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SUMMARY:
- Full hot air convection
- 4 Zone control
- PCB width up to 365mm
- Glass Top Design
- Built-inTemperature profile
- WComputer Control
Autotronik BS3020 is a high performance full hot air convection reflow soldering system
with computers control which can handle boards up to 365mm width with less than +/-2 centigrade degree temperatures gradient.
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Even though these benchtop ovens are small, the 3 vertical zones plus the cooling zone give remarkably accurate profiles for reflow applications. With the new patented Horizontal Convection™ technology*, the "-HT" models are fully compatible with Lead Free for RoHS compliant soldering.
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Lead free:
- yes
PCB size:
- max. 180 x 120 mm
Clearance for assemblies:
- max. 25 mm
Heating controlling:
- microprozessor controlled
Heat distribution:
- Infrared heating element
Solder temperatures:
- 50 - 250 °C
Solder process time:
- ca. 4 - 8 min
Rated power:
- max. 600 W
Features:
- built in automatic air cooling fan
Power requirements:
- 220 VAC / 50Hz
Dimension and weight:
- 300 x 250 x 160mm / ca.18 kg
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With the convection reflow soldering system MaxiReflow, which won the "Global Technology Award 2006", SEHO has set a further milestone in soldering technology. The reflow oven is equipped with a revolutionary, thermally invisible conveyor system and a new, high-functional process gas cleaning.
Provided with the established fan technology of the product family FDS MaxiPower, the MaxiReflow yields excellent and repeatable soldering results. A very homogeneous heat distribution combined with moderate gas velocities are ensured by a large volume of ventilated process gas and especially adapted slot nozzles. Thus, a very good heat transfer coefficient is realized so that the set temperatures of the oven can remain on lower level.
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SEHO PowerReflow is an innovative convection reflow soldering system which is featured with low investment and operation costs, and: it is the "little sister" of SEHO MaxiReflow which won the Global Technology Award 2006.
A special innovative feature of the PowerReflow is the new transport system "LowMassConveyor". Here, the conveyor rails are carried by stainless steel ropes which are tensioned throughout the entire machine. All mechanical parts inside the process area, therefore, are reduced to a minimum as the parallelism of the conveyor exclusively is achieved with the controlled tensioning mechanism. This new and innovative concept allows very slim conveyor rails and center support which are "thermally invisible".
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IL-RTS Rapid Thermal Shock
Building off of our successful Rapid Thermal Shock product line, Despatch is now offering a new In-line Rapid Thermal Shock (IL-RTS) tool for solar cell manufacturers. This revolutionary tool features a simple, in-line process that applies a low temperature thermal spike to solar cells, eliminating the need for low-bow paste.
After moving through the firing furnace, wafers enter the IL-RTS and are rapidly cooled to stabilize any thermal stresses.
Following the cooling, wafers are warmed to above the dew point temperature to prevent condensation. The IL-RTS is
designed to be compatible with any firing furnace on the front end, and the exit table accepts cell tester automation equipment for a completely seamless in-line process.
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Integrated, In-line Diffusion System - DCF Series
Integrated, In-line Diffusion System
The new, Integrated, In-line Diffusion System is Despatch's latest addition to the company's photovoltaic product portfolio. The new in-line diffusion systems are designed to consistently deliver highly homogeneous emitters that are critical for creating high efficiency solar cells.
The production of the DCF Systems represents an important advance in the solar cell manufacturing process by integrating the following into one single piece of equipment:
A patent-pending, in-line phosphorus doper that utilizes top and bottom spray technology
An infrared diffusion furnace featuring a patent-pending thermal processing chamber
Critical process technology
The new integrated systems are recognized for superior thermal processing control, improved cost of ownership, value-added feature sets and ease of maintenance. These special features provide customers with high throughputs and maximum yields.
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Uniform, Repeatable Thermal Processing
Axcelis' Summit XT covers a broad range of advanced thermal processing needs for transistor formation in and beyond the 65nm technology node, including anneals for:
-Ultra shallow junction formation
-Dry oxidation
-Nickel silicide
-Shallow trench isolation (STI) oxides
-Titanium nitride (TiN) densification
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25 years of PV experience and 80 years of furnace production experience
ECM's industrial background and its passion for technological-sophisticated thermal applications naturally led ECM to develop monocrystal and polycrystal growth equipments.
Polycrystalline silicon ingot casting furnace
The process for obtaining a polycrystalline silicon ingot requires a high level of technical mastery. This sector, which is still young and is experiencing major growth, needs the support of all specialists at every stage of the wafers manufacturing process.
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| ... products without technical information |
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