Thermally-conductive adhesives

Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master ...

... temperature resistant • Thermally conductive • Tough and flexible • Easy to apply and doesn’t require freezing • Excellent electrical insulation properties • Uniform bond line thickness Master ...

... prominent use is as a glob top material, it also can be utilized as a die attach, potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA ...

Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical ...

Key Features - Available in 30 gram preforms - High temperature resistant - Thermally conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - ...

... type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good ...

Working temperature: -80 °F - 400 °F

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at ...

... color. As mentioned above, this multifaceted system can be used as a glob top or die attach and in other applications as an adhesive or sealant in electronics when the special combination of properties, particularly the ...

Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 ...

... a specialty formulation that can be used for bonding, coating, sealing and encapsulation. When used as an adhesive, the thermally conductive filler has very fine particle sizes; subsequently, ...

Working temperature: -55 °C - 135 °C
Shear strength: 21.5 N

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...

Working temperature: -55 °C - 135 °C
Shear strength: 26.5 N

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...

Working temperature: -55 °C - 120 °C
Shear strength: 24.5 N

... is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. It is a one-component, high-viscosity anaerobic structural adhesive. ...

Working temperature: -55 °C - 120 °C
Shear strength: 10 N

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...

Working temperature: -55 °C - 150 °C
Shear strength: 19 N

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, ...

... protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. Dual-curing adhesives are specially designed ...

... realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. The no-flow package is designed for local circuit board protection. This adhesive ...

Working temperature: -70 °C - 180 °C

... temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. Product Highlights Thermally conductive Lower exotherm while curing Expeditious cures ...

Working temperature: -50 °C - 180 °C

... RLV is widely used in electronics and microelectronics packaging and assembly applications. Product Highlights Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated ...

Working temperature: -70 °C - 200 °C

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), ...

Working temperature: -70 °C - 200 °C

... for die attach applications. Product Highlights Remarkable die shear strength Ultimate dispensing profile Thermally conductive Low ionic content (chlorine < 15 ppm) Capable of passing ...

Working temperature: -70 °C - 200 °C

... remarkable performance, this multi-functional epoxy system is universally used as a glob top or die attach and also as an adhesive in various electronics and electrical applications. Product Highlights Low ionic content ...

Working temperature: -70 °C - 180 °C

... it suitable for use in various other electronics, aerospace and distinctive OEM applications. Product Highlights Thermally conductive Low ionic content Extremely fast cure Outstanding dimensional ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher ...

Working temperature: -269 °C - 200 °C

Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical ...

... formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive ...