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plastic cutting machine / infrared laser / wafer / CNC
plastic cutting machine
QAC&BACL, LDC

X travel: 250 mm
Y travel: 250 mm
Cutting speed: 0.001 m/s - 0.15 m/s

... 1μm 8. Working Table Route:250mm×250mm 9. Max Cutting Size:4 inches 10. Cutting Width:30-50μm 11. Cutting Depth:80-120μm 12. Cutting Speed:1-150mm/s Application: 1. ...

plastic cutting machine / UV laser / wafer / CNC
plastic cutting machine
UV/QAC&BACL

Features: 1. high-quality UV cutting source 2. high cutting quality 3. high cutting reliability 4. small thermal affected zone 5. excellent cutting quality Parameters: ...

plastic cutting machine / UV laser / wafer / CNC
plastic cutting machine
LED UV/QAC&BACL

... the rotation axis:20" 6.resolution of XY grating ruler:0.1μm 7. CC positioning precision:1μm 8. cutting linear width:5-10μm 9. cutting depth:20-30μm 10. cutting speed:100mm/s

metal cutting machine / for plastics / for ceramics / laser
metal cutting machine
PE-20W/50W (II)

X travel: 50 µm
Y travel: 50 µm
Cutting speed: 0.24 m/s

... operator's vision damage. 2.Software upgrade: the solar cell laser scribing machine support the arc interpolation,circular arc cutting more smoothly. 3.The wafer scribing machine ...

metal cutting machine / laser / wafer / CNC
metal cutting machine
IX-210

The Metal Wafer Cutting laser systems are used by LED manufacturing industry for singulation of metal wafers. Substrates are typically copper moly or alloy up to 150 µm thick, and the ...

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IPG Photonics Corporation
iron cutting machine / knife / wafer / CNC
iron cutting machine
Optium ADS-800

Cutting speed: 0.004, 0.01 m/s

... monitoring for areas up to 9”. The spindles are high in stiffness and torque air bearing with low harmonics. Veeco HMI software defines the entire cutting process as user-accessible high-level scripts. ...

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VEECO
composite material cutting machine / laser / wafer / CNC
composite material cutting machine
DFL734x series

Tube diameter: 200 mm

Laser saws make use of the characteristics of lasers to achieve high speed, high accuracy, and high quality processing of composite materials and difficult-to-cut materials. Stealth dicing This is a dicing method ...

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DISCO HI-TEC EUROPE GmbH
plastic cutting machine / laser / wafer / CNC
plastic cutting machine
LDS 200 A

X travel: 600 mm
Y travel: 400 mm
Cutting speed: 1 m/s

... is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications. The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine ...

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Synova
plastic cutting machine / laser / wafer / CNC
plastic cutting machine
9900

... ultra-thin wafers and scribing logic or system on chip (SoC) wafers on die attach films (DAFs) in one integrated system. * Unparalleled die break strength – Some wafers have delicate, ...

ceramic cutting machine / for plastics / for wood / CO2 laser
ceramic cutting machine
META 1.5C

X travel: 48 in
Y travel: 48 in
Laser power: 150, 700 W

... , powerful and flexible laser cutter that is designed to be accurate and easy to use on non-metal materials. With a cutting area of 48 in x 48 in (1.23m x 1.23m) and 12 inches (300 mm) of Z travel, it ...