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The 5800 series is a multi-configuration multi-functional test system that is designed to meet the ever changing needs of today's electronic manufacturing environment. An open approach to both hardware and software has been adopted. The open software architecture enables integration with code written using third party software such as Teststand™, Labview™, C#™ and VB.NET™, in short any platform that is .NET compliant.
The open hardware architecture allows configurable chassis and interface styles to accommodate low cost analog in-circuit testing, through to high integrity analog and digital functional test solutions. The integrated 21-slot PXI based backplane enables the user to implement solutions using not only Aeroflex PXI cards but also cards from any PXI card supplier. The 5800 Series of testers comprises three body styles, the 5850, 5830 & 5820.
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IPTE develops test equipment, test handlers and turn-key solutions for the automation of testing and adjustments of PCB's and electronic products
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Features
Integrated test system
Compact footprint
Fixtures compatible with TCIL-P and TCIL-TS
Compact PLC for internal controls
Visualization and tester interface on external PC (e.g. tester PC) via USB interface
Stand alone operation
Manual width adjustment
SMEMA Interface
Compatibility with all standard test systems
Options
Product specific fixtures
ESD covers
Safety automatic door
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The S790VXI Series2 represents the ultimate high-performance, mixed signal ATE system. Its advanced hardware technology, coupled with CATE software for fast effective program production, makes the S790 Series2 the ideal solution for addressing today's major board test concerns - test program generation,and diagnostic speed and accuracy.
Protecting your investment - with complete S700-series backward compatibility. Fully compatible with all Schlumberger S700 test systems, the S790 Series2 provides a complete, riskfree migration path for all S700 series test programs.
Protecting large investments into earlier S700 test programs and fixtures is, for most users, a major concern. The S790 Series2 protects your investment; its compatible architecture allows existing test programs and fixtures to be loaded and run - simply and robustly - providing an assured, risk-free migration path.
All diagnostic data is also ported, avoiding lengthy and costly revalidation of new or modified diagnostics
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Fault coverage and return on investment, two major factors affecting the choice of a test system in today's competitive markets.
Combine these with the flexibility to adapt as technology advances and you have the blueprint for the most desirable test system on the market.
From board to program - the solution
PinPoint II 14 slot, has been engineered to meet these criteria. It is the fastest, most economical functional test workstation available, giving the best return on investment in the industry whether configured for diagnostics or functional test.
PinPoint II has, in its high specification and modular design, the stride and flexibility to keep one step ahead of the fast evolving electronics market. It is equally well suited to `one-offs' as it is to production quantities and the combination of test technologies within the one powerful environment provides the key to the diverse range of applications the system is suited to. In-circuit functional test of both analog and digital components, edge card functional, VI analysis, boundary scan, PXI test and schematic reverse engineering can all be included in the same test platform. Flexibility extends further into the interfacing of the tester to the unit under test. The PinPoint II has been developed to adapt to the needs of the customer - clips, probes, edge connectors and bed-of-nails fixtures can all be used.
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ATE QT2256-320PXI system is designed as a Combination Board Tester capable of testing highly complex and dense PCBs employing various test techniques on a single platform.
It can perform Board Level Functional Test through edge connectors of a PCB, and guided probe diagnostics utility to reliably repair Digital/Analog and Mixed Signal PCBs of various complexities for conventional PCBs.
It is an In-Circuit Device / cluster tester when High Current Pin Driver options are installed and interfaced to the UUT either through clips / probes or nail bed. Standard configuration is 64 Channels high current Pin Drivers.
It has in-built 20MHz 12bit Analog Driver / sensors synchronized with digital drivers for covering analog / mixed signal devices.
Integrated Boundary Scan Test controller (Up to 4 Chains) and software package can be used to test today’s PCBs with high density / high pin count devices. Uses latest technology Boundary Scan hardware with RAM based drivers / sensors in synchronization with ATE digital and analog pin drivers.
To effectively test CPU based boards without excluding the CPU from the test, the system offers optional Qmax patented Bus Cycle Signature System.
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S500 Functional Tester
A flexible, scalable high-performance functional test system tailored to meet your exact requirements for Module and PCB test. Rapidly and reliably giving you a Pass / Fail decision on any electronic module or PCB.
Test results can be passed to the PinPoint PCB Diagnostic Test System for rapid identification of any failure.
Designed to use industry standard hardware and software, the system can be configured and expanded to meet your changing test demands today and re-deployed in the future.
o Fully Integrated Test Solution
o Flexible open architecture (PXI, VXI, GPIB, Boundary scan)
o Complete solution - from design to through-life support
o Easy to use software Environment
o Fully scalable from desktop to multi-rack system
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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Easy to Use....
The standard Windows® user interface makes the Proforma 300SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 300SA to your process needs
Wafer Specifications
* Diameter: 200mm and 300mm.
* Material: All Semiconducting and Semi-insulating materials.
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
* Flat/Notch: All SEMI Standard Flat(s) or Notch.
* Conductivity: P or N Type.
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.
Measurements
* Thickness and TTV.
* Bow
* Warp
* Site and Global Flatness
Advantages
* Cost effective alternative to fully automated tools.
* Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
* Standard Windows® User Interface.
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
The standard Windows® user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.
Wafer Specifications
* Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
* Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC
* Surfaces: As-cut, Lapped, Etched, Polished, Patterned
* Flat/Notch: All SEMI Standard Flat(s) or Notch
* Conductivity: P or N Type
* Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape
Measurements
* Thickness and TTV
* Bow
* Warp
* Site and Global Flatness
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PV Series
Using MTII's exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer.
