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Series of newest advanced models of Mikrosam's CNC machines for processing marble, granite and stones. This CNC machines has been designed to offer maximum flexibility and much opportunity for machining of marble, granite and stones. Traditional qualities combined with the most advanced technological innovations that were already implemented have made our machine ideal solution for marble, granite and stone industry.
High productivity machines, ideal for drilling, milling, 2D and 3D modelling, lettering, engraving, internal and external edging, bevelling, grooving, cutting with strait and convex disc.
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V-CUT
CNC cutting centre with 3 controlled axes, designed for cutting profiles made of
aluminium, PVC, light alloys in general. V-Cut loads the extruded section and cuts it, then unloads the finished part all in fully automatic mode without need for operator
attendance.
The powerful and versatile software can handle predefined cutting lists, optimizing them to minimize wastage. The cutting head allows cutting at +/- 22°30' and intermediate angles.
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The TK 804/3 model features an automatic machining and cutting system for aluminum profiles and it is designed to minimize the manual intervention of the operator during the machining cycle, allowing the operator only to load/unload profiles.
The machine comprises a multi-spindle combined unit, complete with 3 controlled axes, where it is possible to install a maximum of 8 electric-spindles to perform milling, drilling and tapping operations on 4 sides of the profiles before they are cut.
The machining line comprises:
In-sequence loader
Loading table with a 3 axis CNC pusher
Labeling machine (optional)
Multi-spindle combined unit
Cutting unit
Conveyor belt
Unloading table
Thanks to the versatility of its components the TK 804/3 model can meet the manufacturing needs of every customer: profiles loading/unloading systems, clamping, handling and machining can be customized according to the characteristics of the workpieces, to the working cycles and to the type of machining to be performed.
The high automation of the TK 804/3 model significantly reduces machining times while improving the production process.needs of each customer.
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Numerically controlled copy router with -90°, 0°, +90° and intermediate angles section rotation for working on 3 sides and quick release spindle for ISO30 cone. Z axis manual down feed with position display. The machine is manufactured in accordance with CE regulation.
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The TS72 CNC cutting line is able to cut four different programmable lengths out of the same bar unloading in 4 different positions. Brush deburring, in-line measuring, washing systems and collecting devices are fully integrated. All adjustments are CNC programmable as well as the working cycle starting from a bundle loader (up to 4000kg), with bar selection, cutting and unloading.
TS72 has a capacity of O.D. 8mm to 102mm with a max. cutting length configuration of 1500mm - 3000mm - 4500mm.
Main features:
* One CNC programmable length stop provide the best material optimisation of 4 different length cuts out of a single bar.
* Automatic and efficient programming not depending from the operator's skills.
* TS72's programming selects for the operator the optimum working parameters for the best possible machine performance, from a complete and proven technological database covering blade speeds and feeds for differing materials, saw blade selection and material feed.
* The cutting head construction with hardened and ground helical gears and automatic backlash compensation guarantees longer blade life and its full exploitation, low noise levels and the very best cut quality.
* The material feed system and vice geometry assure the most positive clamping of the material during the cutting cycle whether the material is thin wall delicate tube or tough thick wall tube.
* During the material feeding process, the material is lifted away from the vice bed and vice jaws to prevent the material surface being marked or scratched.
* Blade life, even under arduous cutting conditions, is much improved by micro-lubrication and by turbo refrigeration.
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As the leading manufacturer of machines for processing aluminium and PVC profiles, we supply matured solutions for different applications.
You have profile - we cut it !
Further saws, like Table saws, Mitre saws, Double mitre saws, Notching saws, Vee-notch and cut off saws, Automatic saws and Automatic saws with pusher cover our product range.
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AC1040 - Full Automatic Double Head Mitre Saw for PVC and Aluminum
* Cuts PVC & Aluminum profile at 45°-90° and intermediate degrees.
* Has the capacity of storing 300 profiles of cutting data by using its control program.
* With the automatic mode, cutting continues until all profile data entered is completed.
* After completion, the next cutting data in the memory is automatically set, required position taken and the cutting continues without operators involvement.
* PLC and Pneumatic controls.
* Setting length of the profile can be done manually.
* LCD screen.
* Single head operation is possible if required.
* Intermediate degrees are set easily by hand (manually).Automatic operation of safety cover.
* Conveyor system for fixed head site is available.
* Protects operator from operational accidents.
* Middle profile support arm, with link to the control panel, user friendly and convenient to use. Practical cylinder adjusting system.
