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How to conserve power when playing back video content is a significant issue when designing mobile media devices. A common solution is to lower the backlight level of the LCD as it consumes 30% to 60% of the total system power. This solution significantly diminishes the viewing experience with details lost due to the lowered contrast ratio. QuickLogic’s proprietary VEE Proven System Block (PSB) enhances both image and video quality by optimizing the dynamic range, contrast, and color saturation pixel-by-pixel to provide a natural viewing experience under low backlight or bright ambient light conditions. Seamlessly integrated into the display path, VEE enhances the user’s mobile multimedia visual experience while drastically reducing backlight power to extend battery life.
All members of the ArcticLink II family of solution platform family embeds the recently announced 2nd Generation VEE technology, combined with programmable fabric. QuickLogic and Apical Limited partnered to architect and develop the optimal blend of algorithms with QuickLogic’s PSBs and patented ViaLink programmable fabric for mobile and portable multimedia products.
The core of the VEE technology is based on the proven iridix® algorithms licensed from Apical Limited, which is substantiated by nearly a decade of scientific research. These algorithms implement a model of human perception; resulting in a displayed image that retains detail, color and vitality even under variable viewing conditions. It specifically addresses the problem of the low contrast ratio of mobile Liquid Crystal Displays (LCD) to bring a more TV-like viewing experience to the mobile devices.
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SPIDA is the Smart Programmable Integrated Data Aggregator technology that is at the heart of QuickLogic’s strategic initiative to bring a better user experience to the mobile consumer market. SPIDA is a scalable, proven system block that can be implemented in any of QuickLogic’s solution platforms, establishing a direct data path between peripheral and mass storage interfaces.
By decoupling the data transfers from the system’s main memory, transfers can happen in less than half the time and with substantially less power consumption and CPU loading. The first generation SPIDA engine is based on QuickLogic’s patented programmable fabric, allowing QuickLogic’s System Solution Group (SSG) to tune the SPIDA engine to the exact specifications of the mobile processor and peripherals being used in the system. The SPIDA engine is compatible with ArcticLink II VX, ArcticLink, PolarPro II and PolarPro solution platforms.
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ArcticLink is a programmable solution platform designed specifically to meet the unique connectivity requirements of handheld devices.
With the explosion of new handheld applications and devices, customers are demanding multiple functions to be performed at optimal levels by a single device. As a result, designers of handheld products such as Smartphones, Personal Media Players and Portable Navigation Devices are faced with the challenge of integrating enhanced wireless connectivity and digital storage features, among others.
ArcticLink addresses these issues in two ways: first by providing hardwired building blocks such as Hi-Speed USB 2.0 On-The-Go (OTG), SD, SDIO, MMC and CE-ATA, and secondly with an embedded, ultra-low power array of Customizable Building Blocks (CBBs) for additional connectivity and custom functions.
The flexible programmable fabric up to 20 CBBs combined with the hardwired building blocks provides a compact, single-chip solution that reduces BOM costs, saves board space, eases system-level design trade-offs and increases the end product’s time-to-market.
ArcticLink Solution Platform has two small package options; 8x8mm package for space constrained application and 12x12mm package for high pin count applications. Wafer level CSP is also available.
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The award winning PolarPro families of programmable platforms, including PolarPro and PolarPro II, were purposely architected to meet the interconnect and system logic requirements of power sensitive and portable applications. It is based on QuickLogic patented ViaLink® technology to offer programmability with ASIC-like power consumption. The PolarPro family offers a spectrum of platforms with ranging from 8 to 240 Customizable Building Blocks (CBBs), embedded SRAM and advanced clock management. Very Low Power (VLP) mode puts the entire device in sleep mode, drawing as low as 2.2µA, while maintaining I/O status and internal register values.
The PolarPro has won multiple industry awards. Packages as small as 5x5mm BGA package are designed specifically for mobile applications.
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VEE-enabled Platform Optimized For Qualcomm Mobile Processors
The ArcticLink II VX4C solution platform integrates two main Proven System Blocks (2nd generation VEE and MDDI v1.2 Type 2 Client with PHY) coupled with CellularRAM Frame Buffer and Programmable Fabric. This highly integrated, yet flexible architecture makes it the ideal platform to implement Customer Specific Standard Product (CSSP) solutions in the display and connectivity subsystems of Smartphones, Netbooks, Mobile Internet Devices (MIDs), Mobile Computing Devices (MCDs) and Pocketable Computing Devices (PCDs) using Qualcomm’s latest Mobile Station Modem™ (MSM™) MSM7xxx-series and MSM8xxx-series mobile processors, including the recently announced Snapdragon family.
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Cypress' PSoC(R) mixed-signal arrays are programmable systems-on-chips (SOCs) that integrate a microcontroller and the analog and digital components that typically surround it in an embedded system. A single PSoC device can integrate as many as 100 peripheral functions with a microcontroller, saving customers design time, board space, power consumption, and from 5 cents to as much as $10 in system costs.
Easy-to-use development tools enable designers to select the precise peripheral functionality they desire, including : Analog functions (amplifiers, ADCs, DACs, filters and comparators) ; Digital functions (timers, counters, PWMs, SPI and UARTs) ; Communications interface (I2C, SPI, USB...).
