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Fonon's Zero Width Laser Dicing Technology® (ZWLDT®) will cover unprecedented explosive growth and demand in semiconductor markets in China, Taiwan, Japan and Korea. This technology has lead to products, such as the BlackStar™, that offer the best in silicon wafer dicing over existing technologies.
ZWLDT® will slice the wafer much safer than mechanical saws that may cause wafer damage, and increase the yield per wafer as well as maximum throughput while minimizing the HAZ.
With the technology Fonon acquires, Fonon Display and Semiconductor Systems (FononDSS), has been able to launch a number of products that make the most of the technology for the semiconductor and flat panel display industry.
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IPTE 's depaneling systems offer a unique combination of cutting tools, material handling and tooling to cut high technology panelized printed circuit board assemblies. They can be utilized in all kinds of production environments and can be seamlessly integrated, for example, in in-line manufacturing environments with automated ingoing and outgoing feeder units, and also be used in stand-alone configuration for manually supplied loading and unloading of boards.
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LPKF MicroCut
Capable of cutting any shape without burrs
The LPKF MicroCut is a high-performance stencil laser. The LPKF MicroCut is capable of cutting any shape at up to 50,000 openings per hour.
The laser can cut apertures as small as 30 µm with a roundness better than 96%, and its effective material focus diameter produces sharp contours.
As a result of the new cutting technology post-treatment is not necessary anymore.
Absolute flatness of the material is reached also with highest component density by the new LPKF PulsShape function.
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Panasonic's UV laser scriber has a complete laser optics bench that offers flexibility to fit the specific application - the result of PFSA's experience in high volume microelectronic manufacturing and expertise in productivity.
The laser scriber enables the non-mechanical scribing and dicing of wafers. Primary uses include application for low and ultra-low 'K' wafers as well as non-mechanical scribing over metalized portions in the wafer streets which enables smaller kerf widths - allowing for greater numbers of die per wafer.
The UV Scriber enables sample builds for next generation products and maximizes die-level densities to reduce costs and increase profits.
Features & Benefits
Low K scribing with superior quality over mechanical dicing
Next generation supported via sample builds
Configurable for development of future capabilities
Increase profits by optimizing die-level density
HVM capable today
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Stealth Dicing Technology
In Stealth Dicing, a laser beam at a wavelength capable of transmitting through the material is condensed on an internal point in that material. This selectively forms a mechanical damage layer (stress layer) in a localized point near the light focus area so that the material is cut from the "inside". The operating principle of stealth dicing is fundamentally different from conventional blade dicing technology that cuts the material from the "outside".
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DIADISC 45OO
High-tech precision cut-off saw for the laboratory
This new precision cut-off saw has been designed for almost universal
use in laboratories. The standard model is thus optimally equipped.
Special characteristics:
Switch-controlled electrical cutting height adjustment of saw blade
Sliding table, free of play, with prismatic roller guides
Parallel stop with digital measuring system and fine adjustment
Integrated suction arm with brush head. It can be swivelled and adjusted in height
Integrated Micro-atomizer for selective dry or wet operation for highly efficient lubrication and cooling of the saw blade and workpiece
Reserve content level indicator for the micro-atomizer tank
Halogen illuminated work area, with non-dazzle and dimming features
Optimum positioning of operating and display elements
Saw blade and cutting disk depot for 6 tools in the machine (optional)
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Retsch SM 2000 cutting mills are especially high performance and user-friendly machines for crushing tough, medium-hard, soft, elastic, brittle and fibrous materials. Running slowly or quickly with different rotors and hoppers, they crush a wide range of materials, eg:: waste samples, plastic parts, biological substances, food and animal feed and beverage cans. The SM 2000 mills are therefore ideal for research, testing and operational laboratories, for technical training facilities or for creating samples in production.
Further model: SM 100.
