|
|
|
Sinergo as a result of hard work and daily study of the most varied welding applications makes completes assembling, welding, testing and marking systems, art the customer's specific request. The designing and manufactoring of both software and electronic-mechanical components are carried out by Sinergo itself.
|
|
MIYACHI EUROPE offers a full product line of LCD/PDP TAB-Repair systems, the Emerald Series.
These systems are designed for:
- Small to large LCD/PDP panels, sizes ranging from 1" up to 65"
- A wide variety of TAB sizes and shapes
- A wide variety of PCB sizes and shapes
This highly flexible systems can be used for 3 bonding techniques (all in one system!): ACF-Tacking, ACF Final Bonding and Hot-Bar Reflow Soldering. Some of the great features of these systems are Fine Pitch Alignment down to 30 microns. This is done by dual upwards looking cameras. A high precision pneumatic bonding head with adjustable speed and force profiles ensures easy and quick access and an ultra consistent process. For more information, please download the Emerald Series Datasheet below.
|
|
Features:
- Many models to choose from
- Manual and automated systems
- Miyachi Unitek Uniflow2 Power Supply
- Manual or pneumatic bonding heads
- Thermo-plane thermodes with Quick Connect Blocks
- Linear slide or rotary motion
- Hot Bar Bonding, Reflow Soldering, and Heat Staking Applications
The Desktop Series are standard table top Hot-Bar Systems using Pulsed Heat Thermode technology for Reflow-Soldering and Heat Seal Bonding.
The DT-250 and DT-260 feature 2 or 3- position manual locking slides, respectively, easy load and unload, 2 handed operation, and sensor-selected parameters.
Miyachi Unitek's Desktop Bonders are also capable of performing heat staking. Heat Staking is an assembly process utilized in many high tech fields; it is also used in the manufacture of a variety of everyday consumer products.
|
|
The Desktop DT-250-PH and DT-260-PH Uni-Slide series are part of a line of (semi-) automatic systems developed for Hot-Bar Soldering. The “PH” stands for the pulsed heat hot-bar (alternative Constant Heat can be delivered). The model “250” has a manually operated 2-position slide, whereas the model “260” has a 3-position slide.
The Desktop Series delivers the same high connection quality as the larger and more sophisticated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts need to be aligned, it can be done in the front position where the operator or camera have sufficient free space and a view that isn't blocked by the bonding head. The manually operated slide locks into place, which is detected by a sensor. The sensor confirms the correct bonding position of the part and after activation of the 2-hand control the bonding process is started.
|
|
|
|
|
|
The new MW500 selective mini-wave soldering cell is adapted for selective point-to-point or linear soldering operations controlled by an industrial PC.
- Based on 4 fully programmable numerical axes with an additional 7-10° tilt axis.
- Staging area for optional tray loading system or rotary table.
- Integration into automatic lines.
- Working area: 500 x 500 mm.
- Mini-wave system fully made of titanium (tank capacity: 20-25 kg).
Soldering process:
programming -> re-centering (option) -> fluxing -> pre-heating -> soldering quality check (option)
Accurate positioning is achieved via a camera during teaching and programming.
Fluxing is introduced according to the type of flux used: an airless fluxer (alcohol based) or, alternatively, an ultrasonic fluxer » (water based).
Hot air blower, or alternatively infrared heater for PCB, are proposed for the pre-heating operation.
Selective soldering is carried out thanks to the most performing lead free compatible tank and electromagnetic pump fully made of titanium.
|
|
The MWS 2300: perfect in every detail. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the modular design of the system, makes the nitrogen wave soldering system MWS 2300 a powerful piece of equipment. It is ideally suited to solder demanding printed circuit boards – even at high throughputs.
The flexible preheating zone configuration with a preheat length between 1800 mm (70.8 inch) and 3300 mm (129.9 inch) makes it possible to suit your specific production requirements. Should your requirements change in the years to come, simply – and without great expense – change the configuration of the soldering machine.
|
|
Due to the ever-increasing demand for quality and reproducibility of the entire manufacturing process, today it is no longer acceptable to manually solder the conventional component remainings after the reflow process into place and – with the GoSelective-1 and -2 from SEHO – this is also no longer necessary.
The GoSelective-1 and -2 offer all in one: highest flexibility, absolutely reproducible results, high soldering quality even with demanding assemblies, low capital expenditure and the possibility to be upgraded step by step at a later date to suit subsequent production developments.
Special flexibility is given in the handling of the assemblies. Both, bare boards as well as assemblies in carriers can be processed with all GoSelective systems.
|
|
|
|
|
|
With the wave soldering system PowerWave, SEHO consequently realized a machine concept which offers a remarkable performance at simultaneously low investment costs. Complex SMD boards are as reliably soldered as conventional assemblies - due to up-to-date solder nozzle geometries and a flexible preheat area.
The modular construction of SEHO PowerWave offers the ideal concept for all production requirements and allows the machine to be integrated into existing fully automated production lines.
Performance reserves for the user have been created with the high performance pre-heating. SEHO PowerWave is available with either 1200 mm preheat length or 1800 mm. Depending on your production requirements, SEHO PowerWave may be equipped with a chain/finger conveyor system or with a solder frame conveyor for the processing of pallets.