PSoC devices include : Up to 32 KB of flash memory
2 KB of SRAM ; An 8x8 multiplier with 32-bit accumulator and Power and sleep monitoring circuits.
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System-on-chip technology is the ability to place multiple function "systems" on a single silicon chip, cutting development cycle while increasing product functionality, performance and quality. Even if the semiconductor industry achieved increasing levels of integration, the success of this double integration - processes and functions -- involves more capabilities than originally expected.
STMicroelectronics is a leader in system-on-chip technology thanks to an unrivalled combination of silicon and system expertise, manufacturing strength, wide IP portfolio and strategic partners.
The manufacturing strength of ST, technology and process know-how are combined to minimize time-to-volume. ST offers a complete solution that takes you from design right through to production. This solution integrates pre-characterised semicustom libraries, a wide package portfolio running from fine-pitch BGA as well as ultra-small leadless packages, a high performance BiCMOS process Silicon-Germanium HBT which marries the advantages of SiGe - speed, low noise and low power consumption - with state-of-the art CMOS in a high volume manufacturing structure.
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Chips conveyors allow easy removal of any kind of swarf without any loss of machine productivity !
Sermeto EI offers three types of conveyor of efficient and robust construction. They are adaptable to any type of machine and swarf produced.
-Hinged steel belt
-Drag link
-magnetic
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Designed for recycling:
- Machine Tool Coolant
- Aqueous Parts Cleaning Fluids
- Gray Water
- Only Almco offers all these liquid filtration benefits:
- Removes particles down to 3 microns
- Does not change chemical structure of liquids
- Eliminates bacteria and rancidity
- Standard units have only one moving part (the pump motor) for highly reliable operation
- Low system cost
- No filter media to buy and replace
- Hands-off operation - fully automatic during filtration cycle
- Compact, easy to install
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A variety of efficient pneumatic conveyor designs are available to transport both wet or dry metal chips to or from processing. Prab offers both positive pressure and vacuum conveyor models depending on application.
Positive Air Systems
- Prab Chip Fan - Model 525 is capable of transporting dry aluminum chips up to 250 or more, for direct loading of scrap trailers
- PD Pump or Blower - Can be fed by rotary air locks or eductors for multiple chip inputs
Negative Pressure - Vacuum Systems:
- Capable of multiple pick-up points, transporting wet or dry chips to central processing system.
- All systems utilize economical standard piping with hardened bends and filter/cyclone receivers.
- All wear items are abrasion resistant Ni-hard.
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Extracting machines automati to us Arcofast series
The Arcofast is an extracting machine automatic rifle to lateral positioning (operating or opposite side), for the pieces withdrawal of money pressofusi and their drainage by means of lateral ribaltamento of 90°.
Composed from arm of withdrawal of money, mounted on adjustable support of support, to commando electrical worker for the movements of income and escape, with programmabile preapproach. The commando is always pneumatic, instead, for the functions of taken, extraction centers them. Pneumatic commando for the functions of taken, extraction centers them, ribaltamento and warehouse pieces. Drive with electric motor to alternating current set in action from inverter. Suit of control panel, cables connection electrical workers, device of control prelevamento pieces with predisposed support to receive 6 sensors (the ns. supply comprises of series n. 2 sensors). The version Arcofast 3 is in a position to serving presse from 140 to 560 ton.
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To provide our customers completely integrated production cells, IDRA has established strong partnerships with the main foundry automation suppliers.
For extraction of castings Idra cooperates with ABB and uses the IRB series Robots, also for programming and diagnostic. These are completely integrated in the die casting cell so as to have only one reliable production system.
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Automatic sprayers model PLUS
The PLUS model is created to serve die-casting machines from 400 to 2500 ton. Buold with brushless motors (on both horizontal and vertical axis) it is able to move the 2 axis at the same time in order to allow entries, internal movements and exits from the dies at very high speed (up to 1,2 m/s). In order to satisfy the different needs of any foundry we have created several models where the difference is basically the vertical stroke (1000 mm, 1300 mm, 1500 mm, 1750 mm, 1900 mm) and of course the horizontal axis. The spraying head is equipped with 7 nozzles fixed platen + 7 nozzles movable platen for the smallest model up to more than 40 nozzles fixed platen 40 nozzles movable platen for the biggest model. On demand it permits to use a spraying head divided into 3 working bands independently programmable with double solenoid valves (one for mixing and two for blow) for spraying of a first lubricant. The easy programming of times, speeds and positions is guaranteed by a microprocessor Siemens S7 and a control panel equipped with dies memory.
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Chip inductor coil winding machine
Displayed Machine : NCI-0150
The NCI-0150 and NCI-0250 machines are specialized machines for inductor coil winding. The machine is controlled by 12-axis and is capable to wind multiple inductor specifications. Cross-winding is possible for transponder coils. The type of welding is selectable.
Features :
. Shortened cycle time by core supply, winding, welding and core unload simultaneous processing
. Consumes little floor space
. Reduced weight
. Indexer operated by direct drive motor. No maintenance required.
. NITTOKU`s original auto tuning system stabilizes welding temperature
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