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The MicroProf® is a very versatile and modular measuring tool that
is suited for a wide range of applications. No matter what you are
planning to measure, whether it is profile, roughness, topography
or film thickness, this system is a true all-rounder. Most importantly,
it is very easy to use, expandable, can be automated and
provides instant visible results for a time - and
cost efficient operation. |
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| Optical applications are broad and varied. Testing at design wavelength is critical for final alignment and system qualification. Lithographic, DVD, and Infrared imaging lenses all require testing at design wavelength and represent broadly-varying wavelength requirements. ZYGO, long recognized as the world leader in interferometric testing, has designed and built many specially-equipped interferometer systems, including those meeting the most demanding requirements, from the deep ultraviolet to the far infrared. ZYGO offers complete solutions including interferometer mainframes, transmission flats and spheres, mounts and accessories to support numerous wavelengths and testing applications. |
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Building on the proven reliability of ZYGO's trusted NewView optical profiler, ZYGO's NewView Delta provides important operational and performance enhancements which make it easy to measure precision parts right on the factory floor. The NewView Delta extends the field of view up to a full 30 mm diameter, enabling you to measure the critical area of most precision parts in one shot - no multiple measurements, no waiting. It's fast, it's accurate, it's repeatable.
Two models are available: the NewView Delta SA is designed to be used primarily with one microscope objective for a single type of measurement (flatness, roughness, step height, etc.).
The NewView Delta DA sports two super-long-working-distance (SLWD) objectives on a shuttle, making it easy to switch between two different measurement types (typically roughness and flatness) on the fly. You don't even have to change software setups - the NewView Delta senses which objective is in use and automatically uses the appropriate MetroPro® measurement configuration. |
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Wyko NT9800
The Wyko NT9800 Optical Profiler delivers rapid, non-contact, 3D measurements from 0.1 nanometer up to 10 millimeters, with sub-nanometer resolution.
Wyko DMEMS NT3300
Non-contact dynamic MEMS model of the NT3300 delivers automated 3D measurement and analysis of micro-devices in motion
Wyko DMEMS NT1100
Table-top profiler with dynamic MEMS measurement option generates animations of MEMS devices in motion.
Wyko HD8100
Highest performance profiler for data storage metrology provides fast, non-contact characterization of magnetic thin-film heads, including pole-tip recession (PTR) and ABS flatness.
Wyko NT1100
Optical profiler providing high resolution 3D surface measurement, from sub-nanometer roughness to millimeter-high steps.
Wyko NT9300
The Wyko NT9300 utilizes Veeco's ninth-generation optical profiling sensor technology to provide fast, highly accurate 3D surface topography measurements from 0.1 nanometer up to 10 millimeters. The extended, large scan capability makes this system ideal for large-region, stitched, and irregular samples. |
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Dektak 150
The Dektak 150 Surface Profiler boasts the industry%u2019s best performance, best repeatability, and largest standard scanning range for research and production environments.
Dektak 8
Advanced stylus profiler system delivers high repeatability, low-force sensor technology and advanced 3D data analysis for surface characterization of MEMS and thin & thick films. |
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Dimension Vx200/300 AFP
The Dimension Vx200/300 Atomic Force Profiler (AFP) combines the resolution of an atomic force microscope (AFM) with the long scan capability of a profiler to offer the highest performance profiling and atomic force microscopy available. It offers non-destructive profiling for CMP control and characterization and high aspect ratio depth measurements in a single platform for 200mm and 300mm substrates. This semi-automated platform can be configured to handle a variety of samples including wafers, data storage sliders, and square substrates.
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USBeamProTM
The USBeamPro is a camera-based beam profiling system with USB 2.0 connectivity, operating under Photon's renowned BeamProfiler Software in Windows, which includes Vista. It provides highly accurate measurements of ISO Standard beam profile parameters, including beam diameter, centroid, and power/energy. The USB 2.0 interface offers enhanced ease of use and portability.
The USBeamPro features a 2/3" format CMOS 1280x1024 array with 6.7µm square pixels; for a total beam imaging area of 8.6mmx6.9mm. The camera's small form factor of 54x54x33mm allows ease of placement into typical optical paths.
The nominal dynamic range of this array is 30dBpower (10-bit digitization). Profiles with greater than 48dBpower (>16-bit effective digitization) can be acquired with Extended Range Imaging. High dynamic range is important in many applications, especially lens characterization, where lens aberrations are apparent from faint features around a strong central peak in the beam profile.
This instrument provides a high level of portability for beam profiling, since a peripheral frame grabber card is not required for this system. Thus, this equipment can be easily transferred to different laptop or desktop computers without the additional step of installing a frame grabber card and the required software drivers into the computer. |
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| High resolution CCD having 12 Bit true dynamic range. A complete test station measuring Profile, Power and Position, both for CW and Pulsed beams. Based on a USB 2.0 interface for notebooks. Offered with a complete set for larger beams and high power attenuation. |
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LED Profiler - Generates high dynamic range light intensity profiles of LEDs.
The LED Profiler uses goniometric methodology to measure true 3-dimensional profiles of optical components with up to 93 dB dynamic range. All measurements are taken with the packaged or bare chip LED inserted directly into the center of the instrument's radial measurement area. The goniometer makes a ±130 degree measurement around the source, with 0.05 degree resolution.
For the third measurement the mounting chuck is automatically rotated around the phi angle. This measurement can comprise from 10 to 200 cuts or 18 to 0.9 degrees per cut. The values reported are:
Angular width of the light beam
Spatial Profile of device.
Power in the Cone |
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