|
|
|
|
|
|
The Rotary Index style machine is the most widely used for most automatic soldering and brazing applications. The typical sequence on a rotary machine begins with manual or automatic loading of parts onto fixtures. Indexing clockwise, the parts are pasted by one or more automatic applicator guns. These guns, generally mounted on slides, apply a premeasured deposit of paste alloy to each joint.
After pasting, the parts index again through a series of natural gas/air burners. The burners progressively heat the assembly to the liquidus temperature of the filler metal. Following heating, the part indexes through a series of cooling stations. Both air and water are used to solidify the alloy and bring the part and fixture back to room temperature. The finished part is then automatically ejected or manually unloaded by the operator. Production rates between 100-1200 parts per hour are typical.
Rotary Index 200
Dimensions: 48" x 48" or 72" x 72" or 80" x 80"
8-24 stations
Typical Rate: 300-1,200 parts per hour *
Rotary Index 200 Standard Features
|
|
Features:
- Inline machine for integration in existing production lines
- Soldering on aluminum substrates
- High quality solder joint connection
- Stress free soldering of LED leads
This fully automatic soldering system is specifically designed for soldering Lumiled's Luxeon LEDs. Its inline design is suitable for integration in any existing production line. The aluminum substrate automatically runs into the system, is soldered, and transported by the conveyor to the next production step.
|
|
Soldering unit proper for using in production lines equiped with pallet or rotating table
composed of:
Sinergo induction heater
Sinergo controller and wire feeder
Pneumatic movement for approaching the pieces
PLC and RS485 interface
Mechanical adjustment to several axes
“Heavy” industrial standard
Anodized aluminum frame – structure
Version and special accessories on request
The image show a basic structure
|
|
The soldering station proposed by mta automation ag is designed for automatic 1 or 2 point soldering operations.
Thanks to its modular concept, it can be integrated into a line or onto a rotary table.
The movements are performed by pneumatic axes and the micro-processor control enables the operator to pilot the axes and set the soldering parameters.
|
|
|
Sinergo as a result of hard work and daily study of the most varied welding applications makes completes assembling, welding, testing and marking systems, art the customer's specific request. The designing and manufactoring of both software and electronic-mechanical components are carried out by Sinergo itself.
|
|
Features:
- Many models to choose from
- Manual and automated systems
- Miyachi Unitek Uniflow2 Power Supply
- Manual or pneumatic bonding heads
- Thermo-plane thermodes with Quick Connect Blocks
- Linear slide or rotary motion
- Hot Bar Bonding, Reflow Soldering, and Heat Staking Applications
The Desktop Series are standard table top Hot-Bar Systems using Pulsed Heat Thermode technology for Reflow-Soldering and Heat Seal Bonding.
The DT-250 and DT-260 feature 2 or 3- position manual locking slides, respectively, easy load and unload, 2 handed operation, and sensor-selected parameters.
Miyachi Unitek's Desktop Bonders are also capable of performing heat staking. Heat Staking is an assembly process utilized in many high tech fields; it is also used in the manufacture of a variety of everyday consumer products.
|
|
The Desktop DT-250-PH and DT-260-PH Uni-Slide series are part of a line of (semi-) automatic systems developed for Hot-Bar Soldering. The “PH” stands for the pulsed heat hot-bar (alternative Constant Heat can be delivered). The model “250” has a manually operated 2-position slide, whereas the model “260” has a 3-position slide.
The Desktop Series delivers the same high connection quality as the larger and more sophisticated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts need to be aligned, it can be done in the front position where the operator or camera have sufficient free space and a view that isn't blocked by the bonding head. The manually operated slide locks into place, which is detected by a sensor. The sensor confirms the correct bonding position of the part and after activation of the 2-hand control the bonding process is started.
|
|
Our hot bar soldering machine BL-40i Basic und BL-40i PLC as well as especially customized machines are intelligent, innovative systems for bonding applications in the production technology.
Our Technology has already been successful in a various applications:
Bonding technology for Flatpacks, TAB, SMD
Innovative bonding technology for sensitive components
Various hot bar soldering methods:
"Soldering cords to PCB"
Pin soldering
Soldering cables to a temperature sensitive fabric
Soldering on polyesterfoil and much more...
|
|
|
AUTOMATIC ANIMATRICE IN HF MOD. SALION Automatic machine of great reliability, ideal in order to thread whichever type of metallic spirit, normal schools with hinge monoblock or hinge flex in astine of celluloid, propionato acetate or is of shape parallel that pantografata, fustellata or iniettata, also of small dimensions. The machine is complete of automatism for the cargo of the auctions and the spirits.
|
|
|
|
|
|
The new MW500 selective mini-wave soldering cell is adapted for selective point-to-point or linear soldering operations controlled by an industrial PC.
- Based on 4 fully programmable numerical axes with an additional 7-10° tilt axis.
- Staging area for optional tray loading system or rotary table.
- Integration into automatic lines.
