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Pressure die-casting is mostly used when it is necessary to include special geometries for joints, integrated spacers, handles and details for assembling, sophisticated containers, heat sinks with circular fins.
Die-cast products can be finished with:
- Polishing;
- Painting;
- Anodization;
- Chromate treatment (transparent and gold).
As for prototypes and/or little series it is possible to use pressure sand die-casting or with lost wax, prior of producing the final steel die.
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Description:
Provided with the base unit are two filler metering systems, one resin metering system, one catalyst metering system, one base-color metering system and a two color contrast injector system. Additional raw material
systems can be supplied as needed.
The base Autocaster Ultra™continuous casting machine also includes:
· Up to 60 lbs/minute matrix production.
· Recipe based matrix control (100 recipes in control panel) with on-the-fly recipe changes and adjustments for resin %,
catalyst %, base-color and matrix output.
· Totalizer for all raw materials (except contrast color).
· Operator calibrated gear pumps for resin, catalyst and base colors.
· Operator calibrated solid-core filler metering augers.
· Filler hoppers with integrated anti-bridging devices.
· Integrated resin heating system.
· Adjustable flow contrast color injectors (up to eight units).
· High efficiency hardened steel machined mixing auger and barrel.
· Modular base-color systems with expandable base-color pump and recirculation.
· Inverter controlled motors for all raw materials (except contrast color).
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Designed for 300mm wafer processing, the Despatch AST-1100 also accommodates 200mm wafers. This automated photoresist bake tool increases throughput and eliminates handling errors while conserving valuable floor space.
Thermal Data - The Despatch AST-1100 Automated Photoresist Bake Tool provides tight temperature uniformity. The tool maintains uniformity of +/-1.0°C within each wafer and throughout all 25 wafers in the thermal chamber at soak.
Increase Throughput, Eliminate Errors, and Improve Ergonomics - Utilizing Despatch's automated wafer handling system will eliminate costly errors, improve ergonomics, and boost throughput. This process eliminates manual handling of 300mm wafers that exceed the weight limit for repetitive human handling, set by OSHA. The oven's two chambers each hold up to 25 wafers during the process cycle. Despatch can add additional heat chambers to increase throughput.
Conserve Valuable Clean Room Space - The Despatch 300mm oven measures approximately 103 inches (262 cm) wide by 88 inches (224 cm) long. Its small footprint will minimize clean room space needed and maximize your production environment. Compatible with either ballroom or bulkhead mounted installations.
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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
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is designed for fully automatic, precision microelectronics assembly and performs adhesive dispense, pick and place component placement, eutectic die attach, and flip chip operations. This versatile machine is well suited for a high mix, low volume production environment, and can easily be configured for high volume production by adding automated handling capabilities.
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Advantages of Ultrasonic Flip Chip Bonding against Lead/Adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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The UDB-140A is a semi-automatic die bonder for eutectic, thermoplastic, and other die attach media where heat is required at the die pick up tool and/or the package work stage. Precise die placement, quick device change over, and versatility are integral with the design. The UDB-140A is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are facilitated with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package targeting system. An optional preform pick up system, a 4:1 X-Y manipulator for package location, and a dual-axis adjustable excursion scrub can be added depending on the application. Custom packages and die can be accommodated by designing in suitable fixtures to fit the application.
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drawing die nibs for steelcord and and wire production; high-performance grades for steelcord, ISO standard nibs ex stock,
ready-to-use drawing dies for tubes, bars, and profiles,
ready-to-use drawing mandrels for tubes and profiles.
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Diamond Wire Drawing Die Blanks
¡ª¡ªSelf-Supported and Tungsten Carbide Supported Blanks for Wire Drawing Applications.
¡¡¡¡Diamond/PCD wire drawing die blanks from DMD Company have the advantages of longer service life. While drawing metal wires, they embody higher surface finish and brightness.
¡¡¡¡Our diamond wire drawing die blanks are polycrystalline diamond (PCD) products made under ultra-high temperature and ultra-high pressure, they are suitable for high-speed drawing of nonferrous wires such as bronze, aluminum, nickel, stainless steel and other alloy wires.
¡¡¡¡Our diamond wire drawing die blanks have three series: XYH Series,XYR and XYY Series. In each series, there are 4 grain sizes available to choose from based on the application of wire drawing: 3 micron, 5 micron, 10 micron, and 25 micron.
¡¡¡¡XYH and XYR Series diamond wire drawing die blanks contains self-supported PCD die blanks which include the Hexagonal type and the Round type in various sizes. These blanks are suitable for all types of wire drawing applications especially where cost-cutting is required.
¡¡¡¡XYY Series diamond wire drawing die blanks includes tungsten carbide supported PCD die blanks in round shape of various sizes. These products have a polycrystalline diamond core integrally bonded to a tungsten carbide support ring which in turn enhances the strength of the die blanks. These features allow the products stronger ability to withstand wire drawing with high intensity.
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Sandvik Hard Materials supplies carbide drawing nibs for the full range of wire drawing applications:
Metal Forming products supplies a wide range of applications
High-carbon wire,
steel cord for rubber reinforcement,
bead wire,
welding wire,
stainless steel wire,
spring wire,
…
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Injection Plungers for Pressure Die Casting
Injection plungers for pressure die casting of Al, Zn, Mg and Cu alloys are made of grey cast iron,
steel and, more and more of special copper alloys such as Brocadur® CCNB and Brocadur CNCS.
The advantages of injection plungers made of special copper alloys are as follows:
- extraordinary adjustablity
- perfect sealing
- low consumption of lubricant
- good cooling due to high temperature conductivity enabling high working cycle rates
- long life of plunger
- long life of casting chamber
- increase of casting capacity
- reduction of casting costs[
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The concept of American Maplan's co-extrusion block permits the production of reduced weight foam core pipes or pipes with a compact middle layer of recycled material.
The pipe is generally formed using our PVC spider die technology. The special design of the extrusion blocks will allow either one or two co-extruders to provide up to three materials in the same pipe product.
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Dies for profile extrusion designed to precisely manufacture your products
In close co-operation with its strategic partners, American Maplan offers a complete range of profile dies for window, foam and co-extrusion
Easy installation, handling, adjustment and disassembly for short set-up times and high productivity
Dual-strand dies allow for production of main and auxilliary profiles with maximum efficiency and flexibility
Block dies for large profiles are also available
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