Unmatched Precision for Thin and Thick Film Applications
The SUSS Mask Aligner has become synonymous with superior quality, accuracy, and high quality exposure equipment. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, volume production and R&D environments alike. The new mask aligner generation from SUSS processes wafers up to 300mm and can be equipped with technologies that significantly increase throughput, achieve 1 micron resolution and sub-micron overlay and significantly reduce lithography costs. SUSS Mask Aligners provide a flexible and economic alternative to expensive stepper technology and are regarded as the system of choice for many enabling technologies such as MEMS, Wafer Level Packaging or Compound Semiconductors.
Preventing Defects from Occuring: Mask Inspection
The photomask is one of the most important tools of photolithography. The mask contains the original image of the structures, which are transferred several thousand times to the individual chips during the exposure of the wafer. To create the structures of a microchip, the patterns of up to 40 different photomasks are projected step by step on the wafer.
Even minute defects in the layout of a single mask used in this process can render all chips in the exposed wafers unusable resulting in enormous losses. That is why it is critical to inspect the mask for defects and eliminate them before the mask is used in a scanner/stepper. The best way to reliably control quality at this stage is to optically emulate the photolithographic process with aerial imaging.
Carl Zeiss' E-Beam based mask repair tool meets all requirements for repair of advanced mask technologies.
MeRiT MG as Multi Generation system offering highest precision for current and future nodes.
Requirements for Advanced Mask Repair
- High resolution etching and deposition
- Support of small features sizes (< 65nm)
- Low transmission loss
- High resolution and non destructive defect review
- Capability to support multiple processes
- Support all future lithography approaches and mask materials (157nm, EUV, EPL, LEEPL, S-FIL)
- High Throughput