- Working area: 500 x 500 mm.
- Mini-wave system fully made of titanium (tank capacity: 20-25 kg).
Soldering process:
programming -> re-centering (option) -> fluxing -> pre-heating -> soldering quality check (option)
Accurate positioning is achieved via a camera during teaching and programming.
Fluxing is introduced according to the type of flux used: an airless fluxer (alcohol based) or, alternatively, an ultrasonic fluxer » (water based).
Hot air blower, or alternatively infrared heater for PCB, are proposed for the pre-heating operation.
Selective soldering is carried out thanks to the most performing lead free compatible tank and electromagnetic pump fully made of titanium.
|
|
Panasonic's SP60 is designed with both the high- and low-volume manufacturer in mind who requires ultrahigh printing accuracy. It combines high-speed, multi-snap-off and support snap-off to give users the flexibility to realize both SMT screen printing and superfine pitch printing. Customizability is key to the benefits this machine delivers.
For long-time, continuous production cycles, The SP60 features an advanced squeegee that's resilient enough to deliver consistent high quality. Additionally, a squeegee can be added that's designed for high-speed, high-productivity printing scenarios.
The SP60 supports lead-free soldering.
|
|
|
|
|
|
Benefits and Applications
Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to solder using conventional soldering techniques. Blackstone-NEY Ultrasonics has perfected a technique for introducing ultrasonic energy into dip solder pots and is the exclusive manufacturer of this type of equipment in the world today.
Blackstone-NEY Ultrasonics' solder pots are activated by externally mounted transducers which allow large volume multi-part dipping. The systems' controls are adaptable to automated lines.
Blackstone~NEY Ultrasonics has many years of experience in ultrasonic soldering, dating from the early design and production of some of the first practical equipment for this purpose in the early 1960's. Our experience assures quality and competence in this field.
Ultrasonic soldering finds application in two major areas. They are the pre-tinning and soldering of precision, high reliability electronic components and the joining of aluminum heat exchangers.
|
|
The MWS 2300: perfect in every detail. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the modular design of the system, makes the nitrogen wave soldering system MWS 2300 a powerful piece of equipment. It is ideally suited to solder demanding printed circuit boards – even at high throughputs.
The flexible preheating zone configuration with a preheat length between 1800 mm (70.8 inch) and 3300 mm (129.9 inch) makes it possible to suit your specific production requirements. Should your requirements change in the years to come, simply – and without great expense – change the configuration of the soldering machine.
|
|
Maximum performance in selective soldering at minimum cost: this is the GoSelective light from SEHO.
The GoSelective light is designed for stand-alone operation. Infeed and outfeed of the assemblies is made manually. During the process the assembly remains on its position whereas the working stations, which are mounted on a high-precision axis system, successively approach the solder joints.
The GoSelective light offers an uncompromisingly high soldering quality and maximum flexibility particularly for small and medium-sized production volumes. The high-grade and compact machine concept "Made in Germany" ensures absolutely reproducible soldering results at simultaneously small footprint and thus offers an economic alternative to traditional hand soldering processes.
|
|
Due to the ever-increasing demand for quality and reproducibility of the entire manufacturing process, today it is no longer acceptable to manually solder the conventional component remainings after the reflow process into place and – with the GoSelective-1 and -2 from SEHO – this is also no longer necessary.
The GoSelective-1 and -2 offer all in one: highest flexibility, absolutely reproducible results, high soldering quality even with demanding assemblies, low capital expenditure and the possibility to be upgraded step by step at a later date to suit subsequent production developments.
Special flexibility is given in the handling of the assemblies. Both, bare boards as well as assemblies in carriers can be processed with all GoSelective systems.
|
|
The selective soldering system RTH 3700 has been designed for high-volume soldering of THT components after the reflow process.
The RTH 3700 is a semi-automatic system:
- manual handling of the products
- automatic fluxing and soldering process
All parameters, decisive for the quality, therefore are absolutely reproducible.
The RTH 3700 is configured to perform selective dip soldering operations, i.e. both, the fluxer and soldering area use product specific multi nozzle systems. This allows very short cycle times of approx. 20 seconds.
|
|
|
|
|
|
With the wave soldering system PowerWave, SEHO consequently realized a machine concept which offers a remarkable performance at simultaneously low investment costs. Complex SMD boards are as reliably soldered as conventional assemblies - due to up-to-date solder nozzle geometries and a flexible preheat area.
The modular construction of SEHO PowerWave offers the ideal concept for all production requirements and allows the machine to be integrated into existing fully automated production lines.
Performance reserves for the user have been created with the high performance pre-heating. SEHO PowerWave is available with either 1200 mm preheat length or 1800 mm. Depending on your production requirements, SEHO PowerWave may be equipped with a chain/finger conveyor system or with a solder frame conveyor for the processing of pallets.
