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Fonon's Zero Width Laser Dicing Technology® (ZWLDT®) will cover unprecedented explosive growth and demand in semiconductor markets in China, Taiwan, Japan and Korea. This technology has lead to products, such as the BlackStar™, that offer the best in silicon wafer dicing over existing technologies.
ZWLDT® will slice the wafer much safer than mechanical saws that may cause wafer damage, and increase the yield per wafer as well as maximum throughput while minimizing the HAZ.
With the technology Fonon acquires, Fonon Display and Semiconductor Systems (FononDSS), has been able to launch a number of products that make the most of the technology for the semiconductor and flat panel display industry.
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- Diodes laser
- Laser power: 60, 90 or 120W
- Surface of the focal point 1 x 1.2mm
- Precision of the wire in-feed ± 2,5%
- Diameter of the soldering wire from 0.46 - 1.6mm
- Wire alloy leaded or lead free
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LPKF MicroCut
Capable of cutting any shape without burrs
The LPKF MicroCut is a high-performance stencil laser. The LPKF MicroCut is capable of cutting any shape at up to 50,000 openings per hour.
The laser can cut apertures as small as 30 µm with a roundness better than 96%, and its effective material focus diameter produces sharp contours.
As a result of the new cutting technology post-treatment is not necessary anymore.
Absolute flatness of the material is reached also with highest component density by the new LPKF PulsShape function.
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Panasonic's UV laser scriber has a complete laser optics bench that offers flexibility to fit the specific application - the result of PFSA's experience in high volume microelectronic manufacturing and expertise in productivity.
The laser scriber enables the non-mechanical scribing and dicing of wafers. Primary uses include application for low and ultra-low 'K' wafers as well as non-mechanical scribing over metalized portions in the wafer streets which enables smaller kerf widths - allowing for greater numbers of die per wafer.
The UV Scriber enables sample builds for next generation products and maximizes die-level densities to reduce costs and increase profits.
Features & Benefits
Low K scribing with superior quality over mechanical dicing
Next generation supported via sample builds
Configurable for development of future capabilities
Increase profits by optimizing die-level density
HVM capable today
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Laser Brazing Head YB50
Modular processing head for laser beam brazing
rugged components tested under industrial conditions
integrated protective window monitoring and Cross Jet
integrated sensor for process monitoring
can be expanded with an LPF Seam Tracking System
Laser Welding Head YW50
Process monitoring: laser power
Laser: Nd:YAG, ytterbium
Focal length collimator: 50 to 200 mm
Welding power supply, wire feed supply, torch hose pack: company CLOOS Schweißtechnik GmbH
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(2-Panel CO2 Laser)
World Champion of 2-Panel CO2 Laser
Drilling Machine manufacturers
To the world of High quality Cu direct drilling
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(CO2 Laser)
World Champion of 2-Panel CO2 Laser
Drilling Machine manufacturers
To the world of High quality Cu direct drilling
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Function
The ALD 01 laser depaneling system is equipped with a rotary table system for optimum separation of the individual processing stages. This method allows parallel processing of the individual tasks. Consequently, the only times relevant for the cycle time, are the time for the longest individual stage plus the time taken for the table to rotate from one position to another.
1. Handover of the panel from the inlet conveyor to the first position on the rotary table
2. Panel routing
3. Loading of individual routed PCBs onto the outlet conveyor
4. Tipping of remaining panel waste into the integrated waste container
The panel is transferred from the inlet conveyor to the first position on the turntable by means of a pneumatic X/Y/Z portal gripper system. The routing process utilizes a CO² Laser.
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Corning Tropel continues its tradition of providing innovative metrology solutions and tools to semiconductor wafer manufacturers by introducing UltraSort a patented wafer flatness analysis system for rapid, repeatable, accurate, non-qualification of wafers.
UltraSort continues Corning Tropel’s 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer manufacturing, this automated system offers the utmost in rapid, repeatable, accurate, non-contact qualification of silicon and alternative substrate wafers.
UltraSort is an automated wafer flatness analysis system that includes cassette-to-cassette wafer handling with user configurable sorting capability.
This Class 100 cleanroom compliant system integrates a grazing-incidence interferometer with industry standard robotic handling.
The UltraSort can be configured to measure wafer sizes from 2 inches to 8 inches in diameter, and is well suited for a variety of different materials including gallium arsenide, sapphire, quartz, germanium and silicon.
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Laser Depanelizer for stress free and flexible Cutting of PCB Panels
- Depanelizing with Laser Technology
- Stress- and dust free Process
- Low Process cycles, high throughput
- Simple Fixtures
- Cutting and Marking possible
- Cutting any shapes
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High-precision CSP and BGA checker jig plate drilling
Application extended to brittle material in addition to resin
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As a leading company in the PWB manufacturing systems industry, Hitachi Via Mechanics has been providing a broad range of products including PWB Mechanical Drilling Machines, Routing Machines and Laser Drilling Machines. We have also commercially introduced other products including Hole Analyzer and Printed-circuit Motherboard Products. Furthermore, we have been providing PWB manufacturing facilities, which are ready to address the needs of the highly-advanced information age. These solutions have an excellent reputation and have earned a high level of customer confidence.
LT Series
Laser trimming of embedded passive components on PWBs.
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General description:
The models 2000 / S / DPS / DPS-G / C / UV of the wafer marking system d IL 2000 are designed to mark various wafer materials with different diameters.
Different laser types and setups (solid-state laser, CO2 laser, UV laser etc.) are available to vield optimum process results for different wafer materilas such as Si, GaAs, Ge, GaP, InP, Sapphir, Quartz and others.
The IL 2000 provides "Deep" marking (marking depth up to 100µm) as well as "debris-free" marking (0,3 - 6µm). A powerful software package, developed in cooperation with many customers over the past 10 years, offers immediate operating solutions for most customer applications.
The model 2000 X (Die Marking System) adds specially developed Die marking software and a linear X/Y-table to the standard components of the 2000 series. These enhancements allow the 2000 X to accurately mark each die on the wafer (e.g. for processing of high-end-components).
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A new generation of advanced circuit board plotters
LPKF ProtoMat S62
The LPKF ProtoMat S62 introduces a new era of state-of-the-art circuit board plotters for in-house rapid PCB prototyping. This compact high-speed system provides superior performance for quickly and easily manufacturing circuit board prototypes in a single day. It is an advanced and very affordable PCB plotter that includes features usually found only on much more expensive systems.
The LPKF ProtoMat S62 delivers unmatched precision with system resolution as fine as 0.25 µm (0.01 mils). As a result, the plotter can mill and drill PCBs with extremely fine traces, including RF and microwave boards. Its milling head travel speed of 150 mm (6”) per second and high-performance 62,000 RPM spindle motor makes it a premiere high-speed performer for producing quality PCBs in-house. Its motorized Z-axis drive also makes it an ideal tool for machining instrument front panels and housings, and for reworking and depanelizing bare and populated boards.
Whether the project is a two-sided board or a multilayer board, or it involves machining three-dimensional objects like front panels, the S-Series plotters are indispensable prototyping tools that deliver a finished product of the highest quality.
Setup and operation of the S-Series plotters is intuitive and easy to learn, thanks to their advanced and convenient design, comprehensive documentation and intelligent board production CAM software.
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