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DC / IC Target
Angstrom Sciences' circular magnetrons have become recognized as the new standard of the sputtering industry, because in addition to the advanced features of the Angstrom Advantage™, they offer a host of other performance advantages as well.
Versatile, Compact Design
Their compact design makes our circular magnetrons ideal for any new or retrofit application, including the most complex cluster assemblies for the smallest vacuum chambers.
Total Power Compatibility
Low-impedence heads provide RF, DC, mid-frequency DC, pulsed DC, and microwave power compatibility.
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Angstrom Sciences offers state-of-the-art magnetrons for virtually any standard sputtering process. But we know that every application is different. That’s why we’ve developed a unique, modular approach that specifically adapts to your specifications.
Better Technology
Angstrom Sciences uses Finite Element Analysis (FEA) magnet modeling to custom profile magnetics to your specifications.
Whether you need high rate and throughput, high uniformity and target utilization, or a perfect balance between the two, we’ll make sure the Angstrom Advantage™ is optimized for your process.
More Capabilities
Angstrom Sciences designs, engineers, manufactures, and tests its magnetrons in-house. So we can guarantee the highest quality and control over your custom project.
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Cylindrical Magnetrons have long been trusted in the glass coating industry to create uniform thin films while maximizing target utilization. Now, Angstrom Sciences has created a compact, lightweight, and economical cylindrical magnetron specifically designed to offer these same advantages to Flat Panel Display, Solar Cell, and Web Coating applications.
Patented Technology
Angstrom Sciences’ patented profiled magnet technology creates a deposition profile that is closer to normal between the source and the substrate. The improved deposition profile offers reduced debris accumulation on the chamber walls.
Additionally, Angstrom Sciences’ magnet array offers a higher magnetic field intensity, which allows the user to run the sputtering process at lower power to achieve typical deposition rates.
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Dexter R-Mag™ Magnetron,U.S. Patent 5,865,970
UP TO FOUR TIMES MORE PRODUCTIVITY THROUGH ENHANCED MAGNETICS
Our patented quadrature design produces higher fields than conventional magnetrons thus lowering your costs.
>The higher fields allow for thicker targets. Thicker targets can drastically increase run time between target changes while saving thousands in target costs.
>Magnet assemblies are built with carefully matched magnets that are calibrated to within +/- 1%.
>Magnet assemblies can be adjusted in any location to obtain the desired uniformity profile along the length.
>Magnet assemblies are designed for direct exposure with the cooling water.
>Magnets are mechanically protected with SS cladding.
>Magnet bar is designed with SS to minimize corrosion.
>Turn around portion of the assembly is designed for simple replacement. This allows us to work with the end user to optimize the turnaround erosion for maximum target utilization. This saves time and money! The replaceable turnaround also allows the end user to quickly repair and replace this portion of the bar if it becomes damaged.
>Readily adjusted to run with the larger ID targets
>Each magnet bar is individually mapped and certified to meet the uniformity requirements.
>Optional: Unbalanced or balanced magnetrons
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As more industries discover the speed, controllability, and bottom-line benefits of magnetron sputtering, Angstrom Sciences is developing tools to maximize the output of these larger, faster manufacturing processes.
Broader Solutions
For those who have to coat extremely broad substrates or have to achieve extremely high throughput, linear magnetrons offer the perfect solution.
Patented Advantages
Angstrom Sciences’ linear magnetrons incorporate our fully-encapsulated patented profiled NdFeB rare earth magnets and turbulent water flow to provide unparalleled performance.
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Dexter's patented circular magnetron guns (T-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Simplified, lower cost, rotating magnetron system
>Robust mechanical structure will work with low PTF SUL materials
>Programmable recipe variables include: rotational speed and phase angle
>Dexter target removal/load tool required
*Note that Dexter also offers the patented Z-Gun Magnetron Sputter Source.
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Dexter's rotating magnetron guns (Z-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Magnet array capable of 2.625 in (67 mm) of linear travel
>Easy target removal without special tooling
>Programmable recipe variables include: rotational speed, phase angle and linear position
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Magnetrons
Angstrom Sciences’ magnetrons are engineered to meet stringent thin film uniformity, target utilization, and sputter rate specifications. In addition to the advanced performance results provided by the profiled magnets and turbulent water flow of the Angstrom Advantage™, Angstrom Sciences’ magnetron sputtering cathodes offer a host of other efficiencies.
Versatile, Compact Design
ONYX® magnetron sputtering cathodes are ultra compact and specially designed for compatibility with complex multi-cathode cluster assemblies. This versatile construction allows scalability, making ONYX® magnetrons an ideal option for system upgrades and retrofit applications.
Total Power Compatibility
Low impedance sputter heads are RF, DC, mid-frequency DC, pulsed DC, and microwave power compatible.
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Angstrom Sciences’ circular rotary magnetrons incorporate a moving magnet array within a planar circular magnetron design. This rotating array provides a precise magnetic field for ±2% film uniformity and 50% high target utilization.
Rotary magnetrons come with a speed control monitor, adjustable from 1RPM-170ROM, with digital display. Angstrom Sciences’ standard rotary magnetron is a direct cooled design with an external flange mount.
Rotary Magnetrons are available in 4", 6", 6.75", 8", 9.25", 10", 12", and 16" Outer Diameters.
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Dexter's rotating magnetron guns (Z-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Magnet array capable of 2.625 in (67 mm) of linear travel
>Easy target removal without special tooling
>Programmable recipe variables include: rotational speed, phase angle and linear position
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Magnetrons
Angstrom Sciences’ magnetrons are engineered to meet stringent thin film uniformity, target utilization, and sputter rate specifications. In addition to the advanced performance results provided by the profiled magnets and turbulent water flow of the Angstrom Advantage™, Angstrom Sciences’ magnetron sputtering cathodes offer a host of other efficiencies.
Versatile, Compact Design
ONYX® magnetron sputtering cathodes are ultra compact and specially designed for compatibility with complex multi-cathode cluster assemblies. This versatile construction allows scalability, making ONYX® magnetrons an ideal option for system upgrades and retrofit applications.
Total Power Compatibility
Low impedance sputter heads are RF, DC, mid-frequency DC, pulsed DC, and microwave power compatible.
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