The heart of the machine, the soldering area, is designed with a degree of flexibility that may perform all realistic soldering operations. Modern and innovative solder nozzle geometries provide ideal soldering results.
|
|
The GoWave 1030 is a powerful soldering system for those just entering into mass-soldering operations. This system is suited to a variety of applications ranging from entry-level mass-soldering to soldering in small or medium-sized batches. It also provides an economical soldering solution for universities, schools and laboratories.
The GoWave 1030 is especially featured with its innovative nozzle concept which is ideally suited for nearly all soldering tasks.
A special feature of this machine is its compact, but performance oriented design. Offering a fluxer module, an efficient preheater, innovative soldering area and microprocessor control, the GoWave 1030 presents the finest soldering technology in its class.
|
|
|
The technology behind Fusion automatic brazing and soldering machines is substantial, the approach is a simple one. In most cases, one operator loads and unloads the parts. The application of filler metal and flux, along with heating and cooling is handled by the machine. Joint quality is virtually guaranteed, due to the elimination of human error. Material costs are controlled, since filler metal and flux are applied automatically-in just the right amount. Labor costs become almost insignificant, as one operator turns out hundreds of brazed or soldered assemblies each hour.
|
|
Fusion designs and builds rotary, multi-station brazing machines utilizing induction brazing heat. Production rates from 100-600 per hour can be achieved.
Induction is ideal for applications that require fast, localized heating where only the joint area is affected. Induction is also effective for large, heavy mass assemblies.
Coils are matched to the specific assembly and can be easily changed for future part needs. Part temperature can be accurately controlled with an optical pyrometer.
|
|
AB-1 Automated Brazing System
• Small 4x4' footprint fits your mfg. cell
• Indexing turntable for easy loading/unloading
• For automated brazing and soldering
• Multiple heat program capability
• Energy-efficient induction heating system
• Facilitates continuous flow manufacturing
|
|
Sinergo design and manufacture custom machines for photovoltaic cells producers.
Brazing process could be made in different tecnologies:
_ Hot Iron
_ Laser
_ Electromagnetic Induction
_ Infrared light beam
Technology depends on customer applications.
Sinergo machines can be used in lines production or stand alone.
|
|
S I N T E S I S E R I E 5 0 0
As a result of intensive laboratory work and daily study of the most varied applications of induction heating on metal parts, Sinergo has designed and patended a series of equipments with remarkable techincal characteristics.
|
|
Half-automatic induction brazing machine for plate / contact
Electrotechnical industry.
Manual loading of one contact, either fixed or moving.
Automatic feeding of brazing paste.
Automatic feeding of a plate.
Induction brazing process.
Output rate : 1000 fixed contacts / hour.
|
|
Brazing Systems
OPEN AIR BRAZING
Semi-Automatic Indexing Turntable
• Eight part positions
• For small part induction brazing
• Full manual control for automatic override and process
development
• Perfect for high speed automated processes
• Choose an off-the shelf model or custom design
|
|
SEIT’s machines for the mechanical sector allow various processings. Choose among the followings fields of application the more proper for your needs:
1.Brazing Machines for the Refrigeration and Compressor Industry
2.Machines for machine tool industry
3.Machines for faucet and fittings industry
4.Machines for small metal assembling and other various processes
|
|
|
The Uni-Slide stand-alone product line is a system concept with a linear product movement. The product is safely and accurately loaded, aligned and unloaded in the front position of the slide, and processed in the rear position. The linear slide is manual operated.
|
|
|
|
|
|
The stand-alone Uni-Base systems are the first in a line of (semi-) automatic systems developed for Hot Bar Reflow Soldering, Heat-Sealing and ACF-bonding. The Uni-Base delivers the same high connection quality as the larger and more sophisticated systems.
Setting up the system for different products is easy as 1-2-3, making it suitable for laboratory and high-mix production. Because of the low investment costs, earn-back time is short. Mass production environments will typically run several of these systems besides each other.
Standard available systems are:
- Uni-Base SS-W-100 with SH500 pneumatic bonding head and Uniflow Power Supply
- Uni-Base SS-W-231 with SH500 pneumatic bonding head, Uniflow Power Supply and basic manual slide
- Uni-Base PS-W-101 with PH500 motorized bonding head, Uniflow Power Supply and PLC control
For Reflow Soldering and Heat-Sealing these standard systems are using Pulsed Heat Technology (Uniflow Power Supply). For ACF Bonding a tape feeder and tape cutting module can be added. You can find more information in the PDF-file below.
|
|
Lead free:
- yes
PCB size:
- max. 180 x 120 mm
Clearance for assemblies:
- max. 25 mm
Heating controlling:
- microprozessor controlled
Heat distribution:
- Infrared heating element
Solder temperatures:
- 50 - 250 °C
Solder process time:
- ca. 4 - 8 min
Rated power:
- max. 600 W
Features:
- built in automatic air cooling fan
Power requirements:
- 220 VAC / 50Hz
Dimension and weight:
- 300 x 250 x 160mm / ca.18 kg
|
|
|
|