Wafer saw mark detection and classification is accomplished by adding optional laser sensors to the PV-1000 module. Utilizing up to two of MTII's industry leading Microtrak - SA standalone laser heads, saw marks can be classified for orientation and depth simultaneously with wafer thickness scanning making the PV-1000 ideal for incoming wafer characterization and sorting.
Integrated data acquisition and control electronics analyze and transmit wafer data via the on-board Ethernet port at speeds of up to five wafers per second. The digital I/O port allows communication with wafer handling equipment for up to 64 classes of wafer sorting and binning. Remote monitoring capabilities allow you to see your production line data across your network or directly at the module.
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Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding the wafer.
Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)
Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.
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With its newly developed unique multi-directional detection optics unit, the LS-6800 / LS-7800 Wafer Surface Inspection tool achieves a detection sensitivity of 36nm (LSE) on bare silicon wafers.
This enables critical wafer inspection even at the 65nm technology node.
Features:
Detection Sensitivity: 40nm (PSL on Bare Silicon)
(36nm attainable)
Defect Classification: Crystal Defect / Particles
Scratches/ Particles
others
Detection Reproducibility: >99% (100nm PSL on bare Si)
Throughput (fast mode): 97wph (300mm)
75wph (200mm)
Display functions: Particle map, counts, histogram,
haze map, haze histogram,
others
Wafer sizes: 300mm, 200mm
(150, 125, 100mm optional)
(thin wafer chucking optional)
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Hamamatsu provides photo ( EMMI ) and thermal emission microscopes , thermal ( OBIRCH ) and photoelectrical ( OBIC ) laser stimulation systems for the failure analysis field and the design debug markets .
Our know how to combine state of the art confocal optical design for various wavelength bandwidth , owning core detections technologies such as InGaAs or Thermal sensors , integrating extremely high accurate and stable mechanical stage down to the microprobing level , sets our equipments as the most renowned in the world for more than 20 years .
Our tools are suited for a wide type of architecture from the die or wafer level , though package or applications boards level, up to probe card level and direct docking with tester environment, allowing our customers to observe parametric defect in static conditions and/or functional failures in real dynamic conditions.
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JEOL wafer and mask review tools improve yield management with unique capabilities that help rapidly detect minute imperfections and killer defects. 360 degree wafer edge review, high tilt, and fully automated rotation enhance the automatic defect classification capability of our high resolution, high throughput wafer inspection SEMs for 150-300mm wafers. JEOL provides a wide range of SEM based review solutions for the most advanced designs and highest throughputs.
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The pcba|inspector is a high-resolution microfocus X-ray inspection system designed for inspecting solder joints in board assemblies.
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Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation
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The ml|inspector is a high-resolution microfocus X-ray system designed for inspecting multilayer boards.
Special features:
Max. inspection area 24“ x 20“
Detail detectability of <2µ
Max. tube voltage of 100kV
Automated calculation of offset and annular ring width
Multiple-axis manipulation
Maintenance-free X-ray tube
Integrated noise suppression system
User-friendly image processing software
Easy and intuitive operation
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DE-F SERIES
Mask-less, New Matrix Beam scan method Suitable for general PWB process with excellent cost-performance
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Rudolph Technologies provides automated wafer edge top and edge normal inspection with throughputs of greater than 80 WPH (300 mm). The Class 1 certified system has an approximate 10 minute set-up time to be fully optimized and production ready. Featuring on-the-fly color defect image capture and intrinsic ADC capabilities, the E25 System can automatically detect and classify defects on the entire wafer edge, from the edge exclusion area to the bottom bevel. Both brightfield and darkfield illumination are available.
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The Rudolph Wafer device combines both edge and backside inspection into one enclosure. It retains all the capabilities of the proven E25 and B20 System in one small footprint. The Class 1 certified system can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology than any in the market today. Providing the highest resolution and the lowest gage sigma value imaginable for repeatability and reproducibility in the world, the XE-WAFER is the perfect solution for the semiconductor and hard disk drive industry which, until now, had very limited choice of industrial grade in-line inspection tools. We, Park Systems, take pride in providing you with the metrology solution you have been longing for.
- Allowable Sample Size (Up to 300mm Wafers)
- Allowable Scan Size (100 μm x 100 μm, Optional: 200 μm x 200 μm)
- Automatic Data Acquisition & Analysis of High Aspect Ratio Trench Features on Wafers
- Acoustic Enclosure with Built-in Anti Vibration Isolation System
- Designed Specifically for Production Facilities
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AutoPoint DT is a fixtureless, gridless flying probe with a unique power-off impedance analysis measurement system. Excellent for Manufacturing Defect Analysis (MDA) testing and Field Return Failures.
Supplied as a Stand Alone System or integrated with the PinPoint II Advanced Diagnostic Test System System
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General description:
The InnoLas wafer sorting system IL 2600 can automatically sort, split merge and transfer wafer from any slot / cassette to any other slot / cassette in a six cassette array.
Wafer sizes from 100 mm to 200 mm can be handled without any mechanical adjustment in a single or multi-batch operation.
The laser mark code read for verification can be located at any position on the front and/or backside of the wafer.
The basic model has one reading unit (OCR, BC412, T7) for reading the laser code on the frontside of the wafer.
A second reading unit (OCR, BC412, T7) for reading the code on the backside of the wafer can be mounted as an option.
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