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semiconductor resin / photosensitive
semiconductor resin
OiR, GiR, HiPR, FHi series

The Mid-UV range of sensitive photoresists is specifically created for various critical and non critical fields of applications. It is ideal of fields having a sub-0.30µm to >1.0µm resolution on different substrates under a substantial ...

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Fujifilm NDT Systems
encapsulation resin / photosensitive
encapsulation resin
SC, IC Type 3, HNR, HR series

The Negative Polyisoprene-based photoresist material, fabricated by Fujifilm, features various of negative tone, polyisoprene-based resist systems that are suited for a wide range of contact imaging and projection. This product provides ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin
FEP, FEN series

Fujifilm e-Beam is a negative and positive tone resist series suitable for a variety of e-beam imaging requirements. Advantages include high resolution and wide process window. FEP series is a perfect one to be used with positive imaging ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin

Fujifilm has an aqueous buffer coat formulations which result to durable polymer coatings after thermal curing. It is photo-imageable using the g-line, i-line or other broadband exposure tools. They are developed with standard 0.262N ...

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Fujifilm NDT Systems
semiconductor resin / photosensitive
semiconductor resin
Durimide 7000 series

The Fujifilms Solvent Developable Polyimide is a range of photo-imageable polyimide precursor which is ideal for a broad spectrum of applications in different substrates. It is created and improved through the our HTRD2 developer. It ...

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Fujifilm NDT Systems