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Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
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The FC300 High Force Device Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding on wafer up to 300 mm.
It includes Nanoimprinting Lithography (NIL) capabilities.
The FC300 is a configurable platform which can perform various applications with a quick and easy process head exchange:
high force bonding, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography,
low force for reflow bonding of RF & optoelectronics devices assembly,
UV-curing for adhesive bonding or for Nanoimprint using the UV-NIL process.
High End Processes
Die bonding, flip chip bonding, mass reflow, in-situ reflow, fluxless eutectic bonding, thermocompression bonding, ultrasonic bonding, UV-curing bonding, adhesive bonding,
UV-NIL, hot embossing lithography...
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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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An accurate high-speed flip chip bonder, the FCB3 accommodates a variety of needs. From development to pre-production and multiple-model production, this machine offers outstanding functionality.
The FCB3 features a simultaneous recognition camera that ensures accurate bonding in continuous production. Additionally, the automatic calibration function corrects thermal changes over time, guaranteeing bonding accuracy of ± 3 _m/3 sigma during continuous production.
Ideal for medium to very fine pitch manufacturing.
Features & Benefits
Flexible modular system accommodates various processes
IC feed from both tray and wafer optimizes productivity
Automatic tool changer with 4 input handles up to 38 types of ICs
Wide component range - from 2" x 2" (up to 320 inputs) to 4" x 4" (up to 80 inputs)
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KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding
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The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
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Chip inductor coil winding machine
Displayed Machine : NCI-0150
The NCI-0150 and NCI-0250 machines are specialized machines for inductor coil winding. The machine is controlled by 12-axis and is capable to wind multiple inductor specifications. Cross-winding is possible for transponder coils. The type of welding is selectable.
Features :
. Shortened cycle time by core supply, winding, welding and core unload simultaneous processing
. Consumes little floor space
. Reduced weight
. Indexer operated by direct drive motor. No maintenance required.
. NITTOKU`s original auto tuning system stabilizes welding temperature
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Thread cutting tools
HAND TAPS
3150V Standards set of 3 CV hand taps - ISO 529
3155V Set of 3 HSS hand taps - ISO 529
MACHINE TAPS
3160V HSS machine tap - standard point
3152V HSS machine tap - spiral point
3158V HSS machine tap - spirale flute
OUTILLAGE
3180V Adjustable tap wrench
9780V T-handle ratchet tap wrench
FILIERE
3170-3171V CV-steel adjustable round dies
3175V Metric HSS round dies
3172-73-74-78V NPT HSS round dies - briggs thread
3177-85-86V BSP HSS round dies - gas thread
3200V Die rock
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These sets consist of an assortment of Hexagon Rethreading Dies in American National form of thread. These dies are neatly packed in a wooden case.
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These sets consist of an assortment of Hexagon Rethreading Dies in American National form of thread.
These dies are neatly packed in a wooden case.
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Rolling dies exploit the plasticity of metal to form screws and serrations by rolling rather than cutting. This process maintains the integrity of the material by preventing damage to it structurally. The absense of cutting also makes this a high-speed process.
Consequently, many forms, serrations, and splines used in the manufacture of automotive parts are now made using rolling dies.
OSG is the world leader in the production of rolling dies renowned for their high quality and level of technology.
To request more information on this product, please visit our Literature Request Page
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Our extensive experience and wide-ranging technological knowledge of thread, profile and cold ring rolling is the foundation for being a qualified die manufacturing source. Whether you require standard or special dies for high quality profiles, Profiroll has the ability to supply and support you with the innovative visions of the company. You will get solutions to complex technological problems, all from one source. From the design and manufacturing to testing in our facility and support at the customers facility ? by utilizing our complete die manufacturing process, we can respond to your needs quickly. Quality control and customer service are important to us.
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Landis Replacement Dies Program
Now you can get that world-famous Landis quality in a replaceable machine die for practically every major cylindrical die competitive brand on the market today from “Plain Annular Threaded” dies to the most demanding "Specialty" dies…you name it…now you
can get it…from Landis.
Dies are available up to 9” nominal O.D. with bore sizes to 3”. Got a machine die you want us to quote on? Just use the handy "Quik-Quote" form or call us toll free at 1-888-565-0386. We want your business. Give us the chance to earn it. Call us with any inquiry! You won’t be disappointed!
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Automatically remove and elevate ferrous materials such as chips, turnings and small parts. Conveyor mechanism is totally enclosed. Wide variety of configurations can be assembled from standard design sections.
Chip & Parts Conveyor - Standard Utility Model 68
Standard model for lightweight material.
Chip & Parts Conveyors - Low Profile Permanent Magnetic
Control lightweight ferrous materials.
Chip & Parts Conveyors - Model 6
6-1/4 in. (159mm) deep housing to transport small volumes of chips.
Chip & Parts Conveyors - Model 9
9-1/4 in. (235mm) depth for greater volumes.
Chip & Parts Conveyors - Model 12
12-1/4 inch (311mm) depth for high volumes of chips.
Chip & Parts Conveyors - Model 21
21-1/4 in. (540mm) working width for high volume conveying.