* With Kaban's esthetic design, strong structure, user friendly usage.
* Smooth cutting surface due to new bearing design.
* Higher performance in the quantity cuts without using a vacuum system due to new vacuum system within the design.
* Fully protected against operational accidents.
* Optional:
o Cooling system for cutting aluminum profiles.
o Hydro-pneumatic design for cutting aluminum profiles.
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HORIZON BROWN 425 AP 1500 IMS
Machine main features:
- User friendly control
- Blade diameter of 425 mm
- Maximum cutting capacity of 143 mm
- Rapid movements by means of brusheless motors
- Blade rotation speed controlled by inverter
- Electronic control of head's position
- Carriage advance position controlled by magnetic bands
- Carriage stoke extended to 1550 mm with automatic repeats
- Automatic control of cutting angle
- Adjustable vertical clamping strength
- Adjustable horizontal clamping strength
- Possibility of connection to remote PC
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LPKF MicroCut
Capable of cutting any shape without burrs
The LPKF MicroCut is a high-performance stencil laser. The LPKF MicroCut is capable of cutting any shape at up to 50,000 openings per hour.
The laser can cut apertures as small as 30 µm with a roundness better than 96%, and its effective material focus diameter produces sharp contours.
As a result of the new cutting technology post-treatment is not necessary anymore.
Absolute flatness of the material is reached also with highest component density by the new LPKF PulsShape function.
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IPTE 's depaneling systems offer a unique combination of cutting tools, material handling and tooling to cut high technology panelized printed circuit board assemblies. They can be utilized in all kinds of production environments and can be seamlessly integrated, for example, in in-line manufacturing environments with automated ingoing and outgoing feeder units, and also be used in stand-alone configuration for manually supplied loading and unloading of boards.
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Fonon's Zero Width Laser Dicing Technology® (ZWLDT®) will cover unprecedented explosive growth and demand in semiconductor markets in China, Taiwan, Japan and Korea. This technology has lead to products, such as the BlackStar™, that offer the best in silicon wafer dicing over existing technologies.
ZWLDT® will slice the wafer much safer than mechanical saws that may cause wafer damage, and increase the yield per wafer as well as maximum throughput while minimizing the HAZ.
With the technology Fonon acquires, Fonon Display and Semiconductor Systems (FononDSS), has been able to launch a number of products that make the most of the technology for the semiconductor and flat panel display industry.
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Panasonic's UV laser scriber has a complete laser optics bench that offers flexibility to fit the specific application - the result of PFSA's experience in high volume microelectronic manufacturing and expertise in productivity.
The laser scriber enables the non-mechanical scribing and dicing of wafers. Primary uses include application for low and ultra-low 'K' wafers as well as non-mechanical scribing over metalized portions in the wafer streets which enables smaller kerf widths - allowing for greater numbers of die per wafer.
The UV Scriber enables sample builds for next generation products and maximizes die-level densities to reduce costs and increase profits.
Features & Benefits
Low K scribing with superior quality over mechanical dicing
Next generation supported via sample builds
Configurable for development of future capabilities
Increase profits by optimizing die-level density
HVM capable today
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Stealth Dicing Technology
In Stealth Dicing, a laser beam at a wavelength capable of transmitting through the material is condensed on an internal point in that material. This selectively forms a mechanical damage layer (stress layer) in a localized point near the light focus area so that the material is cut from the "inside". The operating principle of stealth dicing is fundamentally different from conventional blade dicing technology that cuts the material from the "outside".
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Function
The ALD 01 laser depaneling system is equipped with a rotary table system for optimum separation of the individual processing stages. This method allows parallel processing of the individual tasks. Consequently, the only times relevant for the cycle time, are the time for the longest individual stage plus the time taken for the table to rotate from one position to another.
1. Handover of the panel from the inlet conveyor to the first position on the rotary table
2. Panel routing
3. Loading of individual routed PCBs onto the outlet conveyor
4. Tipping of remaining panel waste into the integrated waste container
The panel is transferred from the inlet conveyor to the first position on the turntable by means of a pneumatic X/Y/Z portal gripper system. The routing process utilizes a CO² Laser.
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Laser Depanelizer for stress free and flexible Cutting of PCB Panels
- Depanelizing with Laser Technology
- Stress- and dust free Process
- Low Process cycles, high throughput
- Simple Fixtures
- Cutting and Marking possible
- Cutting any shapes
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