
Dimensions 515mm x 630mm
Class one cleanliness
Cassette mapping
Syniad SmartLoadTM intuitive Software User Interface
Networked machine for data sharing
System Control
7 Axis Dedicated Motion Controller with 3 unutilised axes offering huge potential for custom applications.
Controller Area Network (CANopen) option for flexible extensions and enabled data sharing.
The option of Optical Character Reading (OCR) for individual wafer locating capabilities.
Easy implementation of wafer alignment and centralisation.
The option of a custom made base plate to mount the MLTM Series MicroLoader and any microscope
Standards are as follows:
Full SEMI compliance
Full CE complaince
Unrivalled Component Listing:
Industry leading elevator with:
Autosize 100mm - 200mm
Cassette mapping
Cassette present "Easy LoadTM" Indicators
Options available:
100mm - 200mm Autosizing Bridge Tool
Wafer centralisation
Wafer alignment
OCR: M12, M13 Barcode, T7
SECS/GEM integration
Map file import and export to the Manufacturing Execution System (MES)
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The Rudolph Wafer device combines both edge and backside inspection into one enclosure. It retains all the capabilities of the proven E25 and B20 System in one small footprint. The Class 1 certified system can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Recognising the rising cost in fab space Syniad Systems have developed a unique multipurpose inspection and sorting tool. The MultiSpecTM enhances the functions of wafer sorting, microscope inspection and bright light inspection all in a single small footprint tool. Customers are allowed to configure the tool to match their own unique requirements.
Example: A customer has a requirement for wafer sorting and bright light inspection. In this scenario, Syniad can configure the tool to "not" include Microscope Inspection and the sales price will be reduced.
Unrivalled Specification:
Dimensions: 1000mm x 700mm
Class 1 cleanliness
Cassette Mapping
OCR: M12, M13 Barcode, T7
UPS for continued operation after power out
Vacuum reservoir for continued operation after power out
Syniad SmartSpecTM intuitive Software User Interface:
Split, Sort, Merge, Wand Sorting functions
Bright Light Inspection Control
Wobble Chuck Control
Standards are as follows:
Full SEMI Compliance
Full CE Compliance
Unrivalled Component Listing:
Industry leading 3 axis robot
Industry leading pre-aligner with:
Linear Accuracy ±0.0025mm
Circular Accuracy ±0.05°
Integration with all microscope types
SEMI Standard Safety Light Curtains
Dual End Effector for maximum throughput
Cassette Present "Easy OnTM" indicators
Auto e-mail off-line configuration files
Options available:
100mm - 200mm Autosizing Bridge Tool
SECS/GEM integration
SMIF 200mm
SMIF and Open (on same tool) 200mm
Wafer thickness measurement (accuracy of 0.1µm)
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Applicable wafer sizes: 200 / 300mm
Hitachi's wide-area AFM series features a fully automated inline metrology instrument that combines 3 applications in one tool:
- Wide-area surface profiling up to 25mm square
- High-accuracy scanning from 0.1 to 10µm square
- High-aspect-ratio structure 3D metrology by Hitachi's patented Step-InTM mode
The WA-1300 can operate fully automated like a CD-SEM. Recipes include automated wafer handling from cassette-to-cassette, global wafer alignment by pattern matching on optical microscope images, target addressing by on-tip-axis optical microscope and/or rough orientation AFM scanning, and the intended measurement. Fully automated tip replacement is also provided.
3D structure metrology
In Hitachi's patented Step-In mode, the AFM probe does not move in transverse direction so that no lateral force is applied to the tip. This enables the use of ultra-thin and high-aspect ratio probes like even carbon-nanotubes and guarantees a distortion-free, accurate imaging of all patterns such as lines, trenches and contact holes.
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Advantages:
- Quality control of rough castings and machined crankshafts
- Manual loading and unloading
- Digital measured data processing
- Expandable with a correction unit
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The VT Series comprises the VT-5200 Series with AC powered operation and VT-5700 Series with ±15 VDC specifications. 4 kHz or 10 kHz output response frequency is provided depending on the model to enable you to select the most suitable frequency for your application.
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ProCam
Fast and easy crash vehicle measurement
* Mobile optical probe replaces conventional CMM or articulated arm
* For pre- and post-crash measurement, analysis and documentation
* Free movement around the vehicle without any additional alignment
* Easy measurement of hidden points
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| ... products without technical information |
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