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The conveyor Turbo Magnetic is specially designed for Multi-tasking machines producing fine chips of ferrous material. The Turbo Magnetic features a heavy gauge stainless steel slider face for a long life in extreme wear conditions. All moving parts are contained inside the conveyor’s viton sealed frame so they are never exposed to machining contaminates. The conveyor belt is automatically tensioned.
Self-lubricated Track
No lubrication oil inside the conveyor to leak and contaminate the coolant.
Reduced Coolant Carry-out
A variable speed drive (AC Inverter) is standard on all units to maximize chip removal and minimize coolant loss.
Easily-Replaceable Magnets
Turbo components, including individual magnet segments, are easily and economically replaced if the conveyor is accidentally damaged.
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Magnetic conveyor M
Areas of application
Transportation of short ferromagnetic, emulsion-afflicted shavings and small parts, e.g. stampings. Installation possible as individual conveyor or interlinked system.
Function
A continuous magnetic band conveyor, consisting of two chain strands which have been connected by means of carrying strips and permanent magnets, continuously conveys the material to be conveyed on the conveyor plate to the discharge station. Pre-cleaning of the cooling lubricant without additional cleaning elements. The magnetic band drive occurs via a three-phase geared motor. The magnetic band has been installed self-tight eningly.
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Heavy-Duty Magnetic Conveyors - For dependable, maintenance-free, positive transfer of ferrous metal scrap and parts with no carryover.
Features, Benefits, & Options:
- Conveys wet or dry ferrous chips, stamping slugs, stamping scrap, or parts
- Rugged, long life stainless steel slider bed
- Available in straight, L-style, or Z-style configurations
- Alloy steel bar tracks, precisely guide chain and magnetic assemblies
- Self adjusting drive chain take-ups
- Completely sealed, oil tight construction for quiet self-lubricating performance
- Available with permanent ceramic or optional rare earth magnets
- Extended height elevation and pivoting conveyors (to be inserted into your press) are also available
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Standard Duty Magnetic Conveyors - Low profile - Only 3 3/8 inch high! An economical alternative for less demanding applications. For dependable, maintenance free, positive transfer of ferrous scrap and parts with no carryover.
Features, Benefits, & Options:
- Conveys wet or dry ferrous chips, stamping slugs, stamping scrap, or parts
- Rugged, long life stainless steel slider bed
- Available in straight, L-style, or Z-style configurations
- Features a steel encased UHMW low friction track
- Quiet, self lubricating performance
- Supplied with permanent ceramic magnets
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Bunting MagSlide® Magnetic Slide Chip and Parts Conveyors are built to handle the tough jobs. Dirty, oily parts, jagged, abrasive scrap, and other punishing materials that could damage or jam conventional conveyors are no challenge for Bunting's 3-D CAD-designed, ruggedly constructed slide plate conveyors. They are ideal for use anywhere you need to transfer ferrous chips, turnings, and small parts from lathes, mills, or stamping presses or from slitting, forming, and other metalworking operations. Chain-driven, permanently charged high-energy Ceramic magnets inside the conveyor housing attract and move ferrous material along the conveyor's stainless steel faceplate. Optional water-tight housings can be submerged into almost any type of hot or cold liquid.
MagSlide Conveyors are engineered for trouble-free, virtually maintenance-free operation. There's no external belt to jam, tear, or wear out from carrying sharp, abrasive parts and scrap.
Get Outstanding Performance and Value
- Rugged construction
- Continuous chain lubrication with oil-impregnated UHMWPE SlideTrack™
- Oil ports to allow extended chain service
- High-energy Ceramic or Rare Earth Magnets matched to your application
- Durable stainless steel slider beds
- Sealed precision drive and take-up bearings
- Designed with 3-D solid-model technology
- Precision manufactured on CNC machines
- Optional submersible housings
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Ready-to-use centrifugal systems. The patented Vetamat® system separates the metal chips from the metalworking fluids.
Wet chips are shaken into the funnel and fed automatically into the centrifuge from there. The delivery includes the centrifuge with hydraulics, chip conveyor with tank, base pan and controller. The Vetamat® Plus system design also includes a chip crusher and a lift & tip device. Long chips are first filled into the lift & tip device by a chip transporter and then tipped into the chip crusher. The crushed chips fall into the funnel and land in the centrifuge.
Vetamat® systems achieve a throughput of 100 kg/h – 2,000 kg/h. Vetamat® systems are delivered ready to use.
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The screener is implemented to maintain system parts such as chip crushers, centrifuges and chip conveyors and to reduce blockages. It continuously and efficiently separates bulk parts from the chips. The bulk parts are ejected from the treatment process while the short chips can continue to be treated.
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Field of application
* fresh wood
* root stems
* compost
* barks
* domestic and bulky waste
* diverses
Advantages
* high mobility, strong construction
* short setup time
* fast changeable screen decks
* high throughput rate
Screen deck
* screen segments with separate hydraulic drive
* adjustable speed control
* 3 variable fraction sizes, for example 0 – 10 mm, 0 – 60 mm, 0 – 200 mm
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