Product Advantages:
powerful size reduction, even of heterogeneous mixtures
defined final fineness
low heat build-up
wide range of accessories for universal use
central locking device
fold-back housing
easy cleaning
robust, safe design
2-year warranty, CE-conforming
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In foodstuff laboratories, in chemical or biological research institutions - suitable analysis material is required everywhere for precise examination of foodstuffs. With the GRINDOMIX Knife Mill, Retsch now produces a grinding and homogenising machine that fulfills professional laboratory and analysis requirements. It processes foodstuffs with high water, oil or fat contents just as rapidly and reliably as dry, soft or medium-hard products. For the first time, Retsch provides a professional alternative to standard household mixers.
With the special cutting knife system and the variable grinding chamber of the Grindomix, the materials can be processed into an homogeneous analysis sample, quick and easy. Two straight knives at different heights, arranged at right angles to the direction of rotation, turn at a speed between 2,000 and 10,000 rpm in the centre of the mill vessel.
Product Advantages:
powerful speed-controlled 750 W industrial motor
speed pre-selectable, range 2000 - 10000 min-1
digital display of grinding time and speed
interval operation possible
three memory keys
gravity lid for automatic grinding chamber volume adaption
comprehensive range of accessories
sample vessel easy to clean and exchange
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Cutting mills are particularly well suited for comminution of soft to medium-hard, fibrous or tough materials (including plastics). They are frequently also used in the preparation of heterogeneous substance mixtures and for sample preparation for RoHS and WEEE analysis. In this type of mill, samples are comminuted through cutting and shearing. The fineness is determined by a sieve insert.
Various knife geometries and replaceable blades ensure maximum flexibility and durability. Grinding parts of various steel types as well as of hardmetal tungsten carbide can be used for controlling the abrasion problems.
All grinding parts can be removed for cleaning in just a few seconds without tools – unbeatable fast, simple and efficient!
YOUR ADVANTAGES WITH FRITSCH CUTTING MILLS
- Especially simple operation for fast work
- Unmatched ease of cleaning thanks to patented quick opening facility
- Optimum airflow for particularly fast grinding and secure protection against clogging
- More stable running and low wear due to the patented double cone bearing of the rotor
- Exceptionally long service life through use of replaceable and fixed knives
- Unique grinding chamber geometry: minimal dead space and progressive cutting geometry between the rotor and the fixed knives – for faster and simpler operation
- Grinding parts with different cutting geometries and materials - perfectly adjustable to your application
By the way:
FRITSCH Cutting Mills are available in different configurations – for each application the perfect Mill!
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IPTE 's depaneling systems offer a unique combination of cutting tools, material handling and tooling to cut high technology panelized printed circuit board assemblies. They can be utilized in all kinds of production environments and can be seamlessly integrated, for example, in in-line manufacturing environments with automated ingoing and outgoing feeder units, and also be used in stand-alone configuration for manually supplied loading and unloading of boards.
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MAP Automatic marking, punching, shearing line for metal profiles - flat bars - angle sections - I - U - H- UPAF, etc.
MAP range: MAP 160 MAP 300 MAP 450
Universal, powerful and high-speed machines
MAP 160, 300 and 450 machines are flexible marking, punching, shearing systems for metal profiles, etc., designed to switch easily from angle sections to flat bars, or to I - U - H profiles.
The modular design makes it possible to adjust equipment capacities to user requirements at the lowest cost.
Access to tools, punches and dies, is easy and makes it possible to switch production quickly.
The MAP series punching-shearing lines are the only machines on the market performing in a single pass all operations normally carried out on beams:
- easy programming
- fast and precise
- flange and web punching in a single pass
- easy and quick machine adjustment.
These machines are especially suited to steel structure construction.
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ALFA range is designed for automatically punching, marking and shearing of profiles. Therefore, the final part is obtained in a whole and single process increasing the efficiency and erasing loss of time.
Automatic line CNC controlled for punching, marking and shearing profiles. This solution is ideal for metallic constructors. The bars (flat bars up to 500x400 mm, and angles up to 150x150x15 mm) up to 12 m long are pushed and clamped by a carriage. Material is always guided by lateral roller against line reference.
