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Bondjet BJ820
The Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, handling all challenging wire bonding applications on a single platform - RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon.
High Speed Fine Pitch Wedge Bonder
Precision:
- 1 μm at 3 σ axis repeatibility at an interpolated encoder resolution of 20 nm
Largest Bonding Area
- 305 mm x 410 mm (12'' x 16,1'') work area can serve as two or mor smaller stations for efficient handling of smaller products or substrates, eliminating index time and maximizing throughput
- Enables intelligent automation of extra large products
Speed:
- Up to 7 wires per second
Quality:
- Consistant performance for the highest yields
- Realtime bond quality monitoring system
- Wear- and maintenance free piezo bondhead with solid state hinges
- Software supports control by host computer, product traceability and external statistical analysis
Small footprint, big capability:
- Integrates easily into complex production lines
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Bondjet BJ920
The Bondjet BJ920 is a nex development in heavy wire bonding. Hesse & Knipps has designed a bonder available with integrated pull and shear test, a high speed and accuracy and largest bonding area which is presently unique in the market. Advanced features available only on Bondjet BJ920 and enhanced quality control systems serve to meet your customers' requirements and greatly enhance productivity.
Advanced Features:
- E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Quality monitoring by high resolution deformation and transducer current measurement
- Program upload and download via LAN
- Flexible multi-lane handlers
Integrated Non-destructive Shear and / or Pull Test:
- Fast shear test with less stress for the connection than pull test
- Programmable pull test for each wire
Speed:
- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)
Accuracy:
- 10 μm at 3 σ repeatibility at each position in the large work area
- 7 μm pattern recognition system accuracy
Largest Bonding Area:
- Up to 380 mm x 500 mm (15'' x 19.7'')
Bondhead Highlights:
- Maintenance-free solid state joints
- Active cutting bondhead with extended cutter lifetime
- No pusher provides better access into tight packages
- Closed loop force control, programmable from 0 to 1400 cN
- Touchdown and deformation sensor without signal delay
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FC150: The Most Flexible High Accuracy Die Bonder
With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.
Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding.
Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.
The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Bond process changes are easily achieved.
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Panasonic's DMX is a world-class, high-productivity die bonder supporting 200mm and 300mm wafers. The eight-nozzle head system offers unparalleled productivity, providing results that are nearly 300% greater than conventional die bonders. The 3-beam mechanism and multi-nozzle bond head provide substrate recognition and both pre- and post-bond inspection.
The high-speed and volumetric epoxy writing system provide for increased productivity of up to 8,000 UPH (actual cycle). Seven (7) standard patterns are installed with free pattern programmability. Multi-beam parallel processing supports wafer (die) recognition, multi-nozzle bonding and substrate recognition (pre- and postbond inspection).
Features & Benefits
Flexible for ultra thin die, Semi S2/S8 option
Near zero transport time for increased machine utilization
Wafer mapping software capability
High speed positive displacement dispensing
Accurate to +/- 25 microns, die size: 0.25mm to 25.4mm
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Model 616A Peg Bonders are used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine. Bare wire diameters equal to or smaller than 75um, insulated wires up to 51um and flat conductors up to 25um x 500um can be bonded with the 616A.
The 616A has a series of seven different configurations that allow it to fit into existing production lines, single work benches or new production lines.
For more information, please contact us at mailus@hybond.com.
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The 626 can be a Wedge bonder (wedge-wedge), Ball bonder (ball-wedge), Peg bonder (for tacking down pre-aligned leads, ribbons and bare or insulated wires) and a Bump bonder (gold stud bumping) without having to remove or replace any electrical or mechanical machine component. Conversion time from Ball bonder to Wedge bonder or vice versa is the same as the time spent replacing a used tool with a new one.
With servomotor control, touch sensor and linear vertical movement, the 626 bond head can move and bond within a 0.750” vertical range without the need to readjust the work stage or bonder platform height. The 626 also has LCD display with parameters in actual units, storage in memory for up to 75 different schedules (or “recipes”) and independent 1st and 2nd bond digital parameter settings. All these features and yet it’s smaller, weighs less and is more cost effective than most other wire bonders.
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Hybond designs, manufactures and sells ultrasonic and thermosonic wire bonders. Products include:
Ball Bonders: for ball bonding and bump bonding of gold wire.
Wedge Bonders: for bonding of gold, aluminum, platinum, copper and other material wires and ribbon (flat wire).
Peg Bonders: Used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine.
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Land cables that are buried into the soil are subject to pulling forces and mechanical impact, expecially during the laying of the cable. Therefore, specifications in certain countries (e.g. U.K.) prescribe the use of heavily galvanised armouring wires around the cable, thus increasing the cable's operational safety and life time. Bekaert is a reknown supplier of low carbon land cable armouring wires from its various factories all around the world .
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We offer you an extensive range of flexible power transmission components. Our diverse manufacturing processes facilitate the production of highly flexible braided cables matched to suit your specific application, ready-assembled connecting components or welded high-current connectors. From the smallest ground or earthing tapes up to high-current cables with 6000 mm² conductor cross-section – almost all conceivable applications are covered. Whether in air-cooled or water-cooled designs, we can offer you the right components and solutions.
