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From standard, single element materials to custom compounds, small circular to multi-tile and stepped constructions, commercial grade to ultra-high purities, Angstrom Sciences provides the highest quality magnetron sputtering target materials.
We utilize a variety of specialized processing techniques such as hot pressing, hot isostatic pressing (HIP), cold isostatic pressing (CIP), induction vacuum melting, and vacuum casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards.
All sputtering targets are cleaned, inspected, chemically-tested, and packed under inert gas for immediate use in your vacuum system.
Angstrom Sciences provides a full range of sputtering materials including: precious metals, pure metals, alloys, ceramics, cermets, borides, oxides, carbides, nitrides, silicides, and fluorides.
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Angstrom Sciences magnetrons are recognized as the new standard of the sputtering industry. Because, in addition to the advanced features provided by the Angstrom AdvantageTM, they offer a host of other performance efficiencies as well.
Versatile Design
Their ultra compact design makes them ideal for virtually any new or retrofit application including the most complex multiple-cathode cluster or the smallest vacuum chamber. Low-impedance heads provide RF, DC, mid frequency DC, and pulse DC power capability. All utilities are maintained at atmosphere and are accessed through standard o-ring compression fittings for ease of installation in any vacuum system.
Lower Pressure, Higher Power
All our magnetrons operate at extremely low pressure, in the 10-4 Torr range and can deliver practical power densities in excess of 300 watts per square inch.
High Rates and Performance
That means they can coat a greater area for their cathode size than other magnetrons. So you can maximize both your coating zone and your target utilization without the kind of trade-off in rate that other magnetrons force you to make.
Greater Performance
Yet these same advanced planar magnetrons can give you target utilization as high as 50%. Our magnetrons also deliver much greater uniformity of deposition – routinely in the 3 to 5% range. One of our research customers has even documented uniformity of 0.1% with Angstrom Sciences magnetrons.
Full Range of Sizes
Angstrom Sciences circular magnetrons are available in 1-16 inch target sizes. The linear magnetrons are available in target widths of 1.5 to 12 inches and in target lengths from 1 to 20 feet.
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Dexter's rotating magnetron guns (Z-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Magnet array capable of 2.625 in (67 mm) of linear travel
>Easy target removal without special tooling
>Programmable recipe variables include: rotational speed, phase angle and linear position |
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Angstrom Sciences magnetrons are recognized as the new standard of the sputtering industry. Because, in addition to the advanced features provided by the Angstrom AdvantageTM, they offer a host of other performance efficiencies as well.
Versatile Design
Their ultra compact design makes them ideal for virtually any new or retrofit application including the most complex multiple-cathode cluster or the smallest vacuum chamber. Low-impedance heads provide RF, DC, mid frequency DC, and pulse DC power capability. All utilities are maintained at atmosphere and are accessed through standard o-ring compression fittings for ease of installation in any vacuum system.
Lower Pressure, Higher Power
All our magnetrons operate at extremely low pressure, in the 10-4 Torr range and can deliver practical power densities in excess of 300 watts per square inch.
High Rates and Performance
That means they can coat a greater area for their cathode size than other magnetrons. So you can maximize both your coating zone and your target utilization without the kind of trade-off in rate that other magnetrons force you to make.
Greater Performance
Yet these same advanced planar magnetrons can give you target utilization as high as 50%. Our magnetrons also deliver much greater uniformity of deposition – routinely in the 3 to 5% range. One of our research customers has even documented uniformity of 0.1% with Angstrom Sciences magnetrons.
Full Range of Sizes
Angstrom Sciences circular magnetrons are available in 1-16 inch target sizes. The linear magnetrons are available in target widths of 1.5 to 12 inches and in target lengths from 1 to 20 feet.
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Dexter's rotating magnetron guns (Z-Guns™) have been specifically engineered for the demanding requirements of data storage media producers. Integration with a new system or retrofitting an existing system is facilitated by our innovative, patented design and control interface.
>Programmable speed: 0 to 500 RPM
>Superior mechanical robustness to withstand the high mechanical loading created by the high strength manget array/target interaction
>High radial anisotropy at ID, MD and OD during sputter
>Programmable magnet phasing
>Power: 120 VAC 60 Hz, 50Hz
>Optimized for dual cathode sputtering
>Designed to retrofit Intevac® 250B and Canon ANELVA 3010 systems
>Typical Deposition Rate: 61 A/kWsec at 3 kW
>Sputter power 3 kW
>Station includes two rotary mechanisms, vacuum chamber, target clamps, spacers and stand-offs
>Magnet array capable of 2.625 in (67 mm) of linear travel
>Easy target removal without special tooling
>Programmable recipe variables include: rotational speed, phase angle and linear position |
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This type of generators represent a new industrial standard for applications
in under vacuum metallizing chambers.
The configuration of the power circuits.
The cooling by air (the system does not need any cooling by water,
avoiding all the problems may arise with this type of cooling)
The construction completely with solid-state components.
A modern Touch Panel used for the control of the generator, of the energy applied to the plasma chamber and for the management of the Mass-Flow-Control.
Are all requisities that position these equipments ahead for this type of applications. |
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