The Kermel Tech fibre has been specifically developed to cope with ever increasing thermal and chemical requirements in the field of hot gas filtration.
Kermel Tech offers exceptional resistance to both long-term elevated operating temperatures as well as shorter term high temperature peaks. It guarantees long service life and reliability of filter bag dust removal systems under rigorous conditions.
• Chromatographic columns for µ-LC
New technologies for improved column durability after frit formation
Windows like standard capillary for on-column detection methods
• Optically monitor fluids
Before, during or after delivery/sampling
The PCO2-14™ Polyimide Cure solution is a clean process oven designed for polyimide baking and curing applications. Many semiconductor manufacturing environments, front-end machines are adapted for polyimide curing. This costly process results in equipment typically not suitable for polyimide curing in terms of cleanliness, inert atmosphere capabilities, cycle time or data acquisition.
The PCO2-14™ optimizes the polyimide cure process for semiconductor wafer devices. It enables short cycle times and a consistent, reproducible cure process for all wafers in the product load by combining four essential characteristics in a single, compact design: clean process operation (Class 100 recirculated airflow), inert atmosphere capabilities (<20 ppm of oxygen), temperatures up to 350°C, and fast cycle times with +/- 1% temperature uniformity.
Like other Despatch thermal processing tools, the PCO2-14™ Polyimide Cure can be networked and controlled from a central location, minimizing the floor space required and further improving productivity. Atmosphere data can also be monitored and recorded throughout the cycle.
