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Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
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The FC300 High Force Device Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding on wafer up to 300 mm.
It includes Nanoimprinting Lithography (NIL) capabilities.
The FC300 is a configurable platform which can perform various applications with a quick and easy process head exchange:
high force bonding, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography,
low force for reflow bonding of RF & optoelectronics devices assembly,
UV-curing for adhesive bonding or for Nanoimprint using the UV-NIL process.
High End Processes
Die bonding, flip chip bonding, mass reflow, in-situ reflow, fluxless eutectic bonding, thermocompression bonding, ultrasonic bonding, UV-curing bonding, adhesive bonding,
UV-NIL, hot embossing lithography...
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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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An accurate high-speed flip chip bonder, the FCB3 accommodates a variety of needs. From development to pre-production and multiple-model production, this machine offers outstanding functionality.
The FCB3 features a simultaneous recognition camera that ensures accurate bonding in continuous production. Additionally, the automatic calibration function corrects thermal changes over time, guaranteeing bonding accuracy of ± 3 _m/3 sigma during continuous production.
Ideal for medium to very fine pitch manufacturing.
Features & Benefits
Flexible modular system accommodates various processes
IC feed from both tray and wafer optimizes productivity
Automatic tool changer with 4 input handles up to 38 types of ICs
Wide component range - from 2" x 2" (up to 320 inputs) to 4" x 4" (up to 80 inputs)
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KADETT K1: The High Accuracy Placement & Semi-Automatic Device Bonder
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments.
The KADETT's design incorporates flexible system architecture. In its basic version, it performs accurate pick & place functions. The KADETT is easily customized with specific modules such as a UV glue curing system, thermosonic bonding
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The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
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Reifenhäuser has a tradition of making die-heads that goes back for over 50 years. A team experienced in planning and construction, the use of cutting edge software tools, highly efficient production, and close contacts to raw material suppliers are all factors that guarantee the best possible results.
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Die Head
The specially designed DKM basket die head and spiral die head for the DKM series single screw extruder, fits well with the DKM high speed vacuum calibrator and guarantees the high output with excellent article quality. The max producible pipe diameter isΦ1600mm.
* Regardless of material viscosity variation, widely applicable for HDPE/MDPE, PERT, PP/PP-R, PB, PS/ABS and HMW-PE pipe production, with reliable processing property.
* High output but rather low pressure drop and melt temperature.
* Small pipe stress due to the low melting pressure and temperature.
* Capacious and smooth runner reduces the pipe stress to the minimum.
* High quality ceramic heater with longer service life.
* Pipe with scratch-free smooth surface finishing.
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Polyolefin pipe die-heads for pipe diameters ranging between 10 - 2 000 mm are part of the delivery package. Reifenhäuser was the world's first supplier of die-heads for 2 000 mm pipes, thereby significantly increasing the extrudable pipe diameter of the time a milestone that perfectly illustrates Reifenhäuser's key expertise.
Reifenhäuser uses spiral mandrel die heads for the extrusion of PE pipes. Coextrusion adapters for the extrusion- of 2 and 3 layered pipes are also supplied.
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As the most influential brandname on extrusion die, owning 60% market share in China, we have been always dedicated to carrer on development of extrusion dies and correlative products
Features
Special flow channel design, sutiable for different raw materials, JCtimes has developed series of dies for PE PP PVC EVA foam products.
Independent temperature control system in lips ensures very identical temperature on the whole width, in order to get most proper expansion rates for different raw materials.
Equipped with the feedblock can produce the co-extrusion foamed products, in whiich surface layers are compact and the internal layer is foamed
Width adjustment system
According customer’s requirement to design various width adjustment system, include: external deckling system and inernal deckling system.
Features
Internal deckling system have reducing thick edge function, mainly use for coating extrusion line. Due to the special adjust requirement, the flow channel of the die also have special design.
Screw type external deckling can adjust the width on line and it working can save time, labour, and raw materials,
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As the most influential brandname on extrusion die, owning 60% market share in China, we have been always dedicated to carrer on development of extrusion dies and correlative products
Characteristics
- Originated design for mono-block die body, UV layer distributed evenly.
- Avoid leakage happening because of split die body.
- Easy maintainance.
- Male inside have air distributary system, divide the cavity into several zones, control air volume independently, ensure even air distribution in a short time.
- Flexible and fine adjustment on both upper and lower lips, the tolerance of the wall thickness within ±3％.
- Internal heating bars work independently in separated zones, temperature tolerance within ±1℃.
- With the economic UV function，PC+UV co-extrusion feedblock and a special structured male, make UV layer evenly cover on the product surface.
- PC hollow profile die can be used for 4-25mm thick , 2100mm wide product, the multilayer product thickness can reach 80mm.
- PPhollow profile thickness and width range bewteen 2-12mm and 1200-3000mm.
- Flow channel surface polishing precision at 0.01-0.02μm.
- Male tooling precision can reach 0.04-0.05μm，special non-sticking treatment applies to each rib.
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The use of Warm and Hot Forging Die gets increasingly wide, because it provides high precision in addition to high productivity and a good point of materials yield. In us, it was newly successful by development of new material and new technology to produce in carbide of warm and hot forging die considered to be difficulty traditionally.
- For forging of automobile parts
- For forging of motorcycle parts and bicycle parts
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Cold heading die nibs
- short delivery for special dimensions,
- close to finished dimensions to reduce grinding,
- different grades for different applications.
Semi fnished cold heading die nibs,
- consistant in metalurgical and dimensional properties,
- keeps your production flexibel, fast, and secure.
Finished cold heading dies and tools,
- tailor-made high performance tools due to many years of experience
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Like the punches we also offer the dies according to the european standard specifications. Therefore we offer our standard dies with the external diameters 22,0mm, 24,0mm, 30,16mm and 38,10mm. In order to satisfy the wishes of all our customers, we also produce special dies, fitting for example in older tablet presses or being used for special products, such as washing tablets.
To meet the demands of all our customers we use different materials for our dies and offer a numerous spectrum of materials, such as ceramics, stainless steel or hard metal. We also offer dies with different coatings, for example TIN–coating. The coatings increase the hardness of the dies and are ideal for the pressing of abrasive products.
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Utilisation with nozzle
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