Please contact us directly for technical support.
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High quality and competitive price:
KINTO is one of the leading suppliers in China specialized in manufacture of copper parts for electrical applications.
Product range:
- copper flexible connectors made out of copper strips
- copper flexible connectors made out of baided tapes or stranded ropes
- flexible insulated busbars
- primary copper contacts (contact fingers, contact blades, tulip type contacts, bell type contacts, sleeve type contacts,...)
- primary copper connectors
- copper clamps and other customer copper parts
We use technologies such as press-/diffusion welding, braze welding, cold-pressing, stamping, deep-drawing and high precision machining.
The contact areas can be zinned or silver-coated according to customers' requirements.
We are a ISO9001 certificated company with strict quality assurance system, and we have advanced production and testing equipments to assure the quality of each product.
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wired shunts
Are you working in the business of restistance welding? Brouwer Metaal offers wired shunts in a variety of designs and dimensions based on your specifications and applications.
Whether you are specialised in seam welding, projection welding, or butt welding you will need wired shunts that can resist temperature fluctuations. We offer wired shunts made out of a wide array of copper alloys. No matter what the circumstances are, it is essential that you can work with parts that allow high thermal stability. Brouwer Metaal will work with you to produce wired shunts that fit your needs. It is even possible for you to offer us a drawing and we will be able to deliver a product in all possible dimensions.
Brouwer Metaal has been on the forefront of offering innovations and new designs for years, and we can now truly claim to be a major player on the resistance welding market. Our experts are constantly cooperating with our customers to prepare the perfect laminated shunts. Our wide range of products ensures that our customers get the exact products (whether those are laminated shunts, electrode holders, or wire shunts) and materials that they need to ensure the highest quality welding process.
More information can be seen by choosing in the menu on the left. If you would like to receive more specific information regarding our products, please contact us
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FEATURES
* 210 to 450 amps UL rating
* Positive latching
* Available in straight, right angle, panel mount, blind mate and bus bar styles
* Touch safe female connectors
* Polarized dual pole connectors with optional hex key
* Strain relief option
* Low connector mating forces
* Silver plated, high conductivity contacts
* Ease of assembly
BENEFITS
* Integral latches with ergonomic release provide over 50 lbs retention
* The flexibility of the PowerMod HP system serves a broad range of electronics applications
* Provide IP20 protection for safe, energized use outside the electronics cabinet
* Dual pole housings prevent shorting from reverse mating and the optional hex key allows the user to create unique mating schemes
* Reduces risk of wire insulation creep and reduces transmission of wire loads to contacts improving service life
* Connectors are easily mated and unmated
* Offers greater longevity for high-power, elevated temperature applications
* Intuitive design allows for simplicity of assembly
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Features & Benefits
- Gold plated center pin
- Nickel over brass housing
- High performance dielectric
- Available in a variety of popular styles
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Wavo® Springs (RW Series)
Wavo Springs are a compact round wire wave springs designed to fit in tight radial and axial spaces. As an ideal alternative to belleville springs, Wavo Springs provide high and accurate force, while maintaining dimensional stability and precise load / deflection characteristics.
Wavo Springs are stocked in carbon and stainless steel with diameters from ½" to 6". Special designs are available with diameters up to 84".
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The shapes of wire forms are only limited by the imagination of the designer, equally with the latest CNC forming machines the ability to produce such wire forms is, in many cases only limited by the skills and imagination of the machine setter.
Airedale Springs Ltd has continued to invest in the latest CNC coiling / wire forming machines increasing its capabilities including those in wire forms. We are able to produce simple wire forms or complex wire forms by using the most effective ways possible, such as CNC, special tooling or hand made processes, as appropriate.
We have been able to assist many of our customers in solving their wire form design problems. Some of our solutions have lead to significant cost savings on tooling, manufacture, assembly costs and materials usage.
The wire forms shown here are just a very small example of the components we have manufactured. They are used in a diverse range of applications including:
- Baggage label clips
- Electrical switchgear
- Light fittings
- Hooks
- Telecommunications equipment
- Textile machinery
- Safety equipment
PLEASE WRITE YOUR ENQUIRY IN ENGLISH!
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Heavy Duty Springs
For all applications requiring big size springs (up to 94mm wire diameter), Ressorts Masselin has the capacity to hot roll your products. Springs can be specified stand alon or part of a kit to be assembled and including up to 3 springs inside each other.
For your projects, our engineers are available to evaluate feasibility and propose prototyping for complete validation.
All aour products are manufactured according to ISO 9001 quality standards
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SANDOW AVIA technical elastic shock cords, also called bungee cords, are designed to meet aviation standards., particularly French aerospace ASNA standards.
Force /extension properties are guaranteed for a given diameter and a given elongation. (maximum 100%)
Shock cords from 4 to 30 mm in diameter will resist tractive forces of 1 to 400 daN respectively.
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Springs
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