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MAG B : Drilling punching marking and plasma cutting machine for plates
MAG B range: MAG B 320-80, MAG B 320, MAG B 620, MAG B 1225
Efficient, easy to run and flexible machines for plates
Compact line for complete machining (drilling, punching, marking and plasma cutting) of middle and high thick plates in one handling
The purely software-based solution is a new approach in which a processor carries out all automation tasks within a single-processor mode. The PC software is used for processing PLC and NC tasks.
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UNIQUE GLOBAL SUPPLIER !
With the AXXAIR global concept you may upgrade the tube cutting machines from:
· simple orbital cutting
· to automatic orbital cutting
· to automatic orbital cutting and welding for prefab applications: CC+SASL
· to traditional orbital welding with closed heads: SASL+SATF
IN A FEW MINUTES ONLY !
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The Modular Drive System from Bug-O Systems can provide continuous welding at precise travel speeds, producing flawless welds in a fraction of the time required by hand welding. Various types of rail allow the system to be used on all types of work. Alternative Control Modules allow the system to perform continuous stringer welding, weave welding, stripping, beveling and programmable shape cutting.
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The KatII incorporates everything required to automate your
cutting/ welding operations...quickly, easily, economically. It is
comprised of the Kat II travel carriage and rigid 8 ft. (2438mm)
straight track and torch or gun holder assembly. The carriage
travels in a forward or reverse direction (vertical or horizontal) on
its track, moving the torch or welding gun along the pre-set path
at precisely controlled speeds. The accuracy, uniformity and
quality of the cut or weld is improved. Productivity is increased.
Costs reduced. It is important to note that the Kat II carriage is
not designed to travel on radius roll formed track.
AND...YOU CAN EASILY CONVERT YOUR KAT II
INTO AN EXCELLENT CIRCLE CUTTING MACHINE
This Gullco accessory, comprised of undercarriage, radius
arm and centering pin, eliminates the need for track. The
travel carriage is readily fitted on the top of the undercarriage.
Its drive system engages the undercarriage gears
...moving the assembly in a forward or reverse direction
at desired cutting speeds along a perfectly circular path. A
slide lock on the radius arm allows fast, easy adjustment of
II the circular diameter.
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Manual ultrasonic cutting or welding
Depending of the sonotrode, this very compact and flexible unit, allows to make cutting or welding oprerations.
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Cutting & Welding
3 Table Set-up:
10' Main Vacuum Table
8' (2.44m) Usable Welding Length
10' Filler Table
6x8' Cutting Table
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Conceived for the professionals of Agro-alimentary, the LIXEA slicer series BA is compact, mobile and autonomous equipment which optimizes your station of cutting and reduces your costs.
The LIXEA slicer series BA enables you to cut out in portions, shares or sections your viennoiseries, your fish, your meats.
Thanks to the exceptional performances of the ultrasounds, the LIXEA slicer series BA cuts out the rounds, plates, bands, parts, blocks and breads, quickly and regularly, in a hygienic way, without defects, losses and joining, at positive or negative temperature.
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Conceived for Agro-alimentary industries, our machines of range HEXEM slicer are compact, mobile and autonomous. These machines optimize your stations of cutting and reduce your costs.
The machines of range HEXEM slicer make it possible to cut out in portions, shares or sections your pork-butcheries, your cooked dishes, your pastry makings, your cheeses, your confectioneries, your viennoiseries, your fish, your meats.
Thanks to the exceptional performances of the ultrasounds, machines of range HEXEM slicer cutting the rounds, plates, bands, parts, blocks and breads, quickly and regularly, in a hygienic way, without defects, losses and joining, at positive or negative temperature.
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Liner Cutting & Sealing:
For cutting and sealing of jumbo bag liners.
Description
Nip Roller Provided
Nip Roller Drive 0.37 kw AC
Cutting Arrangement Pneumatic rodless cylinder with both side knife arrangement
Sealing Arrangement Both side double row sealing arrangement
PLC Provided
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The Hob-o is a lightweight hole borer, beveler and welder. It is a portable machine that is quickly centered on the workpiece – all you need is a single center – punch mark. Holes can be cut from 1”-8” (25mm-200mm) inside diam. and from 14.5”-48” (368mm-1220mm) outside diameter.
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