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The LSS series of laser stencil cutting machines is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of any stencil size.
The laser stencil cutting machine has a Gerber interface and the data can be automatically transferred to the NC controller. |
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The Laser Dicing System is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications.
The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine including fast quality check (control of kerf width, position and roughness). |
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Waterjet cutting is particularly advantageous where conventional methods only provide insufficient quality. No further additional costs due to reworking or lower processing speed. Since during the cutting no gases or vapors are generated, the method is also safe, clean and environmentally friendly.
Modern waterjet cutting systems continually boost the process optimization and quality improvement in the processing industry. |
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| Control Systemation maintains an extensive software development department staffed with experienced software engineers. No task is too small, nor too large or complex. From vision systems and databases to full factory automation CSI has been in the forefront of Automation Design. We design, test, and have shipped more than 200 custom software projects a year to industrial, medical, aerospace, automotive, and electronic industries. We specialize in Databases, Host Communications, Vision System Interfaces, Inventory Control, User Interfaces, Robotics, and Networking. |
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Programming system for sheet metal cutting:
Integrated system for laser cutting machine, plasma, oxycutting, jet of water with:
- drawing of parts in 2D, manual overlap,
semi automatic and automatic
- management of a bookstore of parts, parameters of cuts.
- management of the rules of work.
- management of the lines of cut.
- Interface to import/export files of other CAD. |
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| ... products without technical information |
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