The heart of the machine, the soldering area, is designed with a degree of flexibility that may perform all realistic soldering operations. Modern and innovative solder nozzle geometries provide ideal soldering results.
|
|
The GoWave 1030 is a powerful soldering system for those just entering into mass-soldering operations. This system is suited to a variety of applications ranging from entry-level mass-soldering to soldering in small or medium-sized batches. It also provides an economical soldering solution for universities, schools and laboratories.
The GoWave 1030 is especially featured with its innovative nozzle concept which is ideally suited for nearly all soldering tasks.
A special feature of this machine is its compact, but performance oriented design. Offering a fluxer module, an efficient preheater, innovative soldering area and microprocessor control, the GoWave 1030 presents the finest soldering technology in its class.
|
|
|
The Uni-Slide stand-alone product line is a system concept with a linear product movement. The product is safely and accurately loaded, aligned and unloaded in the front position of the slide, and processed in the rear position. The linear slide is manual operated.
|
|
|
|
|
|
The stand-alone Uni-Base systems are the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. The Uni-Base delivers the same high connection quality as the larger and more sophisticated systems.
Setting up the system for different products is easy as 1-2-3, making it suitable for laboratory and high-mix production. Because of the low investment costs, earn-back time is short. Mass production environments will typically run several of these systems besides each other.
Standard available systems are:
- Uni-Base SS-W-100 with SH500 pneumatic bonding head and Uniflow Power Supply
- Uni-Base SS-W-231 with SH500 pneumatic bonding head, Uniflow Power Supply and basic manual slide
- Uni-Base PS-W-101 with PH500 motorized bonding head, Uniflow Power Supply and PLC control
For Reflow Soldering and Heat-Sealing these standard systems are using Pulsed Heat Technology (Uniflow Power Supply). For ACF Bonding a tape feeder and tape cutting module can be added. You can find more information in the PDF-file below.
|
|
|
|
|
|
AUREL AF5-AF8 Forced Convection Reflow Soldering system
Description
The AUREL AF5-AF8 reflow systems are special designed for predrying of pastes in thick film technology.
Applications
• Computer control with user-friendly software, Win 98 operating system, temperature PID control, 1000 program storage.
• Alarms for over temperature, heaters-blowers-thermocouples failure, conveyor stop and muffle open. Week timer. Light tower for status indication.
• Entrance with adjustable barrels, curtains, aspiration chamber.
• 450 mm Stainless Steel mesh belt conveyor or [optional] combination Pin Chain/Mesh Belt conveyor, width 50 to 330 mm adjustable by hand wheel or motor [optional], SMEMA interface.
Standard Features
• Controls for Air/Nitrogen, RS232 port for printer and for external temperature profiler [optional].
• 4+4 or 7+7 zones Top and Botton Heating full convection modules, long life blowers, long life and low consumption heating elements, modular design for easy service and cleaning.
• Cooling zone with Air/Nitrogen blowers, fan ventilators, exhaust aspiration, optional exhaust filtering 99.9% efficiency.
• Easy access to the machine hardware, removable panels, gas and pneumatic cylinders for complete opening of the muffle, UPS for product evacuation [optional], emergency stop buttons, interlock switches for total security, easy installation and moving by adjustable feet and wheels.
|
|
Satellite Paste Applicators are designed to complement an existing heat source, such as furnace or induction. These freestanding units apply single, multiple, or "ring shape" paste deposits onto assemblies. Cycling is automatic and error-free with an operator removing the pasted part and loading it into the adjoining heat source.
Applicator guns can also be mounted to a robot to apply a detailed combination of paste dots and stripes to a particular part. After the pasting cycle, the part is joined to its companion members and fixtured to the subsequent heating and cooling sequence.
Dual station system utilizes rotating mandrel technique to apply 360° stripe of Fusion Paste onto part joint area.
|
|
Lead free:
- yes
PCB size:
- max. 180 x 120 mm
Clearance for assemblies:
- max. 25 mm
Heating controlling:
- microprozessor controlled
Heat distribution:
- Infrared heating element
Solder temperatures:
- 50 - 250 °C
Solder process time:
- ca. 4 - 8 min
Rated power:
- max. 600 W
Features:
- built in automatic air cooling fan
Power requirements:
- 220 VAC / 50Hz
Dimension and weight:
- 300 x 250 x 160mm / ca.18 kg
|
|
| ... products without technical information |
| |
|
AUTOMATIC ANIMATRICE IN HF MOD. SALION Automatic machine of great reliability, ideal in order to thread whichever type of metallic spirit, normal schools with hinge monoblock or hinge flex in astine of celluloid, propionato acetate or is of shape parallel that pantografata, fustellata or iniettata, also of small dimensions. The machine is complete of automatism for the cargo of the auctions and the spirits.
|
|
|
|
|
|
Benefits and Applications
Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to solder using conventional soldering techniques. Blackstone-NEY Ultrasonics has perfected a technique for introducing ultrasonic energy into dip solder pots and is the exclusive manufacturer of this type of equipment in the world today.
Blackstone-NEY Ultrasonics' solder pots are activated by externally mounted transducers which allow large volume multi-part dipping. The systems' controls are adaptable to automated lines.
Blackstone~NEY Ultrasonics has many years of experience in ultrasonic soldering, dating from the early design and production of some of the first practical equipment for this purpose in the early 1960's. Our experience assures quality and competence in this field.
Ultrasonic soldering finds application in two major areas. They are the pre-tinning and soldering of precision, high reliability electronic components and the joining of aluminum heat exchangers.
|
|
|
|
see the results for the following category : 
