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plastic cutting machine / infrared laser / wafer / CNC
plastic cutting machine
QAC&BACL, LDC

X travel: 250 mm
Y travel: 250 mm
Cutting speed: 0 m/s - 0.15 m/s

... 1μm 8. Working Table Route:250mm×250mm 9. Max Cutting Size:4 inches 10. Cutting Width:30-50μm 11. Cutting Depth:80-120μm 12. Cutting Speed:1-150mm/s Application: 1. ...

plastic cutting machine / UV laser / wafer / CNC
plastic cutting machine
UV/QAC&BACL

Features: 1. high-quality UV cutting source 2. high cutting quality 3. high cutting reliability 4. small thermal affected zone 5. excellent cutting quality Parameters: ...

plastic cutting machine / UV laser / wafer / CNC
plastic cutting machine
LED UV/QAC&BACL

... the rotation axis:20" 6.resolution of XY grating ruler:0.1μm 7. CC positioning precision:1μm 8. cutting linear width:5-10μm 9. cutting depth:20-30μm 10. cutting speed:100mm/s

ceramic cutting machine / fiber laser / wafer / CNC
ceramic cutting machine
IX-280-C

... designed for cutting, scribing and drilling of ceramics and other materials used in microelectronics and specialized semiconductor packaging applications. With capabilities for scribing 380 µm alumina at rates up to 300mm/sec, ...

metal cutting machine / laser / wafer / CNC
metal cutting machine
IX-210

The Metal Wafer Cutting laser systems are used by LED manufacturing industry for singulation of metal wafers. Substrates are typically copper moly or alloy up to 150 µm thick, and the ...

iron cutting machine / knife / wafer / CNC
iron cutting machine
Optium ADS-800

Cutting speed: 0.01, 0 m/s

... monitoring for areas up to 9”. The spindles are high in stiffness and torque air bearing with low harmonics. Veeco HMI software defines the entire cutting process as user-accessible high-level scripts. ...

knife cutting machine / wafer / CNC
knife cutting machine
Optium ADS 160

... throughput Targeted at wafer split/trim, row slice, dice, relief cut applications, Veeco’s Optium ADS 160 Advanced Dicing System boosts the productivity and precision of dicing processes for thin film magnetic head (TFMH) ...

composite material cutting machine / laser / wafer / CNC
composite material cutting machine
DFL734x series

Tube diameter: 200 mm

Laser saws make use of the characteristics of lasers to achieve high speed, high accuracy, and high quality processing of composite materials and difficult-to-cut materials. Stealth dicing This is a dicing method ...

composite material cutting machine / laser / wafer / CNC
composite material cutting machine
DFL7361,DFL7360 series

Cutting speed: 0 m/s - 1 m/s

Laser saws make use of the characteristics of lasers to achieve high speed, high accuracy, and high quality processing of composite materials and difficult-to-cut materials. Stealth dicing This is a dicing method ...

plastic cutting machine / laser / wafer / CNC
plastic cutting machine
LDS 200 A

X travel: 600 mm
Y travel: 400 mm
Cutting speed: 1 m/s

... is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications. The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine ...

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Synova
plastic cutting machine / laser / wafer / CNC
plastic cutting machine
LDS 200 C

X travel: 600 mm
Y travel: 400 mm
Cutting speed: 1 m/s

The LDS 200 C includes a cleaning unit with DI water for automatic wafer cleaning after dicing.

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Synova
plastic cutting machine / laser / wafer / CNC
plastic cutting machine
9900

... ultra-thin wafers and scribing logic or system on chip (SoC) wafers on die attach films (DAFs) in one integrated system. * Unparalleled die break strength – Some wafers have delicate, ...

ceramic cutting machine / wood / plastic / CO2 laser
ceramic cutting machine
META 1.5C

X travel: 48 in
Y travel: 48 in
Laser power: 700, 150 W

... , powerful and flexible laser cutter that is designed to be accurate and easy to use on non-metal materials. With a cutting area of 48 in x 48 in (1.23m x 1.23m) and 12 inches (300 mm) of Z travel, it ...