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PA-3000 ICP® (IEPE) signal conditioner - Description
The PA 3000 is a portable 3-channel ICP® ( IEPE ) signal conditioner. It has 4mA/24V supplies for sensors with integrated amplifiers. For low level signal amplification it features three selectable gain ranges and individually selectable highpass- and lowpassfilters for all three channels. Indicators for sensor condition and signal overload further minimize the risk of handling errors. The integrated rechargeable battery ensures a long operating time and the unit may be charged and operated at the same time. It is also possible to control all settings via PC using RS-232 interace.
The PA 3000 has a durable aluminum housing and a membrane keypad withstanding dust and moisture.
The low noise, wide dynamic range and excellent accuracy make the PA 3000 an excellent choice for demanding measurement applications.
ICP® is a registered trademark of PCB Group, inc., Depew, New York |
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The Fredericks Company has a variety of electronics products based on our industry leading tilt sensors. These high-accuracy, microprocessor based electronics can range from printed circuit assemblies to fully integrated packages, as well as remotely mounted sensors and assemblies.
Our dual axis electronics are highly configurable and provide the user with an output signal proportional to tilt. These electronics can be used with any of our TrueTiltTM, glass, or ceramic tilt sensors.
For users requiring special features, The Fredericks Company can design and manufacture electronics tailored to your application. The electronics can be packaged in a variety of ways to provide the user with easy mounting, multiple output options and environmental protection. |
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Space Products
Peregrine provides S-level equivalent screening of its commercial products, as well as developing semi-custom Communications ICs that meet the needs of satellite manufacturers for low-power, inherently radiation-hardened solutions. Peregrine's process is fully space qualified, and offers immunity to single event latch-up (SEL), and a superior resistance to single event upset (SEU) of less than 10-9 errors per bit-day and tolerance to total dose radiation of 300Krads (Si). By using its COTS (Commercial-Off-The-Shelf) capability from its Synthesizer and RF Transceiver products, Peregrine can provide highly cost-effective rad-hard ICs. |
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PMD offers 3 families of motion control ICs in multi-motor, multi axis formats for vast types of demanding applications.
- Magellan Motion Control ICs,
- Navigator Motion Control ICs
- Pilot Motion Control ICs. |
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PMD's Motor Control IC is an extremely compact single axis drive controller for demanding applications using a brushless DC motor.
The MC73110 Motor Control IC provides high performance digital current loop, velocity loop and commutation for brushless DC motors. This intelligent single-axis drive controller operates in internal velocity profile mode, velocity mode with an external velocity command signal, or torque mode with an external torque signal. |
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| The PIC-SERVO SC Motion Control Chip is a complete servo motion control system based on the PIC18F2331 microcontroller. It executes all of the real time processes (PID servo filter, motion profiling, commutation, error monitoring, communications) needed for controlling your motor. The simple serial NMC communications protocol lets you easily connect your microcontroller or PC host computer to multiple controller chips. |
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| Agilent Technologies is the leader in commercial microfluidic Lab-on-a-Chip technology. This technology utilizes a network of channels and wells that are etched onto glass or polymer chips to build mini-labs. Pressure or electrokinetic forces move pico liter volumes in finely controlled manner through the channels. Lab-on-a-Chip enables sample handling, mixing, dilution, electrophoresis and chromatographic separation, staining and detection on single integrated systems. The main advantages of Lab-on-a-Chip are ease-of-use, speed of analysis, low sample and reagent consumption and high reproducibility due to standardization and automation. |
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From the world's foremost microfluidic supplier comes a powerful new molecular diagnostics tool for DNA amplification and analysis. ST's In-Check lab-on-chip brings the exponential power of the Polymerase Chain Reaction (PCR) into a cost effective and convenient format.
Clinicians no longer need to compromise between sensitivity, specificity and speed.
The In-Check platform is based on a silicon chip that integrates all the functions needed to identify given oligonucleotide sequences in a sample, including microfluidic handling, a miniaturized PCR reactor and a custom microarray. The chip is mounted on a 1"x3" plastic slide that provides the necessary mechanical, thermal, electrical and fluidic connections. |
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The flexibility afforded by a synthesizable core is often countered by the additional configuration and implementation time required to produce a reusable component.
ARM%u2019s core hardening service is a flexible, low risk service for licensees of ARM synthesizable CPU cores (Listed in the See Also box) who require a fixed configuration, hardened CPU core, optimized for area, power and speed that provides the advantages of the synthesizable CPU core with the IP re-use convenience of hard macro deliverables. Early access to the company%u2019s emerging technology, CPU development teams and latest design flows, combined with an in-depth understanding of ARM CPU design, enables ARM core hardening teams to provide a unique, dedicated service to meet each Partner's specific requirements. |
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Tyco Electronics offers a broad portfolio of connectors for main Memory modules, removable Memory cards and microprocessors made to the many industry standard specifications.
The Tyco Electronics main Memory connectors are made to JEDEC industry standards for SIMM (Single In-line Memory Modules) and DIMM (Dual In-line Memory Modules) for computer and communication applications. Each product family consists of vertical, right-angle and various angled configurations in solder tail, press fit and SMT mounting options. |
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Samsung’s MCP portfolio leverages the company’s expertise in memory design and semiconductor process technologies. Its MCPs are built using its lowpower memory technology so that mobile devices will consume as little power as possible. In addition, Samsung’s core MCP technology utilizes the company’s skills in wafer thinning, same-die stacking, wire bonding – chip to chip and long-wire bonding – and molding.
The memory chips included in Samsung MCPs are built using advanced process technologies – from 90 to 65 nanometers. The company’s ongoing investments in fabs and technology assure customers of MCPs that will stay on the leading edge.
One of the many advantages of Samsung MCPs is the consistent use of the
same packaging and footprint, which makes it easy to scale between different Samsung MCP combinations. In addition, Samsung customers are assured of broad options within the same